Effect of thermal cycling on the mechanical properties of steel 20Kh

1985 ◽  
Vol 27 (8) ◽  
pp. 589-591
Author(s):  
Yu. A. Bashnin ◽  
L. A. Lisitskaya ◽  
L. M. Semenova ◽  
A. V. Pozharskii
2019 ◽  
Vol 739 ◽  
pp. 132-139 ◽  
Author(s):  
Jiapeng Liu ◽  
Ding-Bang Xiong ◽  
Yishi Su ◽  
Qiang Guo ◽  
Zhiqiang Li ◽  
...  

Author(s):  
Guolin Xiao ◽  
Wei Zhang ◽  
Zhichao Ma ◽  
Hairui Du ◽  
Weizhi Li ◽  
...  

1998 ◽  
Vol 120 (4) ◽  
pp. 322-327 ◽  
Author(s):  
H. Doi ◽  
K. Kawano ◽  
A. Yasukawa ◽  
T. Sato

The effect of a heat spreader on the life of the solder joints for underfill-encapsulated, flip-chip packages is investigated through stress analyses and thermal cycling tests. An underfill with suitable mechanical properties is found to be able to prolong the fatigue life of the solder joints even in a package with a heat spreader and an alumina substrate. The delamination of the underfill from the chip is revealed as another critical failure mode for which the shape of the underfill fillet has a large effect.


2013 ◽  
Vol 538 ◽  
pp. 121-124
Author(s):  
Jing Zhang

Yttria-stabilized zirconia (YSZ) is an important material in the area of energy and optical applications. In this study, the mechanical properties (Young’s modulus, Vickers hardness, flexural strength, and coefficient thermal expansion) and physical properties (phase transition) of yttria-stabilized tetragonal zirconia polycrystalline (Y-TZP) was reported. The effect of thermal cycling on the mechanical properties and the stability was also evaluated.


1997 ◽  
Vol 279 (3-4) ◽  
pp. 173-180 ◽  
Author(s):  
A. Leenders ◽  
M. Mich ◽  
H.C. Freyhard

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