Correlation between transport and equilibrium properties through the ternary interaction parameter for cosolvent and cononsolvent polymeric systems

1992 ◽  
Vol 270 (3) ◽  
pp. 197-206 ◽  
Author(s):  
C. M. G�mez ◽  
V. Soria ◽  
A. Campos
Keyword(s):  
Interaction Parameter ◽  
Ternary Interaction Parameter ◽  
Ternary Interaction ◽  
Polymeric Systems

scholarly journals Calculation of the thermodynamic properties of liquid Ag-In-Sb alloys

2006 ◽  
Vol 71 (3) ◽  
pp. 203-211 ◽  
Author(s):  
Dragana Zivkovic ◽  
Dragan Manasijevic ◽  
Ivan Mihajlovic ◽  
Zivan Zivkovic
Keyword(s):  
Experimental Data ◽  
Liquid Phase ◽  
Thermodynamic Properties ◽  
Ternary System ◽  
Interaction Parameter ◽  
Thermodynamic Data ◽  
Binary Systems ◽  
Ternary Interaction Parameter ◽  
Ternary Interaction ◽  
Mutual Agreement

The results of calculations of the thermodynamic properties of liquid Ag-In-Sb alloys are presented in this paper. The Redlich-Kister-Muggianu model was used for the calculations. Based on known thermodynamic data for constitutive binary systems and available experimental data for the investigated ternary system, the ternary interaction parameter for the liquid phase in the temperature range 1000-1200 K was determined. Comparison between experimental and calculated results showed their good mutual agreement.

Novel organic, polymeric materials for electronics applications

2002 ◽  
Vol 722 ◽  
Author(s):  
Ram W. Sabnis ◽  
Mary J. Spencer ◽  
Douglas J. Guerrero
Keyword(s):  
Optical Density ◽  
Chemical Vapor ◽  
Polymeric Materials ◽  
Substantial Improvement ◽  
Polymeric Systems ◽  
Patterned Wafers ◽  
Visible Spectra ◽  
Potential Applications ◽  
Deep Ultraviolet ◽  
Deposited Films

AbstractNovel organic, polymeric materials and processes of depositing thin films on electronics substrates by chemical vapor deposition (CVD) have been developed and the lithographic behavior of photoresist coated over these CVD films at deep ultraviolet (DUV) wavelength has been evaluated. The specific monomers synthesized for DUV applications include [2.2](1,4)- naphthalenophane, [2.2](9,10)-anthracenophane and their derivatives which showed remarkable film uniformity on flat wafers and conformality over structured topography wafers, upon polymerization by CVD. The chemical, physical and optical properties of the deposited films have been characterized by measuring parameters such as thickness uniformity, solubility, conformality, adhesion to semiconductor substrates, ultraviolet-visible spectra, optical density, optical constants, defectivity, and resist compatibility. Scanning electron microscope (SEM) photos of cross-sectioned patterned wafers showed verticle profiles with no footing, standing waves or undercut. Resist profiles down to 0.10 νm dense lines and 0.09 νm isolated lines were achieved in initial tests. CVD coatings generated 96-100% conformal films, which is a substantial improvement over commercial spin-on polymeric systems. The light absorbing layers have high optical density at 248 nm and are therefore capable materials for DUV lithography applications. CVD is a potentially useful technology to extend lithography for sub-0.15 νm devices. These films have potential applications in microelectronics, optoelectronics and photonics.

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