Oxide removal and desorption of oxygen from partly oxidized thin films of copper at low pressures

1976 ◽  
Vol 10 (4) ◽  
pp. 227-238 ◽  
Author(s):  
D. Bhogeswara Rao ◽  
K. Heinemann ◽  
D. L. Douglass
RSC Advances ◽  
2018 ◽  
Vol 8 (58) ◽  
pp. 33368-33373 ◽  
Author(s):  
Giuseppe Alessio Verni ◽  
Brenda Long ◽  
Farzan Gity ◽  
Martin Lanius ◽  
Peter Schüffelgen ◽  
...  

Functionalisation of bismuth thin films with alkane thiols for oxide removal and passivation.


2004 ◽  
Vol 811 ◽  
Author(s):  
Stephan Regnery ◽  
Reji Thomas ◽  
Hans Haselier ◽  
Peter Ehrhart ◽  
Rainer Waser ◽  
...  

ABSTRACTSrTa2O6 thin films with thickness between 6 and 150nm were deposited in a multi-wafer planetary MOCVD reactor combined with a TRIJET® liquid delivery system using a single source precursor, strontium-tantalum-(methoxyethoxy)-ethoxide dissolved in toluene. A rather narrow process window for the deposition of stoichiometric SrTa2O6 was found for this precursor at low pressures and a susceptor temperature around 500°C. Films were grown on Pt/TiO2/SiO2/Si, TiNx/Si, and SiO2/Si substrates. The as-deposited films were X-ray amorphous and could be crystallized by post-annealing at a temperature ≥700°C. The SrTa2O6 phase was dominating within a broad range of compositions (Sr/Ta: 0.4–0.7) and a perovskite type phase was observed for Sr/Ta > 0.7. The electrical properties have been investigated with MIM and MIS capacitors after sputter deposition of Pt top electrodes. The amorphous films had a relative permittivity, ε, in the range of 25–45, and low leakage currents. Crystallized films were investigated with Pt MIM capacitors. For stoichiometric SrTa2O6 the dielectric permittivity reached values of ε = 100–110, but the leakage currents were increased. Remarkably, the permittivity is not very sensitive to deviations from the exact stoichiometry of the SrTa2O6 phase (Sr/Ta: 0.40.7), but a decrease to values of ε = 30–40 is observed along with the phase transition at high Sr contents.


2000 ◽  
Vol 647 ◽  
Author(s):  
Kazuo Uetani ◽  
Hiroshi Kajiyama ◽  
Akira Kato ◽  
Isao Tokomoto ◽  
Yasuhiro Koizumi ◽  
...  

AbstractMgO thin films as a protective layer in plasma display panels (PDPs) were deposited by an advanced ion-plating (AIP) apparatus that we had developed. The AIP method enables plasma operation at low-pressures of 10−3 Pa. The MgO thin films were mainly (111) oriented with a small amount of randomly oriented textures. The preferred orientation of the films was dependent on deposition conditions; oxygen content and substrate temperature. Fine columnar structures grew with sharp apexes at the film surface. Secondary electron emission coefficient from a film deposited by the AIP method was higher than that by a conventional electron beam evaporation method. The MgO protective layer could be expected to improve PDPs by our AIP deposition.


2018 ◽  
Vol 282 ◽  
pp. 132-138
Author(s):  
Yusuke Oniki ◽  
Guy Vereecke ◽  
Eugenio Dentoni Litta ◽  
Lars-Ake Ragnarsson ◽  
Harold Dekkers ◽  
...  

A self-limiting wet etching of metal thin films has been developed for the replacement metal gate patterning in advanced logic devices, which will have aggressively scaled gate length and fin pitches. A uniform and highly selective wet etching of polycrystalline TiN films is demonstrated by a diffusion-limiting oxide growth on the metal surfaces as well as a subsequent highly selective oxide removal.


1965 ◽  
Vol 15 (6) ◽  
pp. 434-435
Author(s):  
V. Kamberský ◽  
L. Láska
Keyword(s):  

1995 ◽  
Vol 403 ◽  
Author(s):  
K. Yamakawa ◽  
S. Trolier-McKinstry ◽  
J. P. Dougherty

AbstractComposition control in lead or bismuth based ferroelectric thin films was studied for rf magnetron, dc magnetron and ion beam sputter depositions with metal or oxide targets. For room temperature depositions, (1) control of the target surfaces, (2) suppression of harmful effects from negative ions and (3) control of oxygen content in the films were significant. The surface of the lead target gradually degrades and alters the lead flux extracted from the target. At low pressures resputtering from the film occurs by negative oxygen ions. It is necessary to put more oxygen into the films in the sputter depositions with metal targets and the ion beam sputter depositions. For high temperature depositions, a composition self control was observed for films deposited in excess lead environments.


2004 ◽  
Vol 17 (10) ◽  
pp. 1154-1159 ◽  
Author(s):  
Y Zhang ◽  
R Feenstra ◽  
J R Thompson ◽  
A A Gapud ◽  
T Aytug ◽  
...  

Sign in / Sign up

Export Citation Format

Share Document