Pore formation during oxidative annealing of Al2O3 ??Fe and slowing of grain growth by precipitates and pores

1980 ◽  
Vol 15 (8) ◽  
pp. 1978-1986 ◽  
Author(s):  
H. A. Wang ◽  
F. A. Kr�ger
Keyword(s):  
Grain Growth ◽  
Pore Formation ◽  
Oxidative Annealing

Study on Structure Stability of Ti-Al Multilaminate Material at High Temperature

2012 ◽  
Vol 217-219 ◽  
pp. 307-313
Author(s):  
Gang Feng ◽  
Chao Ge Zhang ◽  
Xian Rui Zhao ◽  
Li Ma
Keyword(s):  
High Temperature ◽  
Grain Boundary ◽  
Grain Growth ◽  
High Power ◽  
Pore Formation ◽  
Experimental Results ◽  
Structure Stability ◽  
Layered Architecture ◽  
Ordered Phases ◽  
Different Temperatures

Ti-Al multilaminate composite was prepared by high-power EB-PVD technology, and under vacuum condition, the samples were annealed at different temperatures. The changed microstructure of the samples after annealing was characterized by XRD, SEM and EDS. The experimental results show that, with the increment of temperature, the ordered phases reduce due to the diffusion of Al into Ti, and the breakdown of layered architecture was induced mainly by pore formation, grain growth and the grain boundary grooving.

Grain Refinement in Titanium-Erbium Alloys

1974 ◽  
Vol 32 ◽  
pp. 522-523
Author(s):  
B. B. Rath ◽  
J. E. O'Neal ◽  
R. J. Lederich
Keyword(s):  
Electron Microscopy ◽  
Size Distribution ◽  
Grain Refinement ◽  
Grain Growth ◽  
Volume Fraction ◽  
Pure Titanium ◽  
Systematic Investigation ◽  
Second Phase ◽  
Titanium Matrix ◽  
Average Size

Addition of small amounts of erbium has a profound effect on recrystallization and grain growth in titanium. Erbium, because of its negligible solubility in titanium, precipitates in the titanium matrix as a finely dispersed second phase. The presence of this phase, depending on its average size, distribution, and volume fraction in titanium, strongly inhibits the migration of grain boundaries during recrystallization and grain growth, and thus produces ultimate grains of sub-micrometer dimensions. A systematic investigation has been conducted to study the isothermal grain growth in electrolytically pure titanium and titanium-erbium alloys (Er concentration ranging from 0-0.3 at.%) over the temperature range of 450 to 850°C by electron microscopy.

Microstructural characterization of a rapidly solidified Al-Fe-V-Si alloy for elevated temperature applications

1988 ◽  
Vol 46 ◽  
pp. 550-551
Author(s):  
R. E. Franck ◽  
J. A. Hawk ◽  
G. J. Shiflet
Keyword(s):  
High Temperature ◽  
Elevated Temperature ◽  
Grain Growth ◽  
Volume Fraction ◽  
Microstructural Characterization ◽  
Second Phase ◽  
Microstructural Stability ◽  
Elevated Temperature Strength ◽  
Temperature Applications

Rapid solidification processing (RSP) is one method of producing high strength aluminum alloys for elevated temperature applications. Allied-Signal, Inc. has produced an Al-12.4 Fe-1.2 V-2.3 Si (composition in wt pct) alloy which possesses good microstructural stability up to 425°C. This alloy contains a high volume fraction (37 v/o) of fine nearly spherical, α-Al12(Fe, V)3Si dispersoids. The improved elevated temperature strength and stability of this alloy is due to the slower dispersoid coarsening rate of the silicide particles. Additionally, the high v/o of second phase particles should inhibit recrystallization and grain growth, and thus reduce any loss in strength due to long term, high temperature annealing.The focus of this research is to investigate microstructural changes induced by long term, high temperature static annealing heat-treatments. Annealing treatments for up to 1000 hours were carried out on this alloy at 500°C, 550°C and 600°C. Particle coarsening and/or recrystallization and grain growth would be accelerated in these temperature regimes.

Microstructural Considerations on the Reliability of 3D Packaging

2012 ◽  
Author(s):  
Zhiheng Huang ◽  
Zhiyong Wu ◽  
Hua Xiong ◽  
Yucheng Ma
Keyword(s):  
Mechanical Behavior ◽  
Grain Growth ◽  
Spinodal Decomposition ◽  
Elastic Energy ◽  
Modeling Approach ◽  
3D Packaging ◽  
Ultrafine Interconnects

Abstract Microstructure and its effect on mechanical behavior of ultrafine interconnects have been studied in this paper using a modeling approach. The microstructure from the processes of solidification, spinodal decomposition, and grain growth in ultrafine interconnects has highlighted its importance. The size, geometry and composition of interconnects as well as the elastic energy can influence microstructure and thus the mechanical behavior. Quantification of microstructure in ultrafine interconnects is a necessary step to establish the linkage between microstructure and reliability.

PREDICTION OF GRAIN GROWTH IN HYBRID WELDING HAZ OF TCS STAINLESS STEEL

2013 ◽  
Vol 48 (2) ◽  
pp. 199-204 ◽  
Author(s):  
Zhuanzhuan ZHANG ◽  
Chuansong WU ◽  
Jinqiang Gao
Keyword(s):  
Stainless Steel ◽  
Grain Growth ◽  
Hybrid Welding

On the Abnormal Grain Growth in Pure Magnesium

2018 ◽  
Author(s):  
Risheng Pei ◽  
Sandra Korte-Kerzel ◽  
Talal Al-Samman
Keyword(s):  
Grain Growth ◽  
Abnormal Grain Growth ◽  
Pure Magnesium

Effect of Thermal Stress on Anisotropic Grain Growth in Nano-Twinned and Un-Twinned Copper Films

2020 ◽  
Author(s):  
I-Hsin Tseng ◽  
Yun-Ting Hsu ◽  
Jihperng Leu ◽  
K. N. Tu ◽  
Chih Chen
Keyword(s):  
Thermal Stress ◽  
Grain Growth ◽  
Copper Films

Dimerization of the Antimicrobial Peptide Polyphemusin I into One Polypeptide Chain: Theoretical and Practical Consequences

2019 ◽  
Vol 35 (5) ◽  
pp. 36-41
Author(s):  
V.A. Zenin ◽  
E.G. Sadykhov ◽  
A.N. Fedorov
Keyword(s):  
Antimicrobial Peptides ◽  
Pore Formation ◽  
Lipid Membrane ◽  
Polypeptide Chain ◽  
Unique Identifier ◽  
Bacterial Cultures ◽  
In Series ◽  
The Russian Federation ◽  
Peptide Dimerization ◽  
Putative Mechanism

A strategy of sequential dimerization of monomers of antimicrobial peptides (AMPs) into one polypeptide chain has been implemented on the example of a beta-structural AMP polyphemusin I which is one of the most effective candidate for use as an antibiotic. The possible polyphemusin I monomer and dimer structures in lipid membrane were studied in this work via molecular modeling. To this end, these molecules were chemically synthesized so that the dimer represented two monomers connected in series into one polypeptide chain with a flexible linker. The antimicrobial effects of monomer and dimer were then tested on various bacterial cultures, and their similarity was shown. Therefore, we can conclude that the pore formation is not a putative mechanism of the polyphemusin I action. antimicrobial peptides, peptide dimerization, mechanism of antimicrobial action, polyphemusin The work was supported by the Ministry of Science and Higher Education of the Russian Federation (Project Unique Identifier RFMEFI57517X0151).

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