scholarly journals Transmission of XeCl excimer laser pulses through optical fibers: Dependence on fiber and laser parameters

1992 ◽  
Vol 54 (3) ◽  
pp. 208-215 ◽  
Author(s):  
G. Hillrichs ◽  
M. Dressel ◽  
H. Hack ◽  
R. Kunstmann ◽  
W. Neu
2003 ◽  
Vol 77 (4) ◽  
pp. 441-445 ◽  
Author(s):  
R.F. Delmdahl ◽  
G. Spiecker ◽  
H. Dietz ◽  
M. Rütting ◽  
G. Hillrichs ◽  
...  

2015 ◽  
Vol 780 ◽  
pp. 29-32 ◽  
Author(s):  
M.Z. Zainol ◽  
Yufridin Wahab ◽  
H. Fazmir ◽  
A.F.M. Anuar ◽  
S. Johari ◽  
...  

Excimer laser micromachining enables us to overcome the conventional lithography-based microfabrication limitations and simplify the process of creating three dimensional (3D) microstructures.The objective of this study is to investigate the relation between the number of laser pulses, number of laser passes through the channel of ablation site and their etch performance. Parameters such as frequency, fluence and velocity were retained as constants. In this paper, we present a parametric characterization study on silicon using KrF excimer laser micromachining. From the result, the etch rate change were recorded as the two major laser parameters (Number of laser pulses and number of laser passes) were varied. Both parameters were showing declination profile however from comparing both graphs, it showed that etch rate dropped more steeply when varied number of laser passes rather than number of pulses.


2005 ◽  
Vol 864 ◽  
Author(s):  
Min-Woo Ha ◽  
Seung-Chul Lee ◽  
Joong-Hyun Park ◽  
Kwang-Seok Seo ◽  
Min-Koo Han

AbstractA new post annealing method employing excimer laser pulses is proposed to improve the transfer characteristics and the breakdown voltage of the unpassivated AlGaN/GaN heterostructure field-effect transistor (HFET) and the passivated one. The XeCl excimer laser pulses with wavelength of 308 nm anneal the AlGaN/GaN HFET after the Schottky gate metallization. The interface defects between the Schottky gate metal and a GaN layer is decreased by the lateral heat diffusion of the laser pulses. Our experimental results show that the drain current and the maximum transconductance of the unpassivated AlGaN/GaN HFET after laser pulses annealing are 496 mA/mm and 134 mS/mm while a virgin device shows 434 mA/mm and 113 mS/mm, respectively. The proposed method anneals effectively the SiO2 passivated AlGaN/GaN HFET and the leakage current of the passivated device is decreased from 483 nA to 29 nA.


Author(s):  
W. Neu ◽  
G. Hillrichs ◽  
R. Jahn ◽  
K. H. Jungbluth ◽  
B. Tschirner

2020 ◽  
Vol 126 (2) ◽  
Author(s):  
Fumitaka Nigo ◽  
Masaki Hashida ◽  
Masahiro Tsukamoto ◽  
Shuji Sakabe ◽  
Mitsuhiro Kusaba

1995 ◽  
Vol 67 (24) ◽  
pp. 3529-3531 ◽  
Author(s):  
J. Albert ◽  
B. Malo ◽  
K. O. Hill ◽  
F. Bilodeau ◽  
D. C. Johnson ◽  
...  

2000 ◽  
Vol 33 (17) ◽  
pp. 2142-2145 ◽  
Author(s):  
L Berthe ◽  
A Sollier ◽  
P Peyre ◽  
R Fabbro ◽  
E Bartnicki

2000 ◽  
Vol 28 (1) ◽  
pp. 24-28 ◽  
Author(s):  
Junichi SHIDA ◽  
Naoyuki KOBAYASHI ◽  
Hideaki KUSAMA

2000 ◽  
Vol 9 (3) ◽  
pp. 235-238 ◽  
Author(s):  
T. Schmidt-Uhlig ◽  
P. Karlitschek ◽  
M. Yoda ◽  
Y. Sano ◽  
G. Marowsky

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