Photothermal determination of vertical crack lengths in silicon nitride

1990 ◽  
Vol 50 (5) ◽  
pp. 465-471 ◽  
Author(s):  
J. Rantala ◽  
J. Hartikainen ◽  
J. Jaarinen
1989 ◽  
Vol 97 (1132) ◽  
pp. 1466-1470
Author(s):  
Atsushi CHINO ◽  
Hideo IWATA ◽  
Sirou TORIZUKA ◽  
Kazuya YABUTA

1990 ◽  
Vol 5 (3) ◽  
pp. 121-124 ◽  
Author(s):  
David J. Devlin ◽  
Kamal E. Amin

AbstractThe relative intensities ratios for the determination of the relative amounts of alpha and beta phases in silicon nitride and the relative amounts of delta yttrium disilicate (Y2Si2O7) and nitrogen apatite [Y5(SiO4)3N] are reported. These constants were determined using an iterative method applicable when the pure phases are not easily prepared. In addition, a calibration curve was obtained for the quantitative measurement of free silicon in silicon nitride over the range 0 to 0.3% by weight of Si.


2016 ◽  
Vol 54 (2) ◽  
pp. 197-205 ◽  
Author(s):  
V. V. Yakushev ◽  
A. V. Utkin ◽  
A. N. Zhukov ◽  
D. V. Shakhrai ◽  
V. V. Kim

1992 ◽  
Vol 41 (12) ◽  
pp. T151-T156 ◽  
Author(s):  
Yoshinori UWAMINO ◽  
Hisashi MORIKAWA ◽  
Akira TSUGE ◽  
Kiyoshi NAKANE ◽  
Yasuo IIDA ◽  
...  

2019 ◽  
Vol 220 ◽  
pp. 03012
Author(s):  
Ilia Elmanov ◽  
Anna Elmanova ◽  
Sophia Komrakova ◽  
Alexander Golikov ◽  
Natalya Kaurova ◽  
...  

In the work the thicknesses of the e-beam resists ZEP 520A and ma-N 2400 by using non-destructive method were measured, as well as recipe for the high ratio between the Si3N4 and the resists etching rate was determined. The work has a practical application for e-beam lithography of photonic-integrated circuits and nanophotonics devices based on silicon nitride platform.


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