Phase transitions and thermal expansion coefficients of plant cuticles

Planta ◽  
1990 ◽  
Vol 182 (2) ◽  
Author(s):  
Lukas Schreiber ◽  
J�rg Sch�nherr
Keyword(s):  
Thermal Expansion ◽  
Phase Transitions ◽  
Thermal Expansion Coefficients ◽  
Plant Cuticles ◽  
Expansion Coefficients

Thermodynamics of Epitaxial Ferroelectric Films.

1995 ◽  
Vol 401 ◽  
Author(s):  
S. B. Desu ◽  
V. P. Dudkevich ◽  
P. V. Dudkevich ◽  
I. N. Zakharchenko ◽  
G. L. Kushlyan
Keyword(s):  
Thermal Expansion ◽  
Phase Transitions ◽  
Misfit Dislocations ◽  
Ferroelectric Films ◽  
Growth Stresses ◽  
Substrate Interaction ◽  
Thermal Expansion Coefficients ◽  
Expansion Coefficients ◽  
The Difference ◽  
Film Substrate

AbstractThe problem of phase transitions and physical properties of the BaTiO3-type films on the (001) single-crystal substrates of the cubic syngony was solved in the limits of the Landau- Devonshire thermodynamics. The thermoelastic film-substrate interaction caused by the difference between thermal expansion coefficients was strictly taken into consideration. The model was based on the following assumptions: 1) the film is closely conjugated with the substrate; 2) the film is sufficiently “thick”to find itself unstrained at the growth temperature Ts, ( growth stresses were compensated by misfit dislocations ), and 3) the film is sufficiently “thin, and the stresses arising at the temperatures T>Ts may be considered to be uniform.

High-temperature X-ray diffraction study of Ag2S-Cu2S system

2020 ◽  
pp. 2150018
Author(s):  
Y. G. Asadov ◽  
Y. I. Aliyev ◽  
A. O. Dashdemirov ◽  
S. H. Jabarov ◽  
T. G. Naghiyev
Keyword(s):  
Thermal Expansion ◽  
Phase Transitions ◽  
High Temperature ◽  
X Ray Diffraction ◽  
X Ray ◽  
Thermal Expansion Coefficients ◽  
Cubic Phases ◽  
Temperature Ranges ◽  
Expansion Coefficients ◽  
Xrd Method

Single crystals of AgCuS, [Formula: see text], [Formula: see text] and [Formula: see text] compounds were synthesized using the Bridgman method. The crystal structures and phase transitions were studied by X-ray diffraction (XRD) method in the high temperature ranges. The monoclinic, orthorhombic, hexagonal and cubic phases were observed in the temperature range of [Formula: see text]. Thermal expansion coefficients were calculated for different phases according to the lattice parameters. It was determined that the values of thermal expansion coefficients differ in different planes depending on the space group and symmetry.

Thermophysical Properties of Gd2O3 Doped SrHfO3 Ceramic

2015 ◽  
Vol 816 ◽  
pp. 237-241 ◽  
Author(s):  
Wen Ma ◽  
Yi Ren ◽  
Xi Long Jin ◽  
Ya Hong Liang ◽  
Bao Dong Chen ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Thermal Expansion ◽  
Phase Transitions ◽  
High Temperature ◽  
Solid State ◽  
Solid State Reaction Method ◽  
Reaction Method ◽  
Long Period ◽  
Thermal Expansion Coefficients ◽  
Expansion Coefficients

Gd2O3 (10mol%) doped SrHfO3 (Sr (Hf0.9Gd0.1)O2.95) was synthesized by solid state reaction method. The phase stability of the synthesized Sr (Hf0.9Gd0.1)O2.95 powder at high temperature of 1450 oC for a long period and in a temperature range of RT-1400 oC was characterized by XRD and DSC, respectively. The thermal expansion coefficients (TECs) of bulk Sr (Hf0.9Gd0.1)O2.95 were recorded by a high-temperature dilatometer, indicating that the phase transitions of SrHfO3 are suppressed remarkably by doping Gd2O3. The thermal conductivity of bulk Sr (Hf0.9Gd0.1)O2.95 at 1000 oC is ~1.95 W/m·K, which is ~11% lower than that of bulk 8YSZ.

Influence of Cr deficiency on sintering, thermal expansion and electrical properties of La0.75Sr0.25Cr1−xO3−δ as a SOFC interconnect material

2016 ◽  
Vol 30 (11) ◽  
pp. 1650127 ◽  
Author(s):  
Yi Ren ◽  
Wen Ma ◽  
Xiaoying Li ◽  
Jun Wang ◽  
Yu Bai ◽  
...  
Keyword(s):  
Thermal Expansion ◽  
Electrical Properties ◽  
Perovskite Phase ◽  
Ignition Process ◽  
Thermal Expansion Coefficients ◽  
Auto Ignition ◽  
Pure Perovskite Phase ◽  
Maximum Conductivity ◽  
Expansion Coefficients ◽  
Interconnect Material

The SOFC interconnect materials La[Formula: see text]Sr[Formula: see text]Cr[Formula: see text]O[Formula: see text] [Formula: see text]–[Formula: see text] were prepared using an auto-ignition process. The influences of Cr deficiency on their sintering, thermal expansion and electrical properties were investigated. All the samples were pure perovskite phase after sintering at 1400[Formula: see text]C for 4 h. The cell volume of La[Formula: see text]Sr[Formula: see text]Cr[Formula: see text]O[Formula: see text] decreased with increasing Cr deficient content. The relative density of the sintered bulk samples increased from 93.2% [Formula: see text] to a maximum value of 94.7% [Formula: see text] and then decreased to 87.7% [Formula: see text]. The thermal expansion coefficients of the sintered bulk samples were in the range of [Formula: see text]–[Formula: see text] (30–1000[Formula: see text]C), which are compatible with that of YSZ. Among the investigated samples, the sample with 0.02 Cr deficiency had a maximum conductivity of 40.4 Scm[Formula: see text] and the lowest Seebeck coefficient of 154.8 [Formula: see text]VK[Formula: see text] at 850[Formula: see text]C in pure He. The experimental results indicate that La[Formula: see text]Sr[Formula: see text]Cr[Formula: see text]O[Formula: see text] has the best properties and is much suitable for SOFC interconnect material application.

Novel Silicon-Elastomers for Advanced Soft Lithography

2006 ◽  
Vol 947 ◽  
Author(s):  
Kyung Choi
Keyword(s):  
Thermal Expansion ◽  
High Resolution ◽  
Soft Lithography ◽  
Materials Properties ◽  
Nano Scale ◽  
Thermal Expansion Coefficients ◽  
High Thermal Expansion ◽  
Expansion Coefficients

ABSTRACTHigh resolution pattern transfers in the nano-scale regime have been considerable challenges in ‘soft lithography’ to achieve nanodevices with enhanced performances. In this technology, the resolution of pattern integrations is significantly rely on the materials' properties of polydimethylsiloxane (PDMS) stamps. Since commercial PDMS stamps have shown limitations in nano-scale resolution soft lithography due to their low physical toughness and high thermal expansion coefficients, we developed stiffer, photocured PDMS silicon elastomers designed, specifically for nano-sized soft lithography and photopatternable nanofabrications.

Thermal expansion coefficients of NH4ReO4and NH4IO4down to 58 K

1985 ◽  
Vol 82 (3) ◽  
pp. 1611-1612 ◽  
Author(s):  
Stanley L. Segel ◽  
H. Karlsson ◽  
T. Gustavson ◽  
K. Edstrom
Keyword(s):  
Thermal Expansion ◽  
Thermal Expansion Coefficients ◽  
Expansion Coefficients

scholarly journals Organizing Cells Within Non-Periodic Microarchitectured Materials That Achieve Graded Thermal Expansions

2015 ◽  
Author(s):  
Jonathan B. Hopkins ◽  
Lucas A. Shaw ◽  
Todd H. Weisgraber ◽  
George R. Farquar ◽  
Christopher D. Harvey ◽  
...  
Keyword(s):  
Finite Element Analysis ◽  
Thermal Expansion ◽  
Young’S Modulus ◽  
Young's Modulus ◽  
Element Analysis ◽  
Thermal Expansion Coefficients ◽  
Large Lattice ◽  
Unit Cells ◽  
Expansion Coefficients ◽  
Bulk Behavior

The aim of this paper is to introduce an approach for optimally organizing a variety of different unit cell designs within a large lattice such that the bulk behavior of the lattice exhibits a desired Young’s modulus with a graded change in thermal expansion over its geometry. This lattice, called a graded microarchitectured material, can be sandwiched between two other materials with different thermal expansion coefficients to accommodate their different expansions or contractions caused by changing temperature while achieving a desired uniform stiffness. First, this paper provides the theory necessary to calculate the thermal expansion and Young’s modulus of large multi-material lattices that consist of periodic (i.e., repeating) unit cells of the same design. Then it introduces the theory for calculating the graded thermal expansions of a large multimaterial lattice that consists of non-periodic unit cells of different designs. An approach is then provided for optimally designing and organizing different unit cells within a lattice such that both of its ends achieve the same thermal expansion as the two materials between which the lattice is sandwiched. A MATLAB tool is used to generate images of the undeformed and deformed lattices to verify their behavior and various examples are provided as case studies. The theory provided is also verified and validated using finite element analysis and experimentation.

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