TRANSVERSE VIBRATIONS OF A THIN RECTANGULAR PLATE SUBJECTED TO A NON-UNIFORM STRESS DISTRIBUTION FIELD

1998 ◽  
Vol 210 (4) ◽  
pp. 559-565 ◽  
Author(s):  
P.A.A. Laura ◽  
R.H. Gutierrez
Keyword(s):  
Stress Distribution ◽  
Rectangular Plate ◽  
Uniform Stress ◽  
Thin Rectangular Plate ◽  
Transverse Vibrations ◽  
Distribution Field

Scattering from a Thin Rectangular Plate at Glancing Incidence

2001 ◽  
Vol 21 (2) ◽  
pp. 147-163 ◽  
Author(s):  
Hirohide Serizawa ◽  
Kohei Hongo ◽  
Hirokazu Kobayashi
Keyword(s):  
Rectangular Plate ◽  
Thin Rectangular Plate

Uniform stress distribution road piezoelectric generator with free-fixed-end type central strike mechanism

Energy ◽  
2022 ◽  
Vol 239 ◽  
pp. 121812
Author(s):  
Seong Do Hong ◽  
Jung Hwan Ahn ◽  
Kyung-Bum Kim ◽  
Jeong Hun Kim ◽  
Jae Yong Cho ◽  
...  
Keyword(s):  
Stress Distribution ◽  
Uniform Stress ◽  
Piezoelectric Generator ◽  
Fixed End

Wavelet Multi-Scale Solution for Deflection of Thin Rectangular Plates under Temperature

2012 ◽  
Vol 166-169 ◽  
pp. 2871-2875
Author(s):  
Yan Chang Wang ◽  
Ke Liang Ren ◽  
Yan Dong ◽  
Ming Guang Wu
Keyword(s):  
Differential Equations ◽  
Rectangular Plate ◽  
Thermal Environment ◽  
Operational Matrix ◽  
Rectangular Plates ◽  
Thin Rectangular Plate ◽  
Multi Scale ◽  
Scale Method ◽  
The Matrix ◽  
Operational Matrix Of Integration

To consider the deformation of thin rectangular plate under temperature. In this paper, the wavelet multi-scale method was used to solve the thin plate governing differential equations with four different initial or boundary conditions. An operational matrix of integration based on the wavelet was established and the procedure for applying the matrix to solve the differential equations was formulated, and got the deflection of thin rectangular plates under temperature. The result provides a theoretical reference for solving thin rectangular plate deflection in thermal environment using multi-scale approach.

scholarly journals Stress distribution in a rectangular plate having two opposing edges sheared in opposite directions

1923 ◽  
Vol 103 (723) ◽  
pp. 598-610 ◽  
Keyword(s):  
Shear Stress ◽  
Stress Distribution ◽  
Rectangular Plate ◽  
Royal Society ◽  
External Stress ◽  
The Other ◽  
Optical Methods ◽  
Centre Line ◽  
Distribution Of Stress

The type of deformation under investigation is indicated by fig. 1. A rectangular plate ABCD is deformed into the shape A'B'C'D'. The two opposing edges AB, CD are shifted horizontally without alteration of length into the position A'B', C'D', the other boundaries AD, BC being kept free from external stress. In a paper which appeared in the 'Proc. Royal Society', December 28, 1911, Prof. E. G. Coker investigated this same type of deformation using optical methods to determine the distribution of stress along the centre line OX. He found that if the plate was square the shear stress along OX was distributed in a munner which was approximately parabolic. As the ratio of AD to AB decreased the curve of distribution first of all became flat-topped, and for yet smaller ratios two distinct humps made their appearance.

scholarly journals Fabrication of Optimally Micro-Textured Copper Substrates by Plasma Printing for Plastic Mold Packaging

2020 ◽  
Vol 14 (2) ◽  
pp. 200-207 ◽  
Author(s):  
Tatsuhiko Aizawa ◽  
Yasuo Saito ◽  
Hideharu Hasegawa ◽  
Kenji Wasa ◽  
◽  
...  
Keyword(s):  
Stress Distribution ◽  
Copper Substrate ◽  
Three Dimensional ◽  
Picosecond Laser ◽  
Numerical Control ◽  
Uniform Stress ◽  
Element Analysis ◽  
Micro Grooving ◽  
Plastic Mold ◽  
Screen Printed

Micro-embossing using plasma printed micro-punch was proposed to form micro-groove textures into the copper substrate for plastic packaging of hollowed GaN HEMT-chips. In particular, the micro-groove network on the copper substrate was optimized to attain uniform stress distribution with maximum stress level being as low as possible. Three-dimensional finite element analysis was employed to investigate the optimum micro-grooving texture-topology and to attain the uniform stress distribution on the joined interface between the plastic mold and the textured copper substrate. Thereafter, plasma printing was utilized to fabricate the micro-punch for micro-embossing of the micro-grooving network into the copper substrate as a designed optimum micro-texture. This plasma printing mainly consisted of three steps. Two-dimensional micro-pattern was screen-printed onto the AISI316 die surface as a negative pattern of the optimum CAD data. The screen-printed die was plasma nitrided at 673 K for 14.4 ks at 70 Pa under the hydrogen-nitrogen mixture for selective nitrogen supersaturation onto the unprinted die surfaces. A micro-punch was developed by mechanically removing the printed parts of die material. Then, fine computer numerical control (CNC) stamping was used to yield the micro-embossed copper substrate specimens. Twelve micro-textured substrates were molded into packaged specimens by plastic molding. Finally, gross leak testing was employed to evaluate the integrity of the joined interface. The takt time required to yield the micro-grooved copper substrate by the present method was compared to the picosecond laser micro-grooving; the former showed high productivity based on this parameter.

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