The effect of antimony oxide flame retardants on color of vinyl films

1981 ◽  
Vol 3 (4) ◽  
pp. 205-207 ◽  
Author(s):  
Richard L. Abrams
Keyword(s):  
Flame Retardants ◽  
Antimony Oxide

Interaction of Silanes with Antimony Oxide to Facilitate Particulate Dispersion in Organic Media and to Enhance Flame Retardance

1975 ◽  
Vol 29 (6) ◽  
pp. 512-517 ◽  
Author(s):  
G. A. Pasteur ◽  
H. Schonhorn
Keyword(s):  
Infrared Spectroscopy ◽  
Flame Retardants ◽  
Strong Acid ◽  
Antimony Oxide ◽  
Organic Media ◽  
Flame Retardance ◽  
Acid Media ◽  
Particulate Dispersion

Three new organo-antimony flame retardants which are insoluble in strong acid media have been prepared by the interaction of silanes with antimony oxide using three different procedures. These compounds have been characterized by infrared spectroscopy.

scholarly journals Study on the Flame Retardancy and Hazard Evaluation of Poly(acrylonitrile-co-vinylidene chloride) Fibers by the Addition of Antimony-Based Flame Retardants

Polymers ◽  
2021 ◽  
Vol 14 (1) ◽  
pp. 42
Author(s):  
Hyelim Kim ◽  
Ji-Su Kim ◽  
Wonyoung Jeong
Keyword(s):  
Thermal Properties ◽  
Flame Retardant ◽  
Flame Retardancy ◽  
Flame Retardants ◽  
Antimony Oxide ◽  
Antimony Trioxide ◽  
Hazardous Substance ◽  
Vinylidene Chloride ◽  
Poly Acrylonitrile ◽  
Antimony Tetroxide

Antimony oxide (ATO) is used mainly as a flame retardant, but it is classified as a hazardous substance. Therefore, regulations on the use of antimony trioxide (ATO(3)) and antimony pentoxide (ATO(5)) in textile products are being developed. Accordingly, there is a need for alternative flame retardants. In this study, antimony tetroxide (ATO(4)), which has higher thermal stability and resistance to acids and alkalis than ATO(3) or ATO(5), was selected to assess its use as an alternative flame retardant. First, ATO(3) or ATO(4) were added to poly(acrylonitrile-co-vinylidene chloride) (PANVDC), and the film and wet-spun fiber were prepared. The PANVDC film with flame retardants was prepared to evaluate the flame retardancy and the mechanism of action of the flame retardants. Flame retardancy analysis showed that a limiting oxygen index of 31.2% was obtained when ATO(4) was added, which was higher than when ATO(3) was used. Subsequently, PANVDC fibers with antimony oxide were manufactured and showed improved mechanical and thermal properties when ATO(4) was used, compared to when ATO(3) was tested. In addition, migration analysis due to antimony in the fiber confirmed that the elution amount was below the acceptable standard when PANVDC fibers with ATO(4) were added. Therefore, based on these results, the flame-retardant and thermal properties of antimony tetroxide were superior to antimony trioxide, and it was confirmed that ATO(4) could be used as an alternative flame retardant to ATO(3).

The Formulation of Nonburning Elastomer Compounds

1973 ◽  
Vol 46 (4) ◽  
pp. 1114-1125 ◽  
Author(s):  
H. E. Trexler
Keyword(s):  
Flame Retardants ◽  
Antimony Oxide ◽  
Initial Screening ◽  
Table Xiii

Abstract In this investigation the flammability of 34 polymers was evaluated in 68 compounds; 28 flame retardants were tested in 275 compounds. Only two of 34 polymers evaluated as black-filled compositions were nonburning in the initial screening, five were self-extinguishing, and the rest were completely combustible. Twenty-three of the 32 combustible and self-extinguishing polymers were reformulated into nonburning polymers by the addition of two flame retardants—antimony oxide and either Chlorowax 70 or Dechlorane 515 (Table XIII). Frequently a plasticizer was required. If Chlorowax is compatible with the polymer, it often acts as a plasticizer. Fyrol FR—2 was the only other plasticizer found to be compatible with most polymers and permitting them to retain their nonburning classification.

Conductive Filament Formation in Printed Circuit Boards – Effects of Reflow Conditions and Flame Retardants

2009 ◽  
Author(s):  
Bhanu Sood ◽  
Michael Pecht
Keyword(s):  
Flame Retardants ◽  
Printed Circuit Boards ◽  
Electrochemical Process ◽  
Lead Free ◽  
Circuit Boards ◽  
Filament Formation ◽  
Conductive Filament ◽  
Printed Circuit ◽  
Free Solder ◽  
Halogen Free

Abstract Failures in printed circuit boards account for a significant percentage of field returns in electronic products and systems. Conductive filament formation is an electrochemical process that requires the transport of a metal through or across a nonmetallic medium under the influence of an applied electric field. With the advent of lead-free initiatives, boards are being exposed to higher temperatures during lead-free solder processing. This can weaken the glass-fiber bonding, thus enhancing conductive filament formation. The effect of the inclusion of halogen-free flame retardants on conductive filament formation in printed circuit boards is also not completely understood. Previous studies, along with analysis and examinations conducted on printed circuit boards with failure sites that were due to conductive filament formation, have shown that the conductive path is typically formed along the delaminated fiber glass and epoxy resin interfaces. This paper is a result of a year-long study on the effects of reflow temperatures, halogen-free flame retardants, glass reinforcement weave style, and conductor spacing on times to failure due to conductive filament formation.

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