Prediction of Chip Solder Fatigue in IGBTs

2020 ◽  
Author(s):  
Xiping Wang ◽  
Zhigang Li ◽  
Fang Yao ◽  
Shengxue Tang
Keyword(s):  
Solder Fatigue

Solder Creep-Fatigue Interactions With Flexible Leaded Parts

1992 ◽  
Vol 114 (2) ◽  
pp. 185-192 ◽  
Author(s):  
R. G. Ross ◽  
L. C. Wen ◽  
G. R. Mon ◽  
E. Jetter
Keyword(s):  
Computer Program ◽  
Strain Rate ◽  
Thermal Cycle ◽  
Failure Process ◽  
Strain Range ◽  
Strain Rate Effects ◽  
Rate Effects ◽  
Creep Fatigue ◽  
Solder Fatigue

With flexible leaded parts, the solder-joint failure process involves a complex interplay of creep and fatigue mechanisms. To better understand the role of creep in typical multi-hour cyclic loading conditions, a specialized non-linear finite-element creep simulation computer program has been formulated. The numerical algorithm includes the complete part-lead-solder-PWB system, accounting for strain-rate dependence of creep on applied stress and temperature, and the role of the part-lead dimensions and flexibility that determine the total creep deflection (solder strain range) during stress relaxation. The computer program has been used to explore the effects of various solder creep-fatigue parameters such as lead height and stiffness, thermal-cycle test profile, and part/board differential thermal expansion properties. One of the most interesting findings is the strong presence of unidirectional creep-ratcheting that occurs during thermal cycling due to temperature dominated strain-rate effects. To corroborate the solder fatigue model predictions, a number of carefully controlled thermal-cycle tests have been conducted using special bimetallic test boards.

Modeling of Solder Fatigue Failure due to Ductile Damage

2010 ◽  
Vol 26 (4) ◽  
pp. N23-N27 ◽  
Author(s):  
K. Aluru ◽  
F.-L. Wen ◽  
Y.-L. Shen
Keyword(s):  
Numerical Study ◽  
Fatigue Cracks ◽  
Damage Model ◽  
Quantitative Information ◽  
Ductile Damage ◽  
Element Analysis ◽  
Cyclic Shear ◽  
Rate Dependent ◽  
Solder Fatigue ◽  
Temporal And Spatial

ABSTRACTA numerical study is undertaken to simulate failure of solder joint caused by cyclic shear deformation. A progressive ductile damage model is incorporated into the rate-dependent elastic-viscoplastic finite element analysis, resulting in the capability of simulating damage evolution and eventual failure through crack formation. It is demonstrated that quantitative information of fatigue life, as well as the temporal and spatial evolution of fatigue cracks, can be explicitly obtained.

Applications of 3D X-Ray Microscopy for Advanced Package Development

2011 ◽  
Vol 2011 (1) ◽  
pp. 001078-001083 ◽  
Author(s):  
K. Fahey ◽  
R. Estrada ◽  
L. Mirkarimi ◽  
R. Katkar ◽  
D. Buckminster ◽  
...  
Keyword(s):  
Failure Analysis ◽  
Flip Chip ◽  
Development Stage ◽  
Development Effort ◽  
X Ray ◽  
Structural Details ◽  
Volumetric Images ◽  
Advanced Packaging ◽  
Solder Fatigue ◽  
Non Destructive

This paper describes the utilization of non-destructive imaging using 3D x-ray microscopy for package development and failure analysis. Four case studies are discussed to explain our methodology and its impact on our advanced packaging development effort. Identifying and locating failures embedded deep inside the package, such as a solder fatigue failure within a flip chip package, without the need for physical cross-sectioning is of substantial benefit because it preserves the package for further analysis. Also of utility is the ability to reveal the structural details of the package while producing superior quality 2D and volumetric images. The technique could be used not only for analysis of defects and failures, but also to characterize geometries and morphologies during the process and package development stage.

Thermal lifetime estimation method of IGBT module considering solder fatigue damage feedback loop

2018 ◽  
Vol 82 ◽  
pp. 51-61 ◽  
Author(s):  
Bing Gao ◽  
Fan Yang ◽  
Minyou Chen ◽  
Yigao Chen ◽  
Wei Lai ◽  
...  
Keyword(s):  
Fatigue Damage ◽  
Feedback Loop ◽  
Estimation Method ◽  
Lifetime Estimation ◽  
Igbt Module ◽  
Solder Fatigue

scholarly journals Unified Creep Plasticity Damage (UCPD) Model for SAC396 Solder

2013 ◽  
Author(s):  
Michael Neilsen ◽  
Paul Vianco
Keyword(s):  
Finite Element ◽  
Solder Joints ◽  
Element Analysis ◽  
Damage Evolution Equation ◽  
Thermal Mechanical Fatigue ◽  
Model Predictions ◽  
Solder Fatigue ◽  
Solder Joint Fatigue ◽  
The Relationship ◽  
Model Crack

A unified creep plasticity damage (UCPD) model for Sn-Pb and Pb-free solders was developed and implemented into finite element analysis codes. The new model will be described along with the relationship between the model’s damage evolution equation and an empirical Coffin-Manson relationship for solder fatigue. Next, developments needed to model crack initiation and growth in solder joints will be described. Finally, experimentally observed cracks in typical solder joints subjected to thermal mechanical fatigue are compared with model predictions. Finite element based modeling is particularly suited for predicting solder joint fatigue of advanced electronics packaging, e.g. package-on-package (PoP), because it allows for evaluation of a variety of package materials and geometries.

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