An Investigation on the Strengthening Mechanism Based on Grain‐Boundary Misorientation of High‐Strength Pipeline Steel

2019 ◽  
Vol 90 (12) ◽  
pp. 1900317 ◽  
Author(s):  
Qiang Duan ◽  
Hongbo Pan ◽  
Bin Fu ◽  
Jun Yan
Keyword(s):  
Grain Boundary ◽  
Pipeline Steel ◽  
High Strength ◽  
Strengthening Mechanism ◽  
Boundary Misorientation ◽  
Grain Boundary Misorientation

Measurement of solute segregation to grain boundaries in the AEM: A review

1988 ◽  
Vol 46 ◽  
pp. 606-607
Author(s):  
D. B. Williams ◽  
A. D. Romig
Keyword(s):  
Grain Boundary ◽  
Grain Boundaries ◽  
Boundary Migration ◽  
Grain Boundary Migration ◽  
Boundary Misorientation ◽  
Collector Plate ◽  
Segregation Process ◽  
Grain Boundary Misorientation ◽  
Structure Boundary ◽  
Equilibrium Segregation

The segregation of solute or imparity elements to grain boundaries can occur by three well-defined processes. The first is Gibbsian segregation in which an element of minimal matrix solubility confines itself to a monolayer at the grain boundary. Classical examples include Bi in Cu and S or P in Fe. The second process involves the depletion of excess matrix solute by volume diffusion to the boundary. In the boundary, the solute atoms diffuse rapidly to precipitates, causing them to grow by the ‘collector-plate mechanism.’ Such grain boundary diffusion is thought to initiate “Diffusion-Induced Grain Boundary Migration,” (DIGM). This process has been proposed as the origin of eutectoid transformations or discontinuous grain boundary reactions. The third segregation process is non-equilibrium segregation which result in a solute build-up around the boundary because of solute-vacancy interactions.All of these segregation phenomena usually occur on a sub-micron scale and are often affected by the nature of the grain boundary (misorientation, defect structure, boundary plane).

scholarly journals Microstructure and Enhanced Properties of Copper-Vanadium Nanocomposites Obtained by Powder Metallurgy

Materials ◽  
2019 ◽  
Vol 12 (3) ◽  
pp. 339 ◽  
Author(s):  
Yong Wang ◽  
Jinguo Wang ◽  
Haohao Zou ◽  
Yutong Wang ◽  
Xu Ran
Keyword(s):  
Electrical Conductivity ◽  
Grain Size ◽  
Yield Strength ◽  
Grain Boundary ◽  
High Strength ◽  
Strengthening Mechanism ◽  
Copper Matrix ◽  
Dispersion Strengthening ◽  
Annealed Copper ◽  
Grain Boundary Strengthening

Cu-2.4 wt.%V nanocomposite has been prepared by mechanical alloy and vacuum hot-pressed sintering technology. The composites were sintered at 800 °C, 850 °C, 900 °C, and 950 °C respectively. The microstructure and properties of composites were investigated. The results show that the Cu-2.4 wt.%V composite presents high strength and high electrical conductivity. The composite sintered at 900 °C has a microhardness of 205 HV, a yield strength of 404.41 MPa, and an electrical conductivity of 79.5% International Annealed Copper Standard (IACS); the microhardness and yield strength reduce gradually with the increasing consolidation temperature, which is mainly due to the growth of copper grain size. After sintering, copper grain size and V nanoparticle both maintain in nanoscale; the strengthening mechanism is related to grain boundary strengthening and dispersion strengthening, while the grain boundary strengthening mechanism plays the most important role. This study indicates that the addition of small amounts of V element could enhance the copper matrix markedly with the little sacrifice of electrical conductivity.

Sign in / Sign up

Export Citation Format

Share Document