Surface structure of the PAN-based carbon fibres studied by the scanning probe microscopy (SPM)

1994 ◽  
Vol 22 (1-12) ◽  
pp. 290-295 ◽  
Author(s):  
P. A. Zhdan ◽  
D. Grey ◽  
J. E. Castle
Keyword(s):  
Surface Structure ◽  
Scanning Probe Microscopy ◽  
Scanning Probe ◽  
Carbon Fibres ◽  
Probe Microscopy

Surface structure of nanocomposites based on silicon-carbon matrix revealed by scanning probe microscopy

2011 ◽  
Vol 40 (8) ◽  
pp. 591-594 ◽  
Author(s):  
M. D. Malinkovich ◽  
Yu. N. Parkhomenko ◽  
D. S. Polyakov ◽  
M. L. Shupegin
Keyword(s):  
Surface Structure ◽  
Scanning Probe Microscopy ◽  
Carbon Matrix ◽  
Scanning Probe ◽  
Probe Microscopy ◽  
Silicon Carbon

Surface Structure on Ar+-Ion Irradiated Graphite by Scanning Probe Microscopy

2000 ◽  
Vol 39 (Part 1, No. 6B) ◽  
pp. 3732-3735 ◽  
Author(s):  
Bai An ◽  
Seiji Fukuyama ◽  
Kiyoshi Yokogawa ◽  
Masamichi Yoshimura
Keyword(s):  
Surface Structure ◽  
Scanning Probe Microscopy ◽  
Scanning Probe ◽  
Probe Microscopy ◽  
Irradiated Graphite

scholarly journals Characterizing the Cell Surface Structure and Antibody Recognition Forces on Intact Microbial Cells using Scanning Probe Microscopy

2014 ◽  
Vol 106 (2) ◽  
pp. 511a-512a
Author(s):  
Yoo Jin Oh ◽  
Gerhard Sekot ◽  
Memed Duman ◽  
Lilia Chtcheglova ◽  
Paul Messner ◽  
...  
Keyword(s):  
Cell Surface ◽  
Surface Structure ◽  
Scanning Probe Microscopy ◽  
Scanning Probe ◽  
Microbial Cells ◽  
Probe Microscopy ◽  
Antibody Recognition ◽  
Cell Surface Structure

scholarly journals Investigating the Surface Structure and Antibody Recognition Forces of Tannerella Forsythia by Scanning Probe Microscopy

2012 ◽  
Vol 102 (3) ◽  
pp. 588a
Author(s):  
Yoo Jin Oh ◽  
Gerhard Sekot ◽  
Linda Wildling ◽  
Paul Messner ◽  
Christina Schäffer ◽  
...  
Keyword(s):  
Surface Structure ◽  
Scanning Probe Microscopy ◽  
Scanning Probe ◽  
Tannerella Forsythia ◽  
Probe Microscopy ◽  
Antibody Recognition

The Role of Scanning Probe Microscopy in Drug Delivery Research

1996 ◽  
Vol 13 (3-4) ◽  
pp. 225-256 ◽  
Author(s):  
Kevin M. Shakesheff ◽  
Martyn C. Davies ◽  
Clive J. Roberts ◽  
Saul J. B. Tendler ◽  
Philip M. Williams
Keyword(s):  
Drug Delivery ◽  
Scanning Probe Microscopy ◽  
Scanning Probe ◽  
Probe Microscopy

Extending Electrical Scanning Probe Microscopy Measurements of Semiconductor Devices Using Microwave Impedance Microscopy

2015 ◽  
Author(s):  
Benedict Drevniok ◽  
St. John Dixon-Warren ◽  
Oskar Amster ◽  
Stuart L Friedman ◽  
Yongliang Yang
Keyword(s):  
Scanning Probe Microscopy ◽  
Semiconductor Devices ◽  
Cmos Image Sensor ◽  
Image Sensor ◽  
Scanning Probe ◽  
Cross Sectional ◽  
Probe Microscopy ◽  
Dopant Profiling ◽  
Capacitance Voltage

Abstract Scanning microwave impedance microscopy was used to analyze a CMOS image sensor sample to reveal details of the dopant profiling in planar and cross-sectional samples. Sitespecific capacitance-voltage spectroscopy was performed on different regions of the samples.

Cross-Section Sample Preparation Method for Imaging Dopant Related Anomalies Using Scanning Probe Microscopy Techniques

2014 ◽  
Author(s):  
Swaminathan Subramanian ◽  
Khiem Ly ◽  
Tony Chrastecky
Keyword(s):  
Sample Preparation ◽  
Failure Analysis ◽  
Cross Section ◽  
Scanning Probe Microscopy ◽  
Preparation Method ◽  
Fault Isolation ◽  
Scanning Probe ◽  
Sample Preparation Method ◽  
Probe Microscopy ◽  
Section Sample

Abstract Visualization of dopant related anomalies in integrated circuits is extremely challenging. Cleaving of the die may not be possible in practical failure analysis situations that require extensive electrical fault isolation, where the failing die can be submitted of scanning probe microscopy analysis in various states such as partially depackaged die, backside thinned die, and so on. In advanced technologies, the circuit orientation in the wafer may not align with preferred crystallographic direction for cleaving the silicon or other substrates. In order to overcome these issues, a focused ion beam lift-out based approach for site-specific cross-section sample preparation is developed in this work. A directional mechanical polishing procedure to produce smooth damage-free surface for junction profiling is also implemented. Two failure analysis applications of the sample preparation method to visualize junction anomalies using scanning microwave microscopy are also discussed.

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