Multilayer thin film thickness determination with variable exit angle ultrasoft x-ray fluorescence spectrometry

1987 ◽  
Vol 10 (7) ◽  
pp. 321-326 ◽  
Author(s):  
T. Scimeca ◽  
G. Andermann
1991 ◽  
Vol 01 (03) ◽  
pp. 259-270 ◽  
Author(s):  
J. MIRANDA ◽  
A. OLIVER ◽  
F.J. RUIZ ◽  
J.M. SANTANA

The resolution of several methods for thin film thickness measurement using PIXE, based on the variation of the proton beam incident energy, is discussed. In order to evaluate the resolution, sputtering of copper films, deposited on aluminum and titanium substrates by argon ions is used. Sputtering yields are obtained through thickness changes, and then compared to other experimental and theoretical values. Good agreement is found, thus confirming the accuracy of PIXE as a method for film thickness determination.


2005 ◽  
Author(s):  
Justin Henrie ◽  
Stephen M. Schultz ◽  
Aaron R. Hawkins

Author(s):  
Fengxia Zhao ◽  
Weixuan Jing ◽  
Zhuangde Jiang ◽  
Haoliang Duan

To overcome the difficulties in the fabrication of nanoscale linewidth standards with lithography, a method of fabricating nanoscale multiple linewidth standards based on multilayer thin film deposition technique is presented in this paper. This method can be implemented easily and does not require the use of complex and expensive techniques, and it has advantage of well-controlled linewidth over various millimetres (using thin film thickness control) and versatile materials selection of the grating lines. Nanoscale multiple linewidth samples with nominal linewidths of 20 nm, 25 nm, 35 nm have been fabricated with the presented method. The lines of the fabricated samples have uniform attributes and good linearity over hundreds microns.


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