Depth profiling of polycrystalline layers under a surface using x-ray diffraction at small glancing angle of incidence

2005 ◽  
Vol 37 (2) ◽  
pp. 190-193 ◽  
Author(s):  
Y. Fujii ◽  
T. Komai ◽  
K. Ikeda
Keyword(s):  
Depth Profiling ◽  
Angle Of Incidence ◽  
X Ray Diffraction ◽  
X Ray ◽  
Glancing Angle

Quantitative Study of Al/W Interaction In Si/SiO2/W-Ti/Al Thin Film System

1988 ◽  
Vol 119 ◽  
Author(s):  
Hung-Yu Liu ◽  
Peng-Heng Chang ◽  
Jim Bohlman ◽  
Hun-Lian Tsai
Keyword(s):  
Thin Film ◽  
Film System ◽  
X Ray Diffraction ◽  
Compound Formation ◽  
X Ray ◽  
Thin Film System ◽  
Glancing Angle ◽  
Integrated Intensity ◽  
Al Thin Film ◽  
Kinetics Of

AbstractThe interaction of Al and W in the Si/SiO2/W-Ti/Al thin film system is studied quantitatively by glancing angle x-ray diffraction. The formation of Al-W compounds due to annealing is monitored by the variation of the integrated intensity from a few x-ray diffraction peaks of the corresponding compounds. The annealing was conducted at 400°C, 450°C and 500°C from 1 hour to 300 hours. The kinetics of compound formation is determined using x-ray diffraction data and verified by TEM observations. We will also show the correlation of the compound formation to the change of the electrical properties of these films.

X-ray Diffraction Studies of Polycrystalline Thin Films Using Glancing Angle Diffractometry

1988 ◽  
Vol 32 ◽  
pp. 311-321 ◽  
Author(s):  
R.A. Larsen ◽  
T.F. McNulty ◽  
R.P. Goehner ◽  
K.R. Crystal
Keyword(s):  
Thin Films ◽  
Deep Penetration ◽  
X Ray Diffraction ◽  
Parallel Beam ◽  
X Ray ◽  
Beam Geometry ◽  
Polycrystalline Thin Films ◽  
Glancing Angle ◽  
Parallel Beam Geometry

AbstractThe use of conventional θ/2θ diffraction methods for the characterization of polycrystalline thin films is not in general a satisfactory technique due to the relatively deep penetration of x-ray photons in most materials. Glancing incidence diffraction (GID) can compensate for the penetration problems inherent in the θ/2θ geometry. Parallel beam geometry has been developed in conjunction with GID to eliminate the focusing aberrations encountered when performing these types of measurements. During the past yearwe developed a parallel beam attachment which we have successfully configured to a number of systems.

High Resolution X-ray Diffraction for the Characterization of Semiconducting Materials

1989 ◽  
Vol 33 ◽  
pp. 1-11 ◽  
Author(s):  
B. K. Tanner
Keyword(s):  
Bragg Peak ◽  
Thin Layers ◽  
X Ray Diffraction ◽  
Semiconducting Materials ◽  
Multiple Reflections ◽  
X Ray ◽  
Analyzer Crystal ◽  
Glancing Angle ◽  
Heteroepitaxial Layers

AbstractUse of a reference crystal to condition the beam in the double-axis diffractometer permits the Bragg peak width to be reduced to the correlation of the two crystal reflecting ranges. Some recent applications of double axis diffractometry to the study of heteroepitaxial layers are discussed. The advantages of multiple reflections for beam conditioning and the four reflection DuMond monochromator are examined. Glancing incidence and exit diffractometry permits the study of very thin layers, down to a few tens of nanometres in thickness and both synchrotron radiation and skew reflections can be used to tune the glancing angle close to the critical angle. Recent applications of triple-axis diffraction, where an analyzer crystal is used after the specimen, to the study of very thin single epitaxial layers and multiquantum well structures are reviewed.

Effect of Cu Content on the Tribological Performance of Cr-N Coatings at High Temperatures (840°C)

2009 ◽  
Author(s):  
Kyriaki Polychronopoulou ◽  
Claus Rebholz ◽  
Nicholaos G. Demas ◽  
Andreas A. Polycarpou ◽  
P. N. Gibson
Keyword(s):  
Vapor Deposition ◽  
Photoelectron Spectroscopy ◽  
Physical Vapor Deposition ◽  
Tribological Performance ◽  
X Ray Diffraction ◽  
X Ray ◽  
Cu Content ◽  
Glancing Angle ◽  
Scanning Electron ◽  
Ball On Disc

Cr-N and Cu-Cr-N coatings with Cu content between 3–65 at.%, Cu/Cr ratios in the 0.04–4.5 range and 21–27 at.% N, synthesized by twin e-beam Physical Vapor Deposition (EBPVD) at 450°C, were investigated. Using X-ray photoelectron spectroscopy (XPS), glancing angle X-ray diffraction (GAXRD) and scanning electron microscopy (SEM), in combination with nanoindentation mechanical property measurements and laboratory controlled ball-on-disc sliding experiments, it is shown that Cu-Cr-N coatings with low Cu content (3 at.%) possess sufficient wear resistance for high temperature demanding tribological applications.

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