P‐11.1: A Device Scheme That Can Automatically Test the Bonding Pressure

2021 ◽  
Vol 52 (S2) ◽  
pp. 959-959
Author(s):  
Qiu Chenglei
Keyword(s):  
Bonding Pressure

Influence of bonding pressure on thermal resistance in reactively-bonded solder joints

2016 ◽  
Vol 55 (6S1) ◽  
pp. 06GP17 ◽  
Author(s):  
Shunsuke Kanetsuki ◽  
Shugo Miyake ◽  
Koichi Kuwahara ◽  
Takahiro Namazu
Keyword(s):  
Thermal Resistance ◽  
Solder Joints ◽  
Bonding Pressure

A multi-pronged approach to low-pressure Cu sintering using surface-modified particles, substrate and chip metallization

2019 ◽  
Vol 2019 (1) ◽  
pp. 000387-000392 ◽  
Author(s):  
Sri Krishna Bhogaraju ◽  
Omid Mokhtari ◽  
Jacopo Pascucci ◽  
Fosca Conti ◽  
Hiren R Kotadia ◽  
...  
Keyword(s):  
High Temperature ◽  
Low Cost ◽  
Surface Modifications ◽  
Low Pressure ◽  
Bonding Pressure ◽  
High Tendency ◽  
Promising Alternative ◽  
Die Attach ◽  
Bandgap Semiconductors ◽  
Surface Modified

Abstract High temperature power electronics based on wide-bandgap semiconductors have prominent applications, such as automotive, aircrafts, space exploration, oil/gas extraction, electricity distribution. Die-attach bonding process is an essential process in the realization of high temperature power devices. Here Cu offers to be a promising alternative to Ag, especially because of thermal and mechanical properties on par with Ag and a cost advantage by being a factor 100 cheaper than Ag. With the aim to achieve a low-pressure Cu sintering process, a low cost wet chemical etching process is developed to selectively etch Zn from brass to create nano-porous surface modifications to enhance sinterability, enabling sintering with low bonding pressure of 1MPa and at temperatures below 300°C. However, high tendency of Cu to oxidize poses a major challenge in realizing stable interconnects. For this purpose, in this contribution, we present the use of polyethylene-glycol 600 as reducing binder in the formulation of the Cu sintering paste. Finally, we propose a multi-pronged approach based on three crucial factors: surface-modified substrates, nanostructured surface modifications on micro-scale Cu-alloy particles and use of a reducing binder in the Cu particle paste.

Effect of Bonding Pressure on Transient Liquid Phase Bonding Joint Microstructure and Properties of T91/12Cr2MoWVTiB

2010 ◽  
Vol 97-101 ◽  
pp. 107-110 ◽  
Author(s):  
Si Jie Chen ◽  
Si Jing Guo ◽  
Feng Liang
Keyword(s):  
Liquid Phase ◽  
Transient Liquid Phase ◽  
Optical Microscope ◽  
Isothermal Solidification ◽  
Transient Liquid Phase Bonding ◽  
Bonded Joints ◽  
Electron Microscopic ◽  
Bonding Pressure ◽  
Scanning Electron Microscopic ◽  
Microscopic Techniques

T91/12Cr2MoWVTiB was bonded by transient liquid phase bonding process with different pressures, one commercial FeNiCrSiB was used as the interlayer. The microstructure and components distribution of the bonded joints were examined by optical microscope and scanning electron microscopic techniques. Furthermore, the properties of the joints were also tested. The results indicate that with the increase of the pressure – from 2 MPa to 6 MPa – the microstructures and mechanical properties were improved, and more similar to those base alloys. A theoretical study also revealed that the isothermal solidification complication time can be shorter, because the maximum liquid width was reduced with the existence of pressure.

Exhibition of veiled features in diffusion bonding of titanium alloy and stainless steel via copper

2017 ◽  
Vol 115 (1) ◽  
pp. 115 ◽  
Author(s):  
Gopinath Thirunavukarasu ◽  
Sukumar Kundu ◽  
Tapas Laha ◽  
Deb Roy ◽  
Subrata Chatterjee
Keyword(s):  
Stainless Steel ◽  
Diffusion Bonding ◽  
Pure Copper ◽  
Bonding Time ◽  
304 Stainless Steel ◽  
Time Interval ◽  
Reaction Products ◽  
Bonding Pressure ◽  
Ternary Intermetallic Compounds ◽  
Cu Foil

An investigation was carried out to know the extent of influence of bonding-time on the interface structure and mechanical properties of diffusion bonding (DB) of TiA|Cu|SS. DB of Ti6Al4V (TiA) and 304 stainless steel (SS) using pure copper (Cu) of 200-μm thickness were processed in vacuum using 4-MPa bonding-pressure at 1123 K from 15 to 120 min in steps of 15 min. Preparation of DB was not possible when bonding-time was less than 60 min as the bonding at Cu|SS interface was unsuccessful in spite of effective bonding at TiA|Cu interface; however, successful DB were produced when the bonding-time was 60 min and beyond. DB processed for 60 and 75 min (classified as shorter bonding-time interval) showed distinctive characteristics (structural, mechanical, and fractural) as compared to the DB processed for 90, 105, and 120 min (classified as longer bonding-time interval). DB processed for 60 and 75 min exhibited layer-wise Cu–Ti-based intermetallics at TiA|Cu interface, whereas Cu|SS interface was completely free from reaction products. The layer-wise structure of Cu–Ti-based intermetallics were not observed at TiA|Cu interface in the DB processed for longer bonding-time; however, the Cu|SS interface had layer-wise ternary intermetallic compounds (T1, T2, and T3) of Cu–Fe–Ti-based along with σ phase depending upon the bonding-time chosen. Diffusivity of Ti-atoms in Cu-layer (DTi in Cu-layer) was much greater than the diffusivity of Fe-atoms in Cu-layer (DFe in Cu-layer). Ti-atoms reached Cu|SS interface but Fe-atoms were unable to reach TiA|Cu interface. It was observed that DB fractured at Cu|SS interface when processed for shorter bonding-time interval, whereas the DB processed for longer bonding-time interval fractured apparently at the middle of Cu-foil region predominantly due to the existence of brittle Cu–Fe–Ti-based intermetallics.

A process analysis for microchannel deformation and bonding strength by in-mold bonding of microfluidic chips

2015 ◽  
Vol 35 (3) ◽  
pp. 267-275 ◽  
Author(s):  
Chunpeng Chu ◽  
Bingyan Jiang ◽  
Laiyu Zhu ◽  
Fengze Jiang
Keyword(s):  
Bonding Strength ◽  
Process Analysis ◽  
Bonding Temperature ◽  
Bonding Time ◽  
Production Cycle ◽  
Microfluidic Chips ◽  
Bonding Pressure ◽  
Bonding Parameters ◽  
Bonding Technology ◽  
Assembly Technology

Abstract A novel combination of thermal bonding and in-mold assembly technology was created to produce microfluidic chips out of polymethylmethacrylate (PMMA), which is named “in-mold bonding technology”. In-mold bonding experiments of microfluidic chips were carried out to investigate the influences of bonding process parameters on the deformation and bonding strength of microchannels. The results show that bonding temperature has the greatest impact on the deformation of microchannels, while bonding pressure and bonding time have more influence on deformation in height than in top width. Considering the bonding strength, the bonding temperature and the bonding pressure have more impact than the bonding time. The time is crucial for the sealing of the chips. By setting the bonding parameters reasonably, the microchannel deformation is <10%, while the bonding strength of the chips is 350 kPa. The production cycle of the chip is reduced to <5 min.

Thermal Interface Materials From Vertically Aligned Polymer Nanotube Arrays

2013 ◽  
Author(s):  
Thomas L. Bougher ◽  
Virendra Singh ◽  
Baratunde A. Cola
Keyword(s):  
Thermal Conductivity ◽  
Amorphous Polymer ◽  
Quartz Substrate ◽  
Applied Pressure ◽  
Thermal Interface Material ◽  
Bonding Pressure ◽  
Thermal Interface ◽  
Vertically Aligned ◽  
Conductive Fillers ◽  
Enhanced Thermal Conductivity

A number of studies have reported enhancing the thermal conductivity of semi-crystalline polymers through mechanical stretching, but practical application of this process has proven difficult. Here we demonstrate the application of enhanced thermal conductivity in a purely amorphous polymer for a thermal interface material (TIM) without conductive fillers. Many polymer-based TIMs contain carbon fillers to enhance the thermal conductivity, however the TIMs reported herein are comprised solely of polymer nanotubes. The conjugated polymer polythiophene (Pth) is electropolymerized in nanotemplates to produce arrays of vertically aligned nanotubes, which adhere well to opposing substrates through van der Waals forces. We find that the total thermal resistances of the Pth-TIMs are a strong function of height with some dependence on bonding pressure, yet independent of applied pressure after bonding. Photoacoustic measurements show that the total thermal resistance of the TIMs ranges from 9.8 ± 3.8 to 155 ± 32 mm2-K/W depending on the array height and bonding pressure. Estimates of the component resistances indicate that the majority of the resistance is in the contact between the nanotube free tips and the opposing quartz substrate. These Pth-TIMs demonstrate that enhanced thermal conductivity polymers can be suitable for heat transfer materials without thermally conductive fillers.

scholarly journals Prediction of Tensile Strength and Deformation of Diffusion Bonding Joint for Inconel 718 Using Deep Neural Network

Metals ◽  
2020 ◽  
Vol 10 (9) ◽  
pp. 1266 ◽  
Author(s):  
Han Mei ◽  
Lihui Lang ◽  
Xiaoxing Li ◽  
Hasnain Ali Mirza ◽  
Xiaoguang Yang
Keyword(s):  
Neural Network ◽  
Tensile Strength ◽  
Diffusion Bonding ◽  
Inconel 718 ◽  
Deep Neural Network ◽  
Bonding Temperature ◽  
Bonding Pressure ◽  
Bonding Performance ◽  
Strength And Deformation ◽  
Deformation Ratio

Due to the acceptable high-temperature deformation resistance of Inconel 718, its welding parameters such as bonding temperature and pressure are inevitably higher than those of general metals. As a result of the existing punitive processing environment, it is essential to control the deformation of parts while ensuring the bonding performance. In this research, diffusion bonding experiments based on the Taguchi method (TM) are conducted, and the uniaxial tensile strength and deformation ratio of the experimental joints are measured. According to experimental data, a deep neural network (DNN) was trained to characterize the nonlinear relationship between the diffusion bonding process parameters and the diffusion bonding strength and deformation ratio, where the overall correlation coefficient came out to be 0.99913. The double-factors analysis of bonding temperature–bonding pressure based on the prediction results of the DNN shows that the temperature increment of the diffusion bonding of Inconel 718 significantly increases the deformation ratio of the diffusion bonding joints. Therefore, during the multi-objective optimization of the bonding performance and deformation of components, priority should be given to optimizing the bonding pressure and duration only.

Comparison of Nickel Nanoparticle-Assisted Diffusion Brazing of Stainless Steel to Conventional Diffusion Brazing and Bonding Processes

2010 ◽  
Vol 132 (3) ◽  
Author(s):  
S. K. Tiwari ◽  
B. K. Paul
Keyword(s):  
Stainless Steel ◽  
Bond Strength ◽  
Diffusion Bonding ◽  
Transient Liquid Phase ◽  
Bond Line ◽  
Scanning Electron Micrographs ◽  
Secondary Phases ◽  
Bonding Pressure ◽  
Nickel Nanoparticle ◽  
Diffusion Brazing

Transient liquid phase diffusion brazing is used in precision, hermetic joining applications as a replacement for diffusion bonding to reduce cycle times, reduce bonding pressure, and improve yields. In the present study, stainless steel 316L laminae are diffusion brazed with an interlayer of nickel nanoparticles and compared with samples joined by conventional diffusion bonding and electroplated nickel-phosphorous diffusion brazing. Comparison is made with regard to microstructural evolution, diffusional profile, and bond strength. All bonding was carried out in a uni-axial vacuum hot press at 1000°C with a heating rate of 10°C/min, a dwell time of 2 h and a bonding pressure of 10 MPa. Bond strength measurements show that the sample brazed with a nickel nanoparticle interlayer has the lowest void fraction at 4.8±0.9% and highest shear strength at 141.3±7.0 MPa. Wavelength dispersive spectroscopic analysis of sample cross-sections shows substantial diffusion of Ni and Fe across the nickel nanoparticle bond line. Scanning electron micrographs show no secondary phases along the nickel nanoparticle bond line.

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