P‐118: Optimization of Folding Process for Flexible Electronic Device

2020 ◽  
Vol 51 (1) ◽  
pp. 1815-1817
Author(s):  
Ko Chin Chung ◽  
Zi Shuo Huang ◽  
Yu Zhi Yu ◽  
Yen Hue Lai ◽  
Wan Tsang Wang
Keyword(s):  
Electronic Device ◽  
Folding Process ◽  
Flexible Electronic ◽  
Flexible Electronic Device

scholarly journals Inorganic islands on a highly stretchable polyimide substrate

2009 ◽  
Vol 24 (11) ◽  
pp. 3338-3342 ◽  
Author(s):  
Jeong-Yun Sun ◽  
Nanshu Lu ◽  
Juil Yoon ◽  
Kyu-Hwan Oh ◽  
Zhigang Suo ◽  
...  
Keyword(s):  
Thin Layer ◽  
Electronic Device ◽  
Large Strain ◽  
Inorganic Materials ◽  
Polymer Substrate ◽  
Polyimide Substrate ◽  
Small Strains ◽  
Flexible Electronic ◽  
Flexible Electronic Device ◽  
Highly Stretchable

For a flexible electronic device integrating inorganic materials on a polymer substrate, the polymer can deform substantially, but the inorganic materials usually fracture at small strains. This paper describes an approach to make such a device highly stretchable. A polyimide substrate is first coated with a thin layer of an elastomer, on top of which SiNx islands are fabricated. When the substrate is stretched to a large strain, the SiNx islands remain intact. Calculations confirm that the elastomer reduces the strain in the SiNx islands by orders of magnitude.

P-92: Encapsulation Adhesive Possessing High Water Barrier and Low Corrosive Properties for Flexible Electronic Device

2014 ◽  
Vol 45 (1) ◽  
pp. 1332-1335 ◽  
Author(s):  
Satoshi Naganawa ◽  
Kenta Nishijima ◽  
Yoshiaki Hagihara ◽  
Yuta Suzuki ◽  
Koichi Nagamoto ◽  
...  
Keyword(s):  
Electronic Device ◽  
High Water ◽  
Water Barrier ◽  
Flexible Electronic ◽  
Flexible Electronic Device

Thermal, Optical, and Film Properties of a Ladder-like Polysilsesquioxane as Flexible Electronic Device Substrates

2012 ◽  
Vol 1436 ◽  
Author(s):  
Albert S. Lee ◽  
Seung-Sock Choi ◽  
He Seung Lee ◽  
Hyeon Yeol Jeon ◽  
Kyung-Youl Baek ◽  
...  
Keyword(s):  
Electronic Device ◽  
Coefficient Of Thermal Expansion ◽  
Glass Fibers ◽  
Free Standing ◽  
Flexible Display ◽  
Excellent Thermal Stability ◽  
Structured Materials ◽  
Treatment Processes ◽  
Flexible Electronic ◽  
Flexible Electronic Device

ABSTRACTA high molecular weight, photocurable inorganic-organic hybrid based on ladder-like poly(phenyl6-co-methacrylate4)silsesquioxanes (LPPMA64) was investigated as a flexible display substrate. Photocured free standing films with 40μm thickness showed high transparency (>95%), excellent thermal stability (Td >450°C), and low coefficient of thermal expansion (38ppm/K) without the use of reinforced glass fibers. Furthermore, these ladder-like structured materials did not require any thermal treatment processes due to the negligible amounts of uncondensed groups, thus simplifying manufacturing processing. These novel hybrid films present an alternative to organic plastics as flexible electronic device substrates due to their excellent optical and thermal properties.

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