scholarly journals Low-temperature plasma for compositional depth profiling of crosslinking organic multilayers: comparison with C60and giant argon gas cluster sources

2014 ◽  
Vol 28 (18) ◽  
pp. 1971-1978 ◽  
Author(s):  
Shin Muramoto ◽  
Derk Rading ◽  
Brian Bush ◽  
Greg Gillen ◽  
David G. Castner
Keyword(s):  
Low Temperature ◽  
Depth Profiling ◽  
Low Temperature Plasma ◽  
Temperature Plasma ◽  
Argon Gas ◽  
Compositional Depth Profiling

scholarly journals Depth Profile Analysis of the Modified Layer of Poly(vinyltrimethylsilane) Films Treated by Direct-Current Discharge

Coatings ◽  
2021 ◽  
Vol 11 (11) ◽  
pp. 1317
Author(s):  
Mikhail Piskarev ◽  
Elena Skryleva ◽  
Alla Gilman ◽  
Boris Senatulin ◽  
Alexander Zinoviev ◽  
...  
Keyword(s):  
Low Temperature ◽  
Profile Analysis ◽  
Membrane Surface ◽  
Etching Rate ◽  
Subsurface Layer ◽  
Depth Profiling ◽  
Low Temperature Plasma ◽  
Temperature Plasma ◽  
Dc Discharge ◽  
Before And After

Previously, we found that modification of the membrane surface from polyvinyltrimethylsilane (PVTMS) by treatment with low-temperature plasma induced by low pressure DC discharge leads to a significant increase in gas separation characteristics. To understand the mechanism of this phenomenon, in this article XPS combined with precision etching 10 keV beam of Ar2500+ clusters was used for depth profiling of PVTMS spin-coated films before and after DC discharge treatment. The etching craters depths were measured by stylus surface profiler. The average etching rate of the untreated PVTMS film by Ar2500+ clusters was defined (230 nm/min). It was found that the low temperature plasma treatment of PVTMS leads to a sharp increase in the oxygen concentration on a surface with a simultaneous decrease in the carbon content. The experimental data obtained indicate also that the treatment of PVTMS film by plasma leads not only to a change in the chemical structure of the surface, but also to the formation of a gradient subsurface layer with a thickness of about 50 nm.

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