Tunable PMA and Interfacial Microstructure Induced by a Hf(HfO 2 ) Interfacial Spacer in MTJs with Two MgO Layers

2019 ◽  
Vol 216 (16) ◽  
pp. 1900089
Author(s):  
Minghua Li ◽  
Shuanghai Wang ◽  
Shijie Zhang ◽  
Shuai Fang ◽  
Xingzhong Cao ◽  
...  
Keyword(s):  
Interfacial Microstructure ◽  
Mgo Layers

EXPLOSIVE CLADDING OF ALUMINIUM 5052-STAINLESS STEEL 304

2019 ◽  
Vol 14 (3) ◽  
Author(s):  
Saravanan S ◽  
Murugan G
Keyword(s):  
Stainless Steel ◽  
Interfacial Microstructure ◽  
Bend Angle ◽  
Flyer Plate ◽  
Layer Formation ◽  
Molten Layer ◽  
Explosive Cladding ◽  
Plate Velocity ◽  
Stainless Steel 304 ◽  
Loading Ratio

This study addresses the effect of process parameters viz., loading ratio (mass of explosive/mass of flyer plate) and preset angle on dynamic bend angle, collision velocity and flyer plate velocity in dissimilar explosive cladding. In addition, the variation in interfacial microstructure and mechanical strength of aluminium 5052-stainless steel 304 explosive clads is reported. The interface exhibits a characteristic undulating interface with a continuous molten layer formation. The interfacial amplitude increases with the loading ratio and preset angle. Maximum hardness is observed at regions closer to the interface

Interfacial Microstructure Evolution of Copper/Aluminium Laminates with Different Annealing Processes

2011 ◽  
Vol 239-242 ◽  
pp. 2976-2980 ◽  
Author(s):  
Ying Hui Zhang ◽  
Jing Qin ◽  
Hong Jin Zhao ◽  
Gao Lei Xu
Keyword(s):  
Intermetallic Compounds ◽  
Incubation Period ◽  
Microstructure Evolution ◽  
Diffusion Zone ◽  
Interfacial Microstructure ◽  
Combination Process ◽  
Local Areas

The interfacial microstructure evolution of copper/aluminium laminates with different annealing processes was studied. It was found that the formation and growth of intermetallic compounds in the interface during metallurgical combination process have four stages: the incubation period, the formation of island-like new phases in local areas, the transverse-lengthwise-transverse growth of diffusion zone, the formation of new intermetallic compounds and thickening of diffusion zone.

Dissimilar Metal Welding of Steel to Al-Mg Alloy by Spot Resistance Welding

2006 ◽  
Vol 15-17 ◽  
pp. 381-386 ◽  
Author(s):  
I.H. Hwang ◽  
Takehiko Watanabe ◽  
Y. Doi
Keyword(s):  
Intermetallic Compound ◽  
Base Metal ◽  
Joint Strength ◽  
Pure Aluminum ◽  
Compound Layer ◽  
Interfacial Microstructure ◽  
Mg Alloy ◽  
Intermetallic Compound Layer ◽  
Commercially Pure ◽  
Insert Metal

We tried to join steel to Al-Mg alloy using a resistance spot welding method. The effect of Mg in Al-Mg alloy on the strength and the interfacial microstructure of the joint was investigated. Additionally, the effect of insert metal of commercially pure aluminum, which was put into the bonding interface, on the joint strength was examined. The obtained results were as follows. The cross-tensile strength of a joint between SS400 steel and commercially pure aluminum (SS400/Al) was high and fracture occurred in the aluminum base metal. However, the strength of a joint between SS400 and Al-Mg alloy was remarkably low and less than 30% of that of the SS400/Al joint. An intermetallic compound layer developed so thickly at the bonded interface of the SS400/Al-Mg alloy joint that the joint strength decreased. The intermetallic compound layer developed more thickly as Mg content in the Al-Mg alloy increased. Using insert metal of commercially pure aluminum containing little Mg successfully improved the strength of the SS400/Al-Mg alloy joint and the strength was equivalent to that of the base metal.

Interfacial Microstructure Evolution of (B, Al)N Films Grown on Diamond Substrates

2011 ◽  
Vol 519 (13) ◽  
pp. 4212-4215 ◽  
Author(s):  
Jen-Hao Song ◽  
Jow-Lay Huang ◽  
James C. Sung ◽  
Sheng-Chang Wang ◽  
Horng-Hwa Lu ◽  
...  
Keyword(s):  
Microstructure Evolution ◽  
Interfacial Microstructure

Creep Properties and Interfacial Microstructure of SiC Whisker Reinforced Si3N4

1989 ◽  
Vol 170 ◽  
Author(s):  
Håkan A. Swan ◽  
Colette O'meara
Keyword(s):  
High Temperature ◽  
Creep Resistance ◽  
Interfacial Microstructure ◽  
Deformation Mechanisms ◽  
Amorphous Films ◽  
Creep Tests ◽  
Creep Properties ◽  
High Temperature Exposure ◽  
Temperature Exposure

AbstractPreliminary creep tests were performed on SiC whisker reinforced and matrix Si3N4 material fabricated by the NPS technique. The material was extensively crystallised in the as received material, leaving only thin amorphous films surrounding the grains. No improvement in the creep resistance could be detected for the whisker reinforced material. The deformation mechanisms were found to be that of cavitation in the form of microcracks, predominantly at the whisker/matrix interfaces, and the formation of larger cracks. Extensive oxidation of the samples, as a result of high temperature exposure to air, was observed for the materials tested at 1375°C.

Sign in / Sign up

Export Citation Format

Share Document