Plasma polymerization. IV. A systematic investigation of the inductively coupled RF plasma polymerization of pentafluorobenzene.

1981 ◽  
Vol 19 (9) ◽  
pp. 2129-2149 ◽  
Author(s):  
D. T. Clark ◽  
M. Z. Abrahman
Keyword(s):  
Plasma Polymerization ◽  
Systematic Investigation ◽  
Rf Plasma ◽  
Inductively Coupled

A two‐temperature model of the inductively coupled rf plasma

1987 ◽  
Vol 61 (5) ◽  
pp. 1753-1760 ◽  
Author(s):  
Javad Mostaghimi ◽  
Pierre Proulx ◽  
Maher I. Boulos
Keyword(s):  
Rf Plasma ◽  
Temperature Model ◽  
Inductively Coupled ◽  
Two Temperature

Plasma Surface Modification of Silica and its Application in Epoxy Molding Compounds for Large-Scale Integrated Circuits Packaging

2010 ◽  
Vol 158 ◽  
pp. 184-188 ◽  
Author(s):  
Ming Shan Yang ◽  
Lin Kai Li ◽  
Jian Guo Zhang
Keyword(s):  
Surface Modification ◽  
Acrylic Acid ◽  
Integrated Circuits ◽  
Plasma Polymerization ◽  
High Speed ◽  
Large Scale ◽  
Treatment Time ◽  
Rf Plasma ◽  
Formaldehyde Resin ◽  
Molding Compounds

The surface modification of silica for epoxy molding compounds (EMC) was conducted by plasma polymerization using RF plasma (13.56MPa), and the modification factors such as plasma power, gas pressure and treatment time were investigated systematically in this paper. The monomers utilized for the plasma polymer coatings were pyrrole, 1,3-diaminopropane, acrylic acid and urea. The plasma polymerization coating of silica was characterized by FTIR, contact angle. Using the silica treated by plasma as filler, ortho-cresol novolac epoxy as main resin, novolac phenolic-formaldehyde resin as cross-linking agent and 2-methylmizole as curing accelerating agent, the EMCs used for the packaging of large-scale integrated circuits were prepared by high-speed pre-mixture and twin roller mixing technology. The results have shown that the surface of silica can be coated by plasma polymerization of pyrrole, 1,3-diaminopropane, acrylic acid and urea, and the comprehensive properties of EMC were improved.

Suspension Plasma Spraying (SPS) of Cobalt Spinel

1997 ◽  
Author(s):  
G. Schiller ◽  
M. Müller ◽  
F. Gitzhofer ◽  
M.I. Boulos ◽  
R.B. Heimann
Keyword(s):  
Plasma Spraying ◽  
Inductively Coupled Plasma ◽  
Solid Phase ◽  
Spinel Phase ◽  
Rf Plasma ◽  
Dry Powders ◽  
Inductively Coupled ◽  
Cobalt Spinel ◽  
Chemical Conditions ◽  
Physical And Chemical

Abstract Fine (median size 6 μm and 0.3 μm) cobalt spinel (Co3O4) powders were processed suspended in a suitable liquid phase. Suspensions exceeding 50 wt.% solid phase content were successfully injected into an inductively coupled plasma. Spheroidized powders with large particle size (up to 80 μm) were prepared, and cobalt oxide coatings were produced by this novel RF-SPS method. The microstructural features of the coatings can be controlled by parameter optimization similarly to plasma spraying of dry powders. Numerous variations of the physical and chemical conditions of the process were performed in an attempt to overcome the main disadvantage of the process, i.e. the decomposition of the spinel phase to CoO. So far, the spinel phase could be reestablished only by a post-treatment of the deposited coatings with atomic oxygen in the RF plasma.

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