Analysis of epoxy resin curing kinetics using the Avrami theory of phase change

1987 ◽  
Vol 27 (11) ◽  
pp. 829-836 ◽  
Author(s):  
M. Pollard ◽  
J. L. Kardos
Keyword(s):  
Phase Change ◽  
Epoxy Resin ◽  
Curing Kinetics ◽  
Resin Curing

Study on the Preparation of 2-Phenyl Imidazole Microcapsule and its Effect on Curing Epoxy Resin

2013 ◽  
Vol 690-693 ◽  
pp. 1649-1652
Author(s):  
Ai Jie Ma ◽  
Qiu Yu Zhang ◽  
You Qiang Shi
Keyword(s):  
Epoxy Resin ◽  
Raw Materials ◽  
Curing Kinetics ◽  
Curing Temperature ◽  
Curing Agent ◽  
Thermal Analyzer ◽  
Epoxy Resin System ◽  
Curing Kinetic ◽  
Resin Curing ◽  
Micro Morphology

In this paper, 2-phenyl imidazole (2-PZ) microcapsule-type curing agent of epoxy resin were prepared through solvent volatilization with 2-PZ and polymethyl acrylic glycidyl ester (PGMA) as the raw materials. The micro-morphology, shape and structure of the microcapsules were studied by scanning electronic microscope (SEM) and fourier transform infrared spectrum (FT-IR). The curing kinetics of microcapsule curing agent/epoxy resin E-44 curing system were studied using TGA/DSC simultaneous thermal analyzer. Results showed that the preparation method is simple and effective and the prepared 2-PZ microcapsules have smooth surfaces and monodisperse size. And the curing kinetic study of epoxy resin system suggested epoxy resin curing temperature was rising with the increase of heating rate.

Synthesis of Two Novolac Type Epoxy Resin Curing Agents and their Application

2013 ◽  
Vol 634-638 ◽  
pp. 3008-3016
Author(s):  
Yan Li ◽  
Zhi Nan Zhou ◽  
Xiao Yan Xu ◽  
Long Xie
Keyword(s):  
Mechanical Properties ◽  
Bisphenol A ◽  
Epoxy Resin ◽  
Curing Kinetics ◽  
Mass Ratio ◽  
Scanning Calorimetry ◽  
Curing Reaction ◽  
Novolac Resins ◽  
Curing Agents ◽  
Resin Curing

Two Novolac Resins Were Synthesized by the Reaction between Bisphenol A and Benzaldehyde (bis-BENR) or Bisphenol A and P-hydroxybenzaldehyde (bis-PHNR). Fourier Transform Infrared Spectroscopy (FTIR) and Nuclear Magnetic Resonance (NMR) Were Applied to Characterize the Molecular Structure of Bis-BENR (or Bis-PHNR). then the Two Novolac Resins Were Used as Curing Agent for Bisphenol A Type Epoxy Resin (DGEBA). the Curing Reaction and Curing Kinetics Were Studied by Dynamic FTIR and Differential Scanning Calorimetry (DSC). Dynamic FTIR Showed that the Two Novolac Resins Reacted with Epoxy Resins and Formed a Crosslinking Network Structure. DSC Results Show that the Optimum Mass Ratio between DGEBA and Bis-BENR (or Bis-PHNR) Was 7:3, under which the Curing Reaction Processed Completely. the Mechanical Properties and Sulfide Resistance of DGEBA/bis-BENR (or Bis-PHNR) System Were Also Investigated. the Results Showed that when the Mass Ratio between DGEBA and Bis-BENR (or Bis-PHNR) Was 7:3, the Curing Coatings Had Optimum Mechanical Properties and Sulfide Resistance.

scholarly journals Electrical Resistance Sensing of Epoxy Curing Using an Embedded Carbon Nanotube Yarn

Sensors ◽  
2020 ◽  
Vol 20 (11) ◽  
pp. 3230 ◽  
Author(s):  
Omar Rodríguez-Uicab ◽  
Jandro L. Abot ◽  
Francis Avilés
Keyword(s):  
Carbon Nanotube ◽  
Epoxy Resin ◽  
Electrical Resistance ◽  
Electrical Response ◽  
Curing Kinetics ◽  
Curing Temperature ◽  
Polymerization Process ◽  
Curing Agent ◽  
Resin Curing ◽  
Over Time

Curing effects were investigated by using the electrical response of a single carbon nanotube yarn (CNTY) embedded in an epoxy resin during the polymerization process. Two epoxy resins of different viscosities and curing temperatures were investigated, varying also the concentration of the curing agent. It is shown that the kinetics of resin curing can be followed by using the electrical response of an individual CNTY embedded in the resin. The electrical resistance of an embedded CNTY increased (~9%) after resin curing for an epoxy resin cured at 130 °C with viscosity of ~59 cP at the pouring/curing temperature (“Epon 862”), while it decreased (~ −9%) for a different epoxy cured at 60 °C, whose viscosity is about double at the corresponding curing temperature. Lowering the curing temperature from 60 °C to room temperature caused slower and smoother changes of electrical resistance over time and smaller (positive) residual resistance. Increasing the concentration of the curing agent caused a faster curing kinetics and, consequently, more abrupt changes of electrical resistance over time, with negative residual electrical resistance. Therefore, the resin viscosity and curing kinetics play a paramount role in the CNTY wicking, wetting and resin infiltration processes, which ultimately govern the electrical response of the CNTY immersed into epoxy.

scholarly journals Thermophysical Properties of Multifunctional Syntactic Foams Containing Phase Change Microcapsules for Thermal Energy Storage

Polymers ◽  
2021 ◽  
Vol 13 (11) ◽  
pp. 1790
Author(s):  
Francesco Galvagnini ◽  
Andrea Dorigato ◽  
Luca Fambri ◽  
Giulia Fredi ◽  
Alessandro Pegoretti
Keyword(s):  
Thermal Conductivity ◽  
Energy Storage ◽  
Phase Change ◽  
Epoxy Resin ◽  
Storage Modulus ◽  
Thermal Energy ◽  
Thermal Energy Storage ◽  
Neat Epoxy ◽  
Low Density ◽  
Syntactic Foams

Syntactic foams (SFs) combining an epoxy resin and hollow glass microspheres (HGM) feature a unique combination of low density, high mechanical properties, and low thermal conductivity which can be tuned according to specific applications. In this work, the versatility of epoxy/HGM SFs was further expanded by adding a microencapsulated phase change material (PCM) providing thermal energy storage (TES) ability at a phase change temperature of 43 °C. At this aim, fifteen epoxy (HGM/PCM) compositions with a total filler content (HGM + PCM) of up to 40 vol% were prepared and characterized. The experimental results were fitted with statistical models, which resulted in ternary diagrams that visually represented the properties of the ternary systems and simplified trend identification. Dynamic rheological tests showed that the PCM increased the viscosity of the epoxy resin more than HGM due to the smaller average size (20 µm vs. 60 µm) and that the systems containing both HGM and PCM showed lower viscosity than those containing only one filler type, due to the higher packing efficiency of bimodal filler distributions. HGM strongly reduced the gravimetric density and the thermal insulation properties. In fact, the sample with 40 vol% of HGM showed a density of 0.735 g/cm3 (−35% than neat epoxy) and a thermal conductivity of 0.12 W/(m∙K) (−40% than neat epoxy). Moreover, the increase in the PCM content increased the specific phase change enthalpy, which was up to 68 J/g for the sample with 40 vol% of PCM, with a consequent improvement in the thermal management ability that was also evidenced by temperature profiling tests in transient heating and cooling regimes. Finally, dynamical mechanical thermal analysis (DMTA) showed that both fillers decreased the storage modulus but generally increased the storage modulus normalized by density (E′/ρ) up to 2440 MPa/(g/cm3) at 25 °C with 40 vol% of HGM (+48% than neat epoxy). These results confirmed that the main asset of these ternary multifunctional syntactic foams is their versatility, as the composition can be tuned to reach the property set that best matches the application requirements in terms of TES ability, thermal insulation, and low density.

Curing kinetics of epoxy resin using epoxidized cardanol as diluent with/without fortifier

1988 ◽  
Vol 129 (2) ◽  
pp. 277-284 ◽  
Author(s):  
M.B. Patel ◽  
R.G. Patel ◽  
V.S. Patel
Keyword(s):  
Epoxy Resin ◽  
Curing Kinetics ◽  
Kinetics Of

scholarly journals A novel microwave combined ultraviolet radiator based on slotted coaxial line for epoxy resin curing

AIP Advances ◽  
2018 ◽  
Vol 8 (11) ◽  
pp. 115021
Author(s):  
Ying Wu ◽  
Tian Xie ◽  
Wei Xiao ◽  
Wen Cong Zhang ◽  
Wei Quan Ma ◽  
...  
Keyword(s):  
Epoxy Resin ◽  
Coaxial Line ◽  
Resin Curing
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