Novel macromolecular epoxy resin curing agent containing biphenyl and maleimide moieties: Preparation, curing kinetics, and thermal properties of its cured polymer

2011 ◽  
Vol 125 (1) ◽  
pp. 104-113 ◽  
Author(s):  
Fei Guo ◽  
Xin-Nian Xia ◽  
Yuan-Qin Xiong ◽  
Jia Liu ◽  
Wei-Jian Xu
Keyword(s):  
Thermal Properties ◽  
Epoxy Resin ◽  
Curing Kinetics ◽  
Curing Agent ◽  
Resin Curing

Studies on Mechanical and Thermal Properties of Epoxy Resin Modified by Fluorine-Containing Silicone

2013 ◽  
Vol 401-403 ◽  
pp. 713-716
Author(s):  
Cheng Fang ◽  
Dong Bo Guan ◽  
Wei Guo Yao ◽  
Shou Jun Wang ◽  
Hui An
Keyword(s):  
Glass Transition ◽  
Thermal Properties ◽  
Epoxy Resin ◽  
Bending Strength ◽  
Mechanical And Thermal Properties ◽  
Curing Agent ◽  
Epoxy System ◽  
Resin Curing ◽  
The Impact ◽  
Modified Epoxy

The epoxy resin was modified with the mixture of α,ω-dihydroxy poly-(3,3,3-trifluoropropyl) siloxane (PTFPMS), KH560 and stannous octoate. KH560 can react with PTFPMS and also epoxy resin curing agent. The two reactions were characterized by FI-IR. The modified epoxy resin was characterized by FI-IR. The result showed that fluorine-containing silicone had been successfully introduced into the epoxy system. The mechanical and thermal properties of the modified epoxy resin were analyzed. The results showed that with the increase of PTFPMS the impact strength of epoxy resin increased, hardness and bending strength correspondingly reduced, slight decrease in the glass transition temperature.

Study on the Preparation of 2-Phenyl Imidazole Microcapsule and its Effect on Curing Epoxy Resin

2013 ◽  
Vol 690-693 ◽  
pp. 1649-1652
Author(s):  
Ai Jie Ma ◽  
Qiu Yu Zhang ◽  
You Qiang Shi
Keyword(s):  
Epoxy Resin ◽  
Raw Materials ◽  
Curing Kinetics ◽  
Curing Temperature ◽  
Curing Agent ◽  
Thermal Analyzer ◽  
Epoxy Resin System ◽  
Curing Kinetic ◽  
Resin Curing ◽  
Micro Morphology

In this paper, 2-phenyl imidazole (2-PZ) microcapsule-type curing agent of epoxy resin were prepared through solvent volatilization with 2-PZ and polymethyl acrylic glycidyl ester (PGMA) as the raw materials. The micro-morphology, shape and structure of the microcapsules were studied by scanning electronic microscope (SEM) and fourier transform infrared spectrum (FT-IR). The curing kinetics of microcapsule curing agent/epoxy resin E-44 curing system were studied using TGA/DSC simultaneous thermal analyzer. Results showed that the preparation method is simple and effective and the prepared 2-PZ microcapsules have smooth surfaces and monodisperse size. And the curing kinetic study of epoxy resin system suggested epoxy resin curing temperature was rising with the increase of heating rate.

scholarly journals Electrical Resistance Sensing of Epoxy Curing Using an Embedded Carbon Nanotube Yarn

Sensors ◽  
2020 ◽  
Vol 20 (11) ◽  
pp. 3230 ◽  
Author(s):  
Omar Rodríguez-Uicab ◽  
Jandro L. Abot ◽  
Francis Avilés
Keyword(s):  
Carbon Nanotube ◽  
Epoxy Resin ◽  
Electrical Resistance ◽  
Electrical Response ◽  
Curing Kinetics ◽  
Curing Temperature ◽  
Polymerization Process ◽  
Curing Agent ◽  
Resin Curing ◽  
Over Time

Curing effects were investigated by using the electrical response of a single carbon nanotube yarn (CNTY) embedded in an epoxy resin during the polymerization process. Two epoxy resins of different viscosities and curing temperatures were investigated, varying also the concentration of the curing agent. It is shown that the kinetics of resin curing can be followed by using the electrical response of an individual CNTY embedded in the resin. The electrical resistance of an embedded CNTY increased (~9%) after resin curing for an epoxy resin cured at 130 °C with viscosity of ~59 cP at the pouring/curing temperature (“Epon 862”), while it decreased (~ −9%) for a different epoxy cured at 60 °C, whose viscosity is about double at the corresponding curing temperature. Lowering the curing temperature from 60 °C to room temperature caused slower and smoother changes of electrical resistance over time and smaller (positive) residual resistance. Increasing the concentration of the curing agent caused a faster curing kinetics and, consequently, more abrupt changes of electrical resistance over time, with negative residual electrical resistance. Therefore, the resin viscosity and curing kinetics play a paramount role in the CNTY wicking, wetting and resin infiltration processes, which ultimately govern the electrical response of the CNTY immersed into epoxy.

HIGH TECHNIQUE FOR T-PEEL STRENGTH ENHANCEMENT OF Al/AFRP HYBRID COMPOSITE

2006 ◽  
Vol 20 (25n27) ◽  
pp. 4273-4278
Author(s):  
CHEOL-WOONG KIM ◽  
DONG-JOON OH
Keyword(s):  
Tensile Strength ◽  
Epoxy Resin ◽  
Hybrid Composite ◽  
Equivalence Ratio ◽  
Peel Strength ◽  
Aramid Fiber ◽  
Curing Agent ◽  
Mixture Ratio ◽  
Resin Mixture ◽  
Resin Curing

The interlaminar peel strength of Al / AFRP (Aluminum alloy/Aramid Fiber Reinforced Plastic) hybrid composite is affected by the adhesive strength between the Al alloy layer and the aramid fiber layer. The study of the tensile strength and the T-peel strength of the Al / AFRP should be accomplished first. Therefore, this study focused on the effect of the resin mixture ratio as the Al / AFRP on the tensile strength and T-peel strength. In conclusions, the resin mixture ratio by equivalence ratio of 〈epoxy resin : curing agent〉 equal to 〈1:1〉 of Al / AFRP -I and the resin mixture ratio by equivalence ratio of 〈epoxy resin : curing agent : accelerator〉 equal to 〈1:1:0.2〉 of Al / AFRP -II showed the highest ultimate tensile strength. After the T-peel test, it is found that the T-peel strength of Al / AFRP -II is approximately 1.5 times higher than that of Al / AFRP -I. Reviewing the characteristics of the tensile and T-peel strengths, the resin mixture ratio 〈1:1:0.2〉 of Al / AFRP -II showed the highest tensile strength and T-peel strength.

Thermal properties and non-isothermal curing kinetics of carbon nanotubes/ionic liquid/epoxy resin systems

2015 ◽  
Vol 618 ◽  
pp. 18-25 ◽  
Author(s):  
Xiangyun Zheng ◽  
Daoke Li ◽  
Chuanyi Feng ◽  
Xiaoting Chen
Keyword(s):  
Carbon Nanotubes ◽  
Ionic Liquid ◽  
Thermal Properties ◽  
Epoxy Resin ◽  
Curing Kinetics ◽  
Kinetics Of

Preparation of waterborne P-N containing epoxy resin curing and its performances

2016 ◽  
Vol 45 (5) ◽  
pp. 308-312 ◽  
Author(s):  
Wei Li ◽  
Guilong Xu ◽  
Buqin Xu ◽  
Yi Wang ◽  
Jin Yang ◽  
...  
Keyword(s):  
Flame Retardant ◽  
Epoxy Resin ◽  
Flame Retardancy ◽  
Curing Agent ◽  
Flame Resistance ◽  
Pencil Hardness ◽  
Content Type ◽  
Coating Industry ◽  
Epoxy Curing ◽  
Resin Curing

Purpose The flammability of epoxy resin is a major disadvantage in applications that require flame resistance. Epoxy monomers and hardeners containing flame-retardant elements are molecularly incorporated in the resin network are expected to exhibit better flame resistance than those borne on an additive approach. In recent years, because of health and environmental regulation, the use of waterborne coatings has received many attentions. However, waterborne epoxy resin curing agent with excellent flame retardancy has been seldom reported. The paper aims to study the preparation of waterborne P-N-containing epoxy resin curing agent and its performances (P-N – phosphorous and nitrogen). Design/methodology/approach Waterborne P-N-containing epoxy curing agent was prepared in this study using reactive flame retardant 10-(2,5-dihydroxyphenyl)-9,10-dihydro-9-xa-10-phosphaphenanthrene-10-oxide, liquid epoxy resin, triethylenetetramine and butyl glycidyl ether at the mole ratio of 1.0:2.0:2.0:2.0. Findings The results show that the epoxy thermoset from the prepared P-N-containing curing agent presents good flame retardancy and can pass the V-1 rating, and the cured epoxy thermoset film presents excellent performances such as water resistance, adhesion, impact resistance and pencil hardness. This study provides useful suggestions for the application of the water-borne flame retardancy epoxy resins in coating industry. Research limitations/implications Each step of products during the preparation of waterborne P-N-containing epoxy curing agent cannot be accurately tested. Originality/value This method for synthesis of waterborne P-N-containing epoxy curing agent is novel and could be used for various applications in epoxy coating industry.

scholarly journals Synthesis, Thermal Properties and Curing Kinetics of Hyperbranched BPA/PEG Epoxy Resin

Polymers ◽  
2019 ◽  
Vol 11 (10) ◽  
pp. 1545 ◽  
Author(s):  
Tossapol Boonlert-uthai ◽  
Chavakorn Samthong ◽  
Anongnat Somwangthanaroj
Keyword(s):  
Activation Energy ◽  
Thermal Properties ◽  
Epoxy Resin ◽  
Epoxy Group ◽  
Dendritic Structure ◽  
Curing Kinetics ◽  
Degree Of Branching ◽  
Curing Behavior ◽  
Branching Point ◽  
High Degree

The hyperbranched epoxy resins (HBE) composed of bisphenol A (BPA) and polyethylene glycol (PEG) as reactants and pentaerythritol as branching point were successfully synthesized via A2 + B4 polycondensation reaction at various BPA/PEG ratios. The 13C NMR spectra revealed that the synthesized HBE mainly had a dendritic structure as confirmed by the high degree of branching (DB). The addition of PEG in the resin enhanced degree of branching (DB) (from 0.82 to 0.90), epoxy equivalent weight (EEW) (from 697 g eq−1 to 468 g eq−1) as well as curing reaction. Adding 5–10 wt.% PEG in the resin decreased the onset and peak curing temperatures and glass transition temperature; however, adding 15 wt.% PEG in the resin have increased these thermal properties due to the lowest EEW. The curing kinetics were evaluated by fitting the experimental data of the curing behavior of all resins with the Šesták–Berggren equation. The activation energy increased with the increase of PEG in the resins due to HBE’s steric hindrance, whereas the activation energy of HBE15P decreased due to a large amount of equivalent active epoxy group per mass sample. The curing behavior and thermal properties of obtained hyperbranched BPA/PEG epoxy resin would be suitable for using in electronics application.

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