Optimizations of polyester degradation process of waste copper wire for the application of Cu recycling

2013 ◽  
Vol 54 (3) ◽  
pp. 607-615 ◽  
Author(s):  
Md. Mominul Haque ◽  
Hyungsub Kim ◽  
Man-Sik Kong ◽  
Hyun-Sun Hong ◽  
Caroline Sunyong Lee
Keyword(s):  
Copper Wire ◽  
Degradation Process ◽  
Polyester Degradation

Scanning and Transmission Electron Microscopy of Endomentrium in Women Wearing TCu-380-A IUD 's

1977 ◽  
Vol 35 ◽  
pp. 666-667
Author(s):  
A. Gonzalez Angulo ◽  
R. Berlioz ◽  
R. Aznar
Keyword(s):  
Copper Wire ◽  
Uterine Cavity ◽  
Morphological Evidence ◽  
Secretory Phase ◽  
Ultrastructural Studies ◽  
Proliferative Phase ◽  
Contraceptive Devices ◽  
Transmission Electron ◽  
Intrauterine Contraceptive ◽  
Myelin Figure

Recent ultrastructural studies on endometrial tissues from women wearing copper, wire intrauterine devices have disclosed morphological evidence of impaired glycogen degradation and secretion resulting in interference with the viability of blastocysts. Reduced microapocrine secretion observed with the scanning electron microscope supports this (1). In addition, organelle modifications have been observed in the epithelial cells of these women. The changes are seen in biopsies taken in the proliferative phase of the cycle and consist of mitochondrial vacuolation and myelin figure formation. These modifications disappear in the secretory phase and therefore have been regarded as reversible (2).The aim of the present studies was to investigate surface epithelial changes as well as organelle modifications in relation to the site of contact with an IUD that releases greater amounts of copper. Endometrial tissue was obtained from the uterine cavity of four young women wearing TCu-380-A intrauterine contraceptive devices for 4-6 weeks.

Techniques For The Preparation of Tissue Samples Containing Injectable Polymer Microcapsules

1985 ◽  
Vol 43 ◽  
pp. 710-711
Author(s):  
G.E. Visscher ◽  
R. L. Robison ◽  
G. J. Argentieri
Keyword(s):  
Drug Delivery ◽  
Drug Delivery Systems ◽  
Gastrocnemius Muscle ◽  
Degradation Process ◽  
Delivery Systems ◽  
Tissue Reaction ◽  
Electron Microscopic ◽  
Tissue Samples ◽  
Injectable Polymer ◽  
Microscopic Techniques

The use of various bioerodable polymers as drug delivery systems has gained considerable interest in recent years. Among some of the shapes used as delivery systems are films, rods and microcapsules. The work presented here will deal with the techniques we have utilized for the analysis of the tissue reaction to and actual biodegradation of injectable microcapsules. This work has utilized light microscopic (LM), transmission (TEM) and scanning (SEM) electron microscopic techniques. The design of our studies has utilized methodology that would; 1. best characterize the actual degradation process without artifacts introduced by fixation procedures and 2. allow for reproducible results.In our studies, the gastrocnemius muscle of the rat was chosen as the injection site. Prior to the injection of microcapsules the skin above the sites was shaved and tattooed for later recognition and recovery. 1.0 cc syringes were loaded with the desired quantity of microcapsules and the vehicle (0.5% hydroxypropylmethycellulose) drawn up. The syringes were agitated to suspend the microcapsules in the injection vehicle.

Reduction of AC Copper Loss in Rectangular Copper Wire using Magnetic Path Control Technology

2020 ◽  
Vol 140 (7) ◽  
pp. 364-371
Author(s):  
Kenta Torishima ◽  
Kazuhiro Shimura ◽  
Mitsuhide Sato ◽  
Tsutomu Mizuno
Keyword(s):  
Copper Wire ◽  
Control Technology ◽  
Copper Loss ◽  
Path Control

Failure Analysis on Power Trench MOSFET Devices with Copper Wire Bonds

2011 ◽  
Author(s):  
Huixian Wu ◽  
Arthur Chiang ◽  
David Le ◽  
Win Pratchayakun
Keyword(s):  
Failure Analysis ◽  
Copper Wire ◽  
New Technology ◽  
Analytical Techniques ◽  
Wire Bonding ◽  
Bonding Process ◽  
Wire Bonds ◽  
Copper Wire Bonding ◽  
Wet Chemical ◽  
Microelectronic Components

Abstract With gold prices steadily going up in recent years, copper wire has gained popularity as a means to reduce cost of manufacturing microelectronic components. Performance tradeoff aside, there is an urgent need to thoroughly study the new technology to allay any fear of reliability compromise. Evaluation and optimization of copper wire bonding process is critical. In this paper, novel failure analysis and analytical techniques are applied to the evaluation of copper wire bonding process. Several FA/analytical techniques and FA procedures will be discussed in detail, including novel laser/chemical/plasma decapsulation, FIB, wet chemical etching, reactive ion etching (RIE), cross-section, CSAM, SEM, EDS, and a combination of these techniques. Two case studies will be given to demonstrate the use of these techniques in copper wire bonded devices.

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