Property modification of bulk molding compounds for use in injection molding

1988 ◽  
Vol 9 (2) ◽  
pp. 131-138 ◽  
Author(s):  
M. Pritchard ◽  
A. G. Gibson
Keyword(s):  
Injection Molding ◽  
Molding Compounds ◽  
Property Modification

Injection molding techniques for epoxy molding compounds

2002 ◽  
Author(s):  
D. Glauch ◽  
M. Rajadhyaksha ◽  
H.-F. Buchmann ◽  
S.R. Martell ◽  
H. Schwab ◽  
...  
Keyword(s):  
Injection Molding ◽  
Molding Compounds

Molders' perceptions of vinyl injection molding compounds

1992 ◽  
Vol 14 (2) ◽  
pp. 78-82 ◽  
Author(s):  
C. M. Gruber ◽  
N. L. Gockowski
Keyword(s):  
Injection Molding ◽  
Molding Compounds

Influence of capillary die geometry on wall slip of highly filled powder injection molding compounds

2018 ◽  
Vol 325 ◽  
pp. 615-619 ◽  
Author(s):  
Daniel Sanetrnik ◽  
Berenika Hausnerova ◽  
Petr Filip ◽  
Eva Hnatkova
Keyword(s):  
Injection Molding ◽  
Wall Slip ◽  
Powder Injection Molding ◽  
Powder Injection ◽  
Die Geometry ◽  
Molding Compounds

Sound Control with High Density Coated Substrates

1972 ◽  
Vol 2 (2) ◽  
pp. 68-78
Author(s):  
Charles L. Meteer
Keyword(s):  
Injection Molding ◽  
High Density ◽  
High Mass ◽  
Barrier Material ◽  
Molding Compounds ◽  
Sound Control ◽  
Sound Barrier ◽  
Sound Barriers ◽  
Coated Fabrics

Lead vinyl coated fabrics, new composite vinyl films, and molding compounds have been developed that have application as flexible sound barriers in transportation and recreational equipment. The material consisting of fine lead particles disbursed in PVC compounds for coating, casting films, extrusion, injection molding, thermal form sheets, and rotational casting combines the high mass of lead and the properties and formability of vinyl. These composites provide a limp high mass sound barrier material.

scholarly journals Characterization of Hermetically Sealed Metallic Feedthroughs through Injection-Molded Epoxy-Molding Compounds

2021 ◽  
Vol 2 (4) ◽  
pp. 976-995
Author(s):  
Mehmet Haybat ◽  
Thomas Guenther ◽  
Romit Kulkarni ◽  
Serhat Sahakalkan ◽  
Tobias Grözinger ◽  
...  
Keyword(s):  
Injection Molding ◽  
Electronic Devices ◽  
Injection Molding Process ◽  
Molding Process ◽  
Process Step ◽  
Molding Compounds ◽  
Single Process ◽  
Injection Molded ◽  
Molding Tool

Electronic devices and their associated sensors are exposed to increasing mechanical, thermal and chemical stress in modern applications. In many areas of application, the electronics are completely encapsulated with thermosets in a single process step using injection molding technology, especially with epoxy molding compounds (EMC). The implementation of the connection of complete systems for electrical access through a thermoset encapsulation is of particular importance. In practice, metal pin contacts are used for this purpose, which are encapsulated together with the complete system in a single injection molding process step. However, this procedure contains challenges because the interface between the metallic pins and the plastic represents a weak point for reliability. In order to investigate the reliability of the interface, in this study, metallic pin contacts made of copper-nickel-tin alloy (CuNiSn) and bronze (CuSn6) are encapsulated with standard EMC materials. The metal surfaces made of CuNiSn are further coated with silver (Ag) and tin (Sn). An injection molding tool to produce test specimens is designed and manufactured according to the design rules of EMC processing. The reliability of the metal-plastic interfaces are investigated by means of shear and leak tests. The results of the investigations show that the reliability of the metal-plastic joints can be increased by using different material combinations.

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