New composites with high thermal conductivity and low dielectric constant for microelectronic packaging

2009 ◽  
Vol 31 (2) ◽  
pp. 307-313 ◽  
Author(s):  
Wei Ling ◽  
Aijuan Gu ◽  
Guozheng Liang ◽  
Li Yuan
Keyword(s):  
Thermal Conductivity ◽  
Dielectric Constant ◽  
High Thermal Conductivity ◽  
Low Dielectric Constant ◽  
Microelectronic Packaging ◽  
Low Dielectric

Composites for Electronic Substrate Applications

1987 ◽  
Vol 108 ◽  
Author(s):  
R. Gerhardt
Keyword(s):  
Thermal Conductivity ◽  
Dielectric Constant ◽  
Thermal Expansion ◽  
Experimental Evidence ◽  
Single Phase ◽  
High Thermal Conductivity ◽  
Low Dielectric Constant ◽  
Low Dielectric ◽  
Composite Approach ◽  
Electronic Substrates

ABSTRACTThe need for low dielectric constant, high thermal conductivity, matched thermal expansion and co-processability in electronic substrates is reviewed. Since no single phase material is able to satisfy all the requirements, a microscopic composite approach is proposed. Recent experimental evidence supporting the concept is also presented.

A NEW FRACTAL DESIGN OF POROUS AlN/BN/SiOC COMPOSITES WITH LOW-k AND HIGH THERMAL CONDUCTIVITY

Fractals ◽  
2019 ◽  
Vol 27 (07) ◽  
pp. 1950124
Author(s):  
XIJIE DONG ◽  
YIFAN HU ◽  
MEIJUAN YUAN ◽  
JUN ZHAO ◽  
LING CHEN
Keyword(s):  
Thermal Conductivity ◽  
Dielectric Constant ◽  
Effective Medium Theory ◽  
Fractal Theory ◽  
Dielectric Constants ◽  
High Thermal Conductivity ◽  
Low Dielectric Constant ◽  
Medium Theory ◽  
Low Dielectric ◽  
Low K

In this work, we propose a new model for the dielectric constant and thermal conductivity, and apply it to the design of composites with low dielectric constant and high thermal conductivity based on fractal theory and effective medium theory. In particular, we use this model to prepare porous AlN/BN/SiOC composites with low dielectric constant and high thermal conductivity in different component fractions. We successfully synthesize ceramic samples with low dielectric constants [Formula: see text] and high thermal conductivity ([Formula: see text]). These results indicate that the proposed fractal design is valid.

High Tg, Low Dielectric Constant Aromatic Benzoxazoles Containing Allylether Pendent Groups for Use in Microelectronic Packaging

2001 ◽  
Vol 682 ◽  
Author(s):  
Max D. Alexander ◽  
Thuy D. Dang ◽  
Christina E. Specker ◽  
Marlene Houtz ◽  
R.J. Spry ◽  
...  
Keyword(s):  
Thermal Stability ◽  
Dielectric Constant ◽  
High Thermal Stability ◽  
Low Dielectric Constant ◽  
Microelectronic Packaging ◽  
Low Dielectric ◽  
Degradation Temperature ◽  
Low Thermal Expansion ◽  
Lower Dielectric Constant ◽  
Pendent Groups

ABSTRACTNext generation microelectronic packaging requirements are driving the need to produce increasingly lower dielectric constant materials while maintaining high thermal stability and ease of processing. Polymer candidates with exceptionally low dielectric constant (2.0-2.4), high thermal stability (degradation temperature higher than 400°C), high glass transition temperature (greater than 350°C), low water uptake (less than one percent), solubility in selected organic solvents, and low thermal expansion are all required. We have successfully synthesized and characterized several candidate polymers in an effort to address these needs.

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