Development of epoxy-matrix composite with both high-thermal conductivity and low-dielectric constant via hybrid filler systems

2009 ◽  
pp. NA-NA ◽  
Author(s):  
K. C. Yung ◽  
B. L. Zhu ◽  
T. M. Yue ◽  
C. S. Xie
Keyword(s):  
Thermal Conductivity ◽  
Dielectric Constant ◽  
Matrix Composite ◽  
Epoxy Matrix ◽  
High Thermal Conductivity ◽  
Low Dielectric Constant ◽  
Hybrid Filler ◽  
Low Dielectric ◽  
Epoxy Matrix Composite

Preparation and Properties of β-Si3N4/Epoxy Matrix Composite

2007 ◽  
Vol 336-338 ◽  
pp. 1350-1352 ◽  
Author(s):  
Jin Tang ◽  
Ke Xin Chen ◽  
C.S. Fu
Keyword(s):  
Thermal Conductivity ◽  
Dielectric Constant ◽  
Epoxy Matrix ◽  
Polymer Matrix Composites ◽  
Thermal Contact ◽  
Matrix Composites ◽  
Neat Polymer ◽  
Low Dielectric ◽  
Epoxy Matrix Composite ◽  
Thermally Conducting

Thermally conducting, but electrically insulating, polymer-matrix composites exhibiting low dielectric constant are needed for electronic packaging. For developing such composites, this work used silicon nitride particles as fillers and epoxy as matrix. The thermal conductivity of Si3N4 particles epoxy-matrix composites was increased by up to 31.4 times than that of neat polymer by silane surface treatment of the particles prior to composites fabrication. The increase in thermal conductivity is due to decrease in the filler-matrix thermal contact resistance through the improvement of the interface between matrix and particles. At 45.4 vol. % silane-treated Si3N4 particles only, the thermal conductivity of epoxy-matrix composites reached 9.72W/ (m*K). The dielectric constant was also low (up to 5.0 at 1 MHz). However, Si3N4 addition caused the flexural strength and ductility to decrease from the values of the neat polymer.

Composites for Electronic Substrate Applications

1987 ◽  
Vol 108 ◽  
Author(s):  
R. Gerhardt
Keyword(s):  
Thermal Conductivity ◽  
Dielectric Constant ◽  
Thermal Expansion ◽  
Experimental Evidence ◽  
Single Phase ◽  
High Thermal Conductivity ◽  
Low Dielectric Constant ◽  
Low Dielectric ◽  
Composite Approach ◽  
Electronic Substrates

ABSTRACTThe need for low dielectric constant, high thermal conductivity, matched thermal expansion and co-processability in electronic substrates is reviewed. Since no single phase material is able to satisfy all the requirements, a microscopic composite approach is proposed. Recent experimental evidence supporting the concept is also presented.

A NEW FRACTAL DESIGN OF POROUS AlN/BN/SiOC COMPOSITES WITH LOW-k AND HIGH THERMAL CONDUCTIVITY

Fractals ◽  
2019 ◽  
Vol 27 (07) ◽  
pp. 1950124
Author(s):  
XIJIE DONG ◽  
YIFAN HU ◽  
MEIJUAN YUAN ◽  
JUN ZHAO ◽  
LING CHEN
Keyword(s):  
Thermal Conductivity ◽  
Dielectric Constant ◽  
Effective Medium Theory ◽  
Fractal Theory ◽  
Dielectric Constants ◽  
High Thermal Conductivity ◽  
Low Dielectric Constant ◽  
Medium Theory ◽  
Low Dielectric ◽  
Low K

In this work, we propose a new model for the dielectric constant and thermal conductivity, and apply it to the design of composites with low dielectric constant and high thermal conductivity based on fractal theory and effective medium theory. In particular, we use this model to prepare porous AlN/BN/SiOC composites with low dielectric constant and high thermal conductivity in different component fractions. We successfully synthesize ceramic samples with low dielectric constants [Formula: see text] and high thermal conductivity ([Formula: see text]). These results indicate that the proposed fractal design is valid.

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