New Quenching Method for Improving Large-Scale Stopped-Flow Technique

2014 ◽  
Vol 8 (11) ◽  
pp. 766-770 ◽  
Author(s):  
Ashutosh Thakur ◽  
Supawadee Poonpong ◽  
Minoru Terano ◽  
Toshiaki Taniike
Keyword(s):  
Large Scale ◽  
Stopped Flow ◽  
Quenching Method

scholarly journals Development of Large-Scale Stopped-Flow Technique and its Application in Elucidation of Initial Ziegler–Natta Olefin Polymerization Kinetics

Polymers ◽  
2019 ◽  
Vol 11 (6) ◽  
pp. 1012 ◽  
Author(s):  
Ashutosh Thakur ◽  
Toru Wada ◽  
Patchanee Chammingkwan ◽  
Minoru Terano ◽  
Toshiaki Taniike
Keyword(s):  
Active Sites ◽  
Large Scale ◽  
Olefin Polymerization ◽  
Polymerization Kinetics ◽  
Propylene Polymerization ◽  
Time Range ◽  
Stopped Flow ◽  
Chemical Transformations ◽  
Polymerization Catalysis ◽  
Short Period

The stopped-flow (SF) technique has been extensively applied to study Ziegler–Natta (ZN) olefin polymerization kinetics within an extremely short period (typically <0.2 s) for understanding the nature of the active sites as well as the polymerization mechanisms through microstructure analyses of obtained polymers. In spite of its great applicability, a small amount of polymer that is yielded in a short-time polymerization has been a major bottleneck for polymer characterizations. In order to overcome this limitation, a large-scale SF (LSF) system has been developed, which offers stable and scalable polymerization over an expanded time range from a few tens milliseconds to several seconds. The scalability of the LSF technique has been further improved by introducing a new quenching protocol. With these advantages, the LSF technique has been effectively applied to address several unknown issues in ZN catalysis, such as the role of physical and chemical transformations of a catalyst on the initial polymerization kinetics, and regiochemistry of ZN propylene polymerization. Here, we review the development of the LSF technique and recent efforts for understanding heterogeneous ZN olefin polymerization catalysis with this new system.

scholarly journals Controllable synthesis of graphene scrolls and their performance for supercapacitors

RSC Advances ◽  
2018 ◽  
Vol 8 (34) ◽  
pp. 19164-19170 ◽  
Author(s):  
Lianlian Gao ◽  
Zhigang Zhang ◽  
Jinping Zhao ◽  
Jin Zhou ◽  
Zhichao Miao ◽  
...  
Keyword(s):  
Graphene Oxide ◽  
Large Scale ◽  
Sodium Citrate ◽  
Aqueous Suspension ◽  
Controllable Synthesis ◽  
Quenching Method

In this work, sodium citrate (SC) was added to a graphene oxide (GO) aqueous suspension and GSCs were controllably prepared on a large-scale by a cold quenching method.

Development of a Large-Scale Stopped-Flow System for Heterogeneous Olefin Polymerization Kinetics

2012 ◽  
Vol 6 (6-7) ◽  
pp. 275-279 ◽  
Author(s):  
Toshiaki Taniike ◽  
Shinya Sano ◽  
Mitsuhiro Ikeya ◽  
Vu Quoc Thang ◽  
Minoru Terano
Keyword(s):  
Large Scale ◽  
Olefin Polymerization ◽  
Flow System ◽  
Polymerization Kinetics ◽  
Stopped Flow

Some comments about observations and image processing of comet 29P/Schwassmann-Wachmann 1

1999 ◽  
Vol 173 ◽  
pp. 243-248
Author(s):  
D. Kubáček ◽  
A. Galád ◽  
A. Pravda
Keyword(s):  
Image Processing ◽  
Large Scale ◽  
Harvard College ◽  
Oak Ridge ◽  
Large Scale Structures ◽  
Short Period Comet ◽  
Short Period ◽  
Scale Structures ◽  
Harvard College Observatory ◽  
Period Comet

AbstractUnusual short-period comet 29P/Schwassmann-Wachmann 1 inspired many observers to explain its unpredictable outbursts. In this paper large scale structures and features from the inner part of the coma in time periods around outbursts are studied. CCD images were taken at Whipple Observatory, Mt. Hopkins, in 1989 and at Astronomical Observatory, Modra, from 1995 to 1998. Photographic plates of the comet were taken at Harvard College Observatory, Oak Ridge, from 1974 to 1982. The latter were digitized at first to apply the same techniques of image processing for optimizing the visibility of features in the coma during outbursts. Outbursts and coma structures show various shapes.

Evolution of Large-Scale Coronal Structures

1994 ◽  
Vol 144 ◽  
pp. 29-33
Author(s):  
P. Ambrož
Keyword(s):  
Magnetic Field ◽  
Field Line ◽  
Large Scale ◽  
Coronal Magnetic Field ◽  
Source Surface ◽  
Solar Cycles ◽  
Characteristic Relationship ◽  
The Magnetic Field ◽  
Coronal Structures

AbstractThe large-scale coronal structures observed during the sporadically visible solar eclipses were compared with the numerically extrapolated field-line structures of coronal magnetic field. A characteristic relationship between the observed structures of coronal plasma and the magnetic field line configurations was determined. The long-term evolution of large scale coronal structures inferred from photospheric magnetic observations in the course of 11- and 22-year solar cycles is described.Some known parameters, such as the source surface radius, or coronal rotation rate are discussed and actually interpreted. A relation between the large-scale photospheric magnetic field evolution and the coronal structure rearrangement is demonstrated.

Large-scale Motion of Solar Filaments

2000 ◽  
Vol 179 ◽  
pp. 205-208
Author(s):  
Pavel Ambrož ◽  
Alfred Schroll
Keyword(s):  
Magnetic Flux ◽  
Proper Motion ◽  
Time Scale ◽  
Large Scale ◽  
Accuracy Of Measurements ◽  
Solar Filaments ◽  
General Movement ◽  
Scale Motion ◽  
Velocity Scatter

AbstractPrecise measurements of heliographic position of solar filaments were used for determination of the proper motion of solar filaments on the time-scale of days. The filaments have a tendency to make a shaking or waving of the external structure and to make a general movement of whole filament body, coinciding with the transport of the magnetic flux in the photosphere. The velocity scatter of individual measured points is about one order higher than the accuracy of measurements.

Some applications of electron beam microanalysis techniques in VLSI process evaluation

1983 ◽  
Vol 41 ◽  
pp. 160-161
Author(s):  
Simon Thomas
Keyword(s):  
Integrated Circuits ◽  
Process Evaluation ◽  
Large Scale ◽  
Technology Development ◽  
Analytical Techniques ◽  
Successful Implementation ◽  
Analysis Of Failures ◽  
Characterization Of Materials ◽  
Circuits Vlsi

Trends in the technology development of very large scale integrated circuits (VLSI) have been in the direction of higher density of components with smaller dimensions. The scaling down of device dimensions has been not only laterally but also in depth. Such efforts in miniaturization bring with them new developments in materials and processing. Successful implementation of these efforts is, to a large extent, dependent on the proper understanding of the material properties, process technologies and reliability issues, through adequate analytical studies. The analytical instrumentation technology has, fortunately, kept pace with the basic requirements of devices with lateral dimensions in the micron/ submicron range and depths of the order of nonometers. Often, newer analytical techniques have emerged or the more conventional techniques have been adapted to meet the more stringent requirements. As such, a variety of analytical techniques are available today to aid an analyst in the efforts of VLSI process evaluation. Generally such analytical efforts are divided into the characterization of materials, evaluation of processing steps and the analysis of failures.

Electron microscopy study of reactively sputter-deposited Ti/N films on silicon

1992 ◽  
Vol 50 (2) ◽  
pp. 1362-1363
Author(s):  
V. C. Kannan ◽  
A. K. Singh ◽  
R. B. Irwin ◽  
S. Chittipeddi ◽  
F. D. Nkansah ◽  
...  
Keyword(s):  
Integrated Circuits ◽  
Large Scale ◽  
Hexagonal Phase ◽  
Microscopy Study ◽  
Electron Microscopy Study ◽  
Process Conditions ◽  
Tin Films ◽  
Wide Range ◽  
Fcc Phase ◽  
Circuits Vlsi

Titanium nitride (TiN) films have historically been used as diffusion barrier between silicon and aluminum, as an adhesion layer for tungsten deposition and as an interconnect material etc. Recently, the role of TiN films as contact barriers in very large scale silicon integrated circuits (VLSI) has been extensively studied. TiN films have resistivities on the order of 20μ Ω-cm which is much lower than that of titanium (nearly 66μ Ω-cm). Deposited TiN films show resistivities which vary from 20 to 100μ Ω-cm depending upon the type of deposition and process conditions. TiNx is known to have a NaCl type crystal structure for a wide range of compositions. Change in color from metallic luster to gold reflects the stabilization of the TiNx (FCC) phase over the close packed Ti(N) hexagonal phase. It was found that TiN (1:1) ideal composition with the FCC (NaCl-type) structure gives the best electrical property.

Evolution of the microstructure of Cu(Ti)/SiO2 layers annealed in NH3

1995 ◽  
Vol 53 ◽  
pp. 452-453
Author(s):  
J. Liu ◽  
N. D. Theodore ◽  
D. Adams ◽  
S. Russell ◽  
T. L. Alford ◽  
...  
Keyword(s):  
Thermal Stability ◽  
Titanium Nitride ◽  
Large Scale ◽  
Standard Procedure ◽  
Alloy Film ◽  
Electron Beam Evaporation ◽  
Copper Metallization ◽  
Nominal Composition ◽  
Ti Alloy ◽  
Thermally Grown

Copper-based metallization has recently attracted extensive research because of its potential application in ultra-large-scale integration (ULSI) of semiconductor devices. The feasibility of copper metallization is, however, limited due to its thermal stability issues. In order to utilize copper in metallization systems diffusion barriers such as titanium nitride and other refractory materials, have been employed to enhance the thermal stability of copper. Titanium nitride layers can be formed by annealing Cu(Ti) alloy film evaporated on thermally grown SiO2 substrates in an ammonia ambient. We report here the microstructural evolution of Cu(Ti)/SiO2 layers during annealing in NH3 flowing ambient.The Cu(Ti) films used in this experiment were prepared by electron beam evaporation onto thermally grown SiO2 substrates. The nominal composition of the Cu(Ti) alloy was Cu73Ti27. Thermal treatments were conducted in NH3 flowing ambient for 30 minutes at temperatures ranging from 450°C to 650°C. Cross-section TEM specimens were prepared by the standard procedure.

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