Ultra-short pulse generator using 0.13-μm CMOS

2017 ◽  
Vol 59 (12) ◽  
pp. 3094-3097 ◽  
Author(s):  
Xusheng Tang ◽  
Fengyi Huang ◽  
Xiaoyu Wang ◽  
Tianyu Chang ◽  
Youming Zhang
Keyword(s):  
Pulse Generator ◽  
Short Pulse ◽  
Ultra Short Pulse

Micro Electrical Discharge Machining of Tungsten Carbide with Ultra-Short Pulse

2015 ◽  
Vol 651-653 ◽  
pp. 759-764
Author(s):  
Oliver Kröning ◽  
Mathias Herzig ◽  
Matthias Hackert-Oschätzchen ◽  
Ralf Kühn ◽  
Henning Zeidler ◽  
...  
Keyword(s):  
Electrical Discharge ◽  
Pulse Generator ◽  
Electrical Discharge Machining ◽  
Short Pulse ◽  
High Surface ◽  
Micro Edm ◽  
High Surface Quality ◽  
Micro Electrical Discharge Machining ◽  
Metal Machining ◽  
Ultra Short Pulse

Micro EDM (Electrical Discharge Machining) is a known nonconventional process for the machining of hard to cut materials. Due to its ablating nature based on melting and evaporation through heat induced by electrical discharges, it can function independently of the hardness, toughness or brittleness of the workpiece. Thus micro EDM is a possible process to fulfill the requirements of higher precision and high quality in carbide metal machining. Thereby the surface and the roughness of machined carbide metals depend on the discharge energy used. For machining carbide metals with high surface quality pulse generators with ultra-short discharges are required. This paper presents the development of a two-staged pulse generator with the ability to provide ultra-short pulses by using a two-staged pulse. The current and voltage signals of the discharges were recorded and their characteristics were analyzed.

Silicon Thinning using Ultra-Short Pulse Laser Ablation

2004 ◽  
Author(s):  
F. Beaudoin ◽  
P. Perdu ◽  
C. DeNardi ◽  
R. Desplats ◽  
J. Lopez ◽  
...  
Keyword(s):  
Laser Ablation ◽  
Sample Preparation ◽  
Pulse Laser ◽  
Pulse Laser Ablation ◽  
Short Pulse ◽  
Special Care ◽  
Short Pulse Laser ◽  
Ultra Short Pulse ◽  
Ultra Short Pulse Laser

Abstract Ultra-short pulse laser ablation is applied to IC backside sample preparation. It is contact-less, non-thermal, precise and can ablate the various types of material present in IC packages. This study concerns the optimization of ultra-short pulse laser ablation for silicon thinning. Uncontrolled silicon roughness and poor uniformity of the laser thinned cavity needed to be tackled. Special care is taken to minimize the silicon RMS roughness to less than 1µm. Application to sample preparation of 256Mbit devices is presented.

UKP-laserbasierte Herstellung von Netzen unterschiedlicher Transmissionsgrade/USP-laser based production of meshes of different transmission degrees

2020 ◽  
Vol 110 (11-12) ◽  
pp. 787-789
Author(s):  
Marcel Simons ◽  
Till Rusche ◽  
Tobias Valentino ◽  
Tim Radel ◽  
Frank Vollertsen
Keyword(s):  
High Precision ◽  
Processing Speed ◽  
Laser Processing ◽  
Short Pulse ◽  
High Quality ◽  
Mesh Width ◽  
Variable Transmission ◽  
Ultra Short Pulse ◽  
Mesh Structures

Die Ultrakurzpuls (UKP)-laserbasierte Bearbeitung erlaubt die Herstellung von Netzstrukturen mit verschiedenen Transmissionsgraden. Vorteile der UKP-laserbasierten Herstellung der Netze liegen vor allem in der hohen Präzision und Bearbeitungsgeschwindigkeit. Die UKP-Laserbearbeitung ermöglicht die Herstellung von Netzen aus Aluminium in hoher Qualität, bezogen auf die Stegbreitenabweichung von < 8 µm, mit variablen Transmissionsgraden. Ultra-short pulse (USP) laser based processing enables the production of mesh structures with different degrees of transmission. The advantages of USP-based production of mesh structures are mainly the high precision and processing speed. USP laser processing enables the production of meshes of aluminum in high quality, with respect to the mesh width deviation of < 8 µm with variable transmission degrees.

scholarly journals Laser Pulse Shortening via Zero-Dispersion Phase Matching of Parametric Raman Interactions in Crystals

Crystals ◽  
2020 ◽  
Vol 11 (1) ◽  
pp. 19
Author(s):  
Sergei N. Smetanin ◽  
Michal Jelínek ◽  
Dmitry P. Tereshchenko ◽  
Mikhail N. Ershkov ◽  
Václav Kubeček
Keyword(s):  
Laser Pulse ◽  
Short Pulse ◽  
Matching Condition ◽  
Phase Matching ◽  
Dispersion Phase ◽  
Birefringent Crystal ◽  
Raman Lasers ◽  
Birefringent Crystals ◽  
Phase Matching Condition ◽  
Ultra Short Pulse

We propose and study the conditions of zero-dispersion phase matching for parametric Raman interactions in birefringent crystals differing by anisotropy of zero-dispersion wavelength and allowing for the spectral tuning of the zero-dispersion phase-matching condition. We choose a highly birefringent crystal of calcite having a wide zero-dispersion anisotropy range for the demonstration of new effects of laser pulse shortening in parametric Raman lasers with spectrally tunable zero-dispersion phase matching. We demonstrate the anti-Stokes (1168 nm) and multi-Stokes (1629 nm) picosecond pulse shortening and self-separation of single 80-ps ultra-short pulse from the zero-dispersion phase-matched parametric Raman lasers that are based on the calcite crystal without using any electro-optical device.

The study of time dependent, broadband X-ray emission from ultra-short pulse laser produced plasmas

1994 ◽  
Author(s):  
Ronnie Shepherd ◽  
Rex Booth ◽  
Dwight Price ◽  
Rosemary Walling ◽  
Richard More ◽  
...  
Keyword(s):  
Pulse Laser ◽  
Short Pulse ◽  
Time Dependent ◽  
X Ray ◽  
Short Pulse Laser ◽  
Ultra Short Pulse ◽  
Ultra Short Pulse Laser

Ultra-short pulse laser safety - a challenge to materials science

2005 ◽  
Author(s):  
Andreas Hertwig ◽  
Sven Martin ◽  
Wolfgang Kautek ◽  
Jörg Krüger
Keyword(s):  
Pulse Laser ◽  
Materials Science ◽  
Short Pulse ◽  
Laser Safety ◽  
Short Pulse Laser ◽  
Ultra Short Pulse ◽  
Ultra Short Pulse Laser
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