A millimeter-wave CMOS power amplifier design using high-Q slow-wave transmission lines

2015 ◽  
Vol 26 (2) ◽  
pp. 99-109 ◽  
Author(s):  
Xiao-Lan Tang ◽  
Emmanuel Pistono ◽  
Philippe Ferrari ◽  
Jean-Michel Fournier
Author(s):  
Xiao-Lan Tang ◽  
Emmanuel Pistono ◽  
Jean-Michel Fournier ◽  
Philippe Ferrari ◽  
Zongming Duan ◽  
...  

2011 ◽  
Vol 4 (1) ◽  
pp. 93-100 ◽  
Author(s):  
Xiao-Lan Tang ◽  
Emmanuel Pistono ◽  
Philippe Ferrari ◽  
Jean-Michel Fournier

This paper shows the contribution of slow-wave coplanar waveguides on the performance of power amplifiers operating at millimeter-wave frequencies in CMOS-integrated technologies. These transmission lines present a quality factor Q two to three times higher than that of the conventional microstrip lines at the same characteristic impedance. To demonstrate the contribution of the slow-wave transmission lines on integrated millimeter-wave amplifiers performance, two Class-A single-stage power amplifiers (PA) operating at 60 GHz were designed in standard 40 nm CMOS technology. One of the power amplifiers incorporates only the microstrip lines, whereas slow-wave coplanar transmission lines are considered in the other one. Both amplifiers are biased in Class-A operation, drawing, respectively, 22 and 23 mA from 1.2 V supply. Compared to the power amplifier using conventional microstrip transmission lines, the one implemented with slow-wave transmission lines shows improved performances in terms of gain (5.6 dB against 3.3 dB), 1 dB output compression point (OCP1dB: 7 dBm against 5 dBm), saturated output power (Psat: >10 and 8 dBm, respectively), power-added efficiency (PAE: 16% instead of 6%), and die area without pads (Sdie: 0.059 mm2 against 0.069 mm2).


2013 ◽  
Vol 34 (9) ◽  
pp. 1094-1096 ◽  
Author(s):  
Xiao-Lan Tang ◽  
Emmanuel Pistono ◽  
Philippe Ferrari ◽  
Jean-Michel Fournier

Author(s):  
Dan Sandstrom ◽  
Mikko Varonen ◽  
Mikko Karkkainen ◽  
Kari Halonen

2009 ◽  
Vol 19 (9) ◽  
pp. 542-544 ◽  
Author(s):  
D. Kaddour ◽  
H. Issa ◽  
A.L. Franc ◽  
N. Corrao ◽  
E. Pistono ◽  
...  

Author(s):  
H. J. Lu ◽  
Y. X. Guo ◽  
K. Faeyz ◽  
C. K. Cheng ◽  
J. Wei

In this paper, a multi-layer LCP substrate fabrication process was described and millimeter wave transmission lines and filters were designed and fabricated on the LCP substrate. Various transitions from a CPW to a microstrip line with their characteristic impedance being 50 ohms were investigated. The characteristics of the wirebonding assembly for connecting two transmission lines was also examined. The measurement results show that an insertion loss of 1.3 dB at 60 GHz can be achieved for the two-wire bonding trasmisssion line including two transitions from a CPW to a microstrip line.


Sign in / Sign up

Export Citation Format

Share Document