Interfacial reaction between SAC305 lead-free solders and ENImAg surface finish and bare copper

2017 ◽  
Vol 48 (3-4) ◽  
pp. 235-240 ◽  
Author(s):  
M.A. Rabiatul Adawiyah ◽  
O. Saliza Azlina
Keyword(s):  
Interfacial Reaction ◽  
Surface Finish ◽  
Lead Free ◽  
Lead Free Solders ◽  
Bare Copper

scholarly journals The liquid structure of Sn-based lead-free solders and the correlative effect in liquid-solid interfacial reaction

2008 ◽  
Vol 98 (1) ◽  
pp. 012029 ◽  
Author(s):  
Ning Zhao ◽  
Xuemin Pan ◽  
Haitao Ma ◽  
Chuang Dong ◽  
Shuhong Guo ◽  
...  
Keyword(s):  
Interfacial Reaction ◽  
Liquid Structure ◽  
Lead Free ◽  
Lead Free Solders ◽  
Correlative Effect

Transmission electron microscopy studies of interfacial reactions and void formation in lead-free solders with minor elements

2010 ◽  
Vol 25 (7) ◽  
pp. 1304-1311 ◽  
Author(s):  
Y.T. Chin ◽  
P.K. Lam ◽  
H.K. Yow ◽  
T.Y. Tou
Keyword(s):  
Surface Finish ◽  
Intermetallic Layer ◽  
Void Formation ◽  
Electroless Nickel ◽  
Interfacial Reactions ◽  
Lead Free ◽  
Form Complex ◽  
Minor Elements ◽  
Transmission Electron ◽  
Lead Free Solders

Electroless nickel (Ni–P) is a common surface finish used in the ball grid array (BGA) package and interfacial reactions between its surface finish and lead-free solders can form complex intermetallic compound (IMC) layers. The presence of minor elements in lead-free solders either intentionally added or due to impurity contamination during solder manufacturing, can affect the solder-joint performance. In this work, interfacial reactions between Ni–P surface finish and the Sn–Ag–Cu solders were modified by varying Ag and Cu contents and also by adding a small amount of minor elements such as phosphorus (P), indium (In), and germanium (Ge). A transmission electron microscope was used to determine the intermetallic layer phases, compositions, crystal structures, and void defects. Varying the solder alloy elements led to the modulation of voids formation.

Interfacial Reaction Between Tin-Zinc Based Solders and Copper

1997 ◽  
Vol 3 (S2) ◽  
pp. 715-716
Author(s):  
G. Ghosh ◽  
M. E. Fine
Keyword(s):  
Interfacial Reaction ◽  
High Performance ◽  
Solder Joints ◽  
Physical And Mechanical Properties ◽  
Lead Free ◽  
Eutectic Alloys ◽  
Solidification Behavior ◽  
Lead Free Solders ◽  
Melting And Solidification ◽  
Intermetallic Layers

Due to the interfacial reaction between the solder and substrate, either during manufacturing or in service, the solder joints may contain one or more intermetallic layers at the interface. While such intermetallic layers may provide strong bonding, they may also be responsible for problems associated with solderability and reliability of joints. Certain physical and mechanical properties of the intermetallic may determine the integrity and reliability of solder assembly. So far detailed analysis, modelling, and testing of simulated and actual joints have been performed with Pb-Sn solders. However, in view of the increasing environmental and legislative concerns, lead-free solders are currently being developed and designed for microelectronics applications. As the solder joints in high-performance electronic circuits are expected to carry increasing mechanical, electrical and thermal burdens, it is essential to address the technological and reliability issues for lead-free solders. Among the lead-free solders, tin-zinc based alloys can be designed to achieve melting and solidification behavior similar to those of lead-tin eutectic or near eutectic alloys.

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