A scalable electrothermal model using a three‐dimensional thermal analysis model for
GaN‐on‐diamond
high‐electron‐mobility transistors
2018 ◽
Vol 18
(11)
◽
pp. 7578-7583
2020 ◽
Vol 19
(3)
◽
pp. 1107-1115
2019 ◽
Vol 19
(4)
◽
pp. 704-710