Three-dimensional computational comparison of mini-pinned heat sinks using different nanofluids: Part two-energy and exergy characteristics

2019 ◽  
Vol 49 (1) ◽  
pp. 441-460 ◽  
Author(s):  
Amer Al-damook ◽  
Mohand A. Alfellag ◽  
Wissam H. Khalil
Keyword(s):  
Three Dimensional ◽  
Heat Sinks ◽  
Energy And Exergy ◽  
Computational Comparison

Performance evaluation of serpentine and multi-channel heat sinks based on energy and exergy analyses

2021 ◽  
Vol 186 ◽  
pp. 116475
Author(s):  
Nabeel Sameer Mahmoud ◽  
Hayder Mohammad Jaffal ◽  
Ahmed Abdulnabi Imran
Keyword(s):  
Performance Evaluation ◽  
Heat Sinks ◽  
Energy And Exergy ◽  
Exergy Analyses

scholarly journals Study of Mini Channel Heat Sink with Different Internal Configuration

2020 ◽  
Vol 319 ◽  
pp. 02004
Author(s):  
Muhammad Akif Rahman ◽  
Md Badrath Tamam ◽  
Md Sadman Faruque ◽  
A.K.M. Monjur Morshed
Keyword(s):  
Nusselt Number ◽  
Thermal Performance ◽  
Heat Sink ◽  
Rectangular Channel ◽  
Three Dimensional ◽  
Heat Sinks ◽  
Maximum Temperature ◽  
Rectangular Channels ◽  
Flow Through ◽  
Internal Configuration

In this paper a numerical analysis of three-dimensional laminar flow through rectangular channel heat sinks of different geometric configuration is presented and a comparison of thermal performance among the heat sinks is discussed. Liquid water was used as coolant in the aluminum made heat sink with a glass cover above it. The aspect ratio (section height to width) of rectangular channels of the mini-channel heat sink was 0.33. A heat flux of 20 W/cm2 was continuously applied at the bottom of the channel with different inlet velocity for Reynold’s number ranging from 150 to 1044. Interconnectors and obstacles at different positions and numbers inside the channel were introduced in order to enhance the thermal performance. These modifications cause secondary flow between the parallel channels and the obstacles disrupt the boundary layer formation of the flow inside the channel which leads to the increase in heat transfer rate. Finally, Nusselt number, overall thermal resistance and maximum temperature of the heat sink were calculated to compare the performances of the modified heat sinks with the conventional mini channel heat sink and it was observed that the heat sink with both interconnectors and obstacles enhanced the thermal performance more significantly than other configurations. A maximum of 36% increase in Nusselt number was observed (for Re =1044).

Cooling of Concentrator Photovoltaic Cells Using Mini-Scale Jet Impingement Heat Sinks

2018 ◽  
Author(s):  
Ali Radwan ◽  
Meshack Hawi ◽  
Mahmoud Ahmed
Keyword(s):  
Heat Transfer ◽  
Flow Model ◽  
Three Dimensional ◽  
Jet Impingement ◽  
Heat Sinks ◽  
Maximum Temperature ◽  
Transfer Model ◽  
Cell Temperature ◽  
Maximum Cell ◽  
T System

In this study, an efficient cooling technique for concentrator photovoltaic (CPV) cells is proposed to enhance the system electrical efficiency and extend its lifetime. To do this, a comprehensive three-dimensional conjugate heat transfer model of CPV cells layers coupled with the heat transfer and fluid flow model inside jet impingement heat sink is developed. Four different jet impingement designs are compared. The investigated designs are (A) central inlet jet, (B) Hypotenuse inlet jet, (C) staggered inlet jet, and (D) conventional jet impingement design with side drainage. The effect of coolant flowrate on the CPV/T system performance is investigated. The model is numerically simulated and validated using the available experiments. The performance of CPV system is investigated at solar concentration ratios of 20 and coolant flowrate up to 6000g/min. It is found that increasing the flowrate from 60 g/min to 600 g/min decrease the maximum cell temperature by 31°C for the configuration D while increasing the flowrate from 600 g/min to 6000 g/min reduce the cell temperature by 20.2°C. It is also concluded that at a higher flowrate of 6000g/min, all the investigated configurations relatively achieve better temperature uniformity with maximum temperature differences of 0.9 °C, 2.1 °C, 3.6 °C, and 3.9 °C for configurations A, B, C, and D respectively.

Heat Transfer Enhancement for Wake Zone Using Slit Pillar in Microchannel Heat Sinks

2019 ◽  
Vol 142 (1) ◽  
Author(s):  
Xiao Cheng ◽  
Huiying Wu
Keyword(s):  
Heat Transfer ◽  
Heat Transfer Performance ◽  
Electronic Device ◽  
Three Dimensional ◽  
Lower Surface ◽  
Heat Sinks ◽  
Transfer Performance ◽  
Microchannel Heat Sinks ◽  
Dimensional Simulation ◽  
Wake Zone

Abstract Pillar microchannel heat sinks have been widely used for chip cooling, while their overall heat transfer performance is restricted by the stagnation flow in pillar wake zone. In this work, a simple but effective method using slit microstructure modified on pillar was proposed to enhance wake zone heat transfer. It enables a special flow path for the incoming fluid that intensively disturbs the wake fluid. To validate the proposed method, a three-dimensional simulation was employed to study the laminar flow and heat transfer characteristics in the slit pillar microchannel. The pillar without slit design was also investigated for comparative analysis. Effects of slit angle (θ), height over diameter ratio (H/D), and blocking ratio (D/W) of a single pillar were systematically studied at the Reynolds numbers of 26–260. Results showed the case with θ = 0 deg always demonstrated lower surface temperature, higher Nusselt number and higher thermal performance index (TPI) compared to other cases with different slit angles at the same conditions. Furthermore, it was interesting to find that the slit configuration was not suitable for long pillar microchannel, but preferred for high blocking ratio pillar microchannel at present ranges (H/D ≤ 1, D/W ≤ 0.5). The slit pillar array microchannel was also explored and observed with improved overall heat transfer performance. The proposed slit microstructure well prevents the heat transfer deterioration in pillar wake zone, which is promisingly to be used for cooling performance improvement of electronic device.

Thermohydrodynamic Performance Evaluation of Recharging, Interrupted and Simple Microchannels: A Comparative Study

2019 ◽  
Vol 142 (1) ◽  
Author(s):  
Sangram Kumar Samal ◽  
Manoj Kumar Moharana
Keyword(s):  
Heat Transfer ◽  
Aspect Ratio ◽  
Three Dimensional ◽  
High Heat ◽  
Heat Sinks ◽  
High Heat Flux ◽  
Transverse Wall ◽  
Performance Factor ◽  
Channel Aspect Ratio ◽  
Small Channels

Abstract In this study, a three-dimensional numerical investigation on the thermohydrodynamic performance of a recently proposed recharging microchannel (RMC) is carried out. In this design, a straight microchannel is split into more than one smaller length channels (having individual inlet and outlet) placed end to end. This design enhances overall heat transfer and maintains temperature uniformity across the substrate length. The comparison of fluid flow and heat transfer performance of RMC, interrupted microchannel (IMC) and straight microchannel (SMC) with the same hydraulic diameter and substrate length are presented to explore the effect of geometrical configuration on heat transfer enhancement. The parametric variations include the number of channels (n), transverse wall length (Ltw), channel aspect ratio (α), and flow Reynolds number. The results reveal that recharging microchannel shows better thermal performance compared to simple and interrupted microchannel with a maximum performance factor of 1.80. The results also indicate that the performance factor of RMC increases with an increase in the number of small channels, transverse wall length, and channel aspect ratio. The outcome of this study indicates the possible use of recharging microchannel heat sinks for high heat flux removal applications such as electronic cooling.

Thermodynamic Analysis of Heat and Fluid Flow in a Microchannel With Internal Fins

2009 ◽  
Author(s):  
Ramesh Narayanaswamy ◽  
Tilak T. Chandratilleke ◽  
Andrew J. L. Foong
Keyword(s):  
Heat Transfer ◽  
Fluid Flow ◽  
Thermodynamic Analysis ◽  
Entropy Generation ◽  
High Performance ◽  
Numerical Study ◽  
Three Dimensional ◽  
Heat Sinks ◽  
Heat Transfer Fluid ◽  
Internal Fins

Efficient cooling techniques are one of the critical design requirements for maintaining reliable operational characteristics of modern, miniaturised high performance electronic components. Microchannel heat sinks form an integral part of most devices used for thermal management in electronic equipment cooling. A microchannel of square cross section, having internal longitudinal fins is considered for analysis. A numerical study is carried out to investigate the fluid flow and heat transfer characteristics. Three-dimensional numerical simulations are performed on the microchannel in the presence of a hydrodynamically developed, thermally developing laminar flow. Further on, a thermodynamic analysis is carried out, for a range of fin heights and thermophysical parameters, in order to obtain the irreversibilities due to heat transfer and fluid flow within the microchannel. An optimum fin height, corresponding to the thermodynamically optimum conditions that minimize the entropy generation rates has been obtained. The effect of the presence of internal fins on the entropy generated due to heat transfer, fluid friction, and the total entropy generation is also provided.

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