Forced air cooling for CPU modules with high heat dissipation

2002 ◽  
Vol 31 (3) ◽  
pp. 226-236 ◽  
Author(s):  
Yoshihiro Kondo ◽  
Hitoshi Matsushima
Keyword(s):  
Heat Dissipation ◽  
High Heat ◽  
Air Cooling ◽  
Forced Air

Forced Air Cooling With Synthetic Jet Ejectors

2005 ◽  
Author(s):  
Raghav Mahalingam ◽  
Ari Glezer
Keyword(s):  
Mass Flux ◽  
Heated Surface ◽  
High Heat ◽  
Synthetic Jet ◽  
Synthetic Jets ◽  
Low Flow ◽  
Air Cooling ◽  
Zero Mass ◽  
High Heat Transfer ◽  
Forced Air

This paper discusses the concept of synthetic jet ejectors for forced air cooling and some practical implementations of the same. Synthetic or “zero-mass-flux” jets, unlike conventional jets, require no mass addition to the system, and thus provide means of efficiently directing airflow across a heated surface. Because these jets are zero net mass flux in nature and are comprised entirely of the ambient fluid, they can be conveniently integrated with the surfaces that require cooling without the need for complex plumbing. A synthetic jet ejector mechanism for obtaining high heat transfer rates at low flow rates is discussed. Synthetic jet ejectors consist of a primary “zero-mass-flux” unsteady jet driving a secondary airflow through a channel. Several practical implementations of synthetic jets are introduced from low form factor, low power spot cooling applications to high heat dissipation applications and flow bypass control where synthetic jets are used to enhance fan performance.

Calculation of Forced-Air Cooling of Electronic Modules With a Two-Fluid Model of Turbulence

1996 ◽  
Vol 118 (4) ◽  
pp. 250-257 ◽  
Author(s):  
O. J. Ilegbusi
Keyword(s):  
Reynolds Number ◽  
Heat Dissipation ◽  
Electronic Device ◽  
Fluid Model ◽  
Diffusion Flux ◽  
Electronic System ◽  
Air Cooling ◽  
Two Fluid Model ◽  
Forced Air ◽  
Two Fluid

The flow and heat transfer characteristics in a forced-air cooled electronic device are calculated with a two-fluid model of turbulence. The fluids are defined as turbulent and nonturbulent, and precludes the need for low-Reynolds number model in the near-wall regions. Transport equations are solved for the zone-averaged variables of each fluid. Empirical relations, established in prior work, are used to express interchange of mass, momentum, and energy at the interface. Gradient-diffusion flux is considered an intrafluid source of turbulence. Several cases are considered showing effects of Reynolds number and heat-dissipation density on the flow and thermal fields. A critical comparison is made between the results based on the application of this model and the conventional k-ε model. Such results include velocity vectors and temperature distribution. In addition, the two-fluid model predicts spatial distribution of the intermittency factor, which provides a measure of the extent of turbulence and mixing in the electronic system.

Thermal Performance Maps for Forced Air Cooling of Ruggedized Electronics Enclosures

2007 ◽  
Author(s):  
Jesse VanEngelenhoven ◽  
Gary L. Solbrekken ◽  
Karl J. L. Geisler
Keyword(s):  
Heat Transfer ◽  
Pressure Drop ◽  
Heat Dissipation ◽  
Side Wall ◽  
Form Factors ◽  
Air Cooling ◽  
Heat Transfer Capacity ◽  
Flow Pressure ◽  
Forced Air ◽  
Analytic Models

Based on standard commercial form factors, this study explores chassis-level air cooling limits for ruggedized military electronics enclosures constrained by pressure drop requirements and fin manufacturing capabilities. Numeric and analytic models are developed and used to define a methodology for optimizing the geometry of longitudinal plate fins included in side wall ducts to maximize the amount of heat that can be dissipated from an air-cooled chassis. The results of these analyses are presented in the form of a performance map facilitate the identification of particular fin manufacturing process well-suited for a specified set of mass flow, pressure drop, and heat transfer requirements. Analysis results demonstrate that if isothermal boundaries can be achieved, the heat transfer capacity of the chassis will increase relative to isoflux boundary condition assumptions. As a means to this end, the incorporation of heat pipes into the chassis wall is explored to enhance heat spreading and approach the isothermal limits of heat dissipation in the airflow ducts.

scholarly journals Optimization of Insulated Gate Bipolar Transistor System to Maximize Heat Dissipation

2021 ◽  
Vol 2070 (1) ◽  
pp. 012245
Author(s):  
Pritam V. Mali ◽  
Harshvardhan H. Patil ◽  
Girish B. Pawar ◽  
Yuvaraj P. Ballal ◽  
Pradip B. Patil
Keyword(s):  
Heat Dissipation ◽  
Removal Rate ◽  
Pure Copper ◽  
Heat Removal ◽  
Bipolar Transistor ◽  
Air Cooling ◽  
Maximum Heat ◽  
Insulated Gate Bipolar Transistor ◽  
Igbt Modules ◽  
Forced Air

Abstract An electric motor, a battery and an inverter are the key components of any hybrid vehicle. The most commonly used switching device in the electric power conversion system is Insulated Gate Bipolar Transistor (IGBT) modules. Heat sinks with their fins are optimized to provide the maximum heat flow to the surrounding and Pure copper is used as it has high thermal conductivity with reasonable heat resistance. This helps to decrease the temperature of the IGBT and heat will spread to the fins. Parallel forced air cooling is utilised to give maximum possible heat removal rate. Further experimentation was done on a IGBT using an Inverter circuit and it was analyzed on ANSYS software and it was observed that the results obtained by numerical method and experimental method are approximately same.

The forced air cooling heat dissipation performance of different battery pack bottom duct

2018 ◽  
Vol 42 (12) ◽  
pp. 3823-3836 ◽  
Author(s):  
Xu Xiaoming ◽  
Tang Wei ◽  
Fu Jiaqi ◽  
Hu Donghai ◽  
Sun Xudong
Keyword(s):  
Heat Dissipation ◽  
Battery Pack ◽  
Air Cooling ◽  
Forced Air
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