Improved Large-Scale Liquid-Phase Synthesis and High-Temperature NMR Characterization of Short ­(F-)PNAs

2011 ◽  
Vol 94 (11) ◽  
pp. 1952-1980 ◽  
Author(s):  
Tobias A. Plöger ◽  
Günter von Kiedrowski
2009 ◽  
Vol 45 (5) ◽  
pp. 506-510 ◽  
Author(s):  
V. A. Gorshkov ◽  
V. I. Yukhvid ◽  
N. T. Andrianov ◽  
E. S. Lukin

1996 ◽  
Vol 6 (8) ◽  
pp. 1391-1393 ◽  
Author(s):  
Yong Yue ◽  
Heyong He ◽  
Jacek Klinowski ◽  
Yuanwen Wu ◽  
Hanrui Zhuang

1995 ◽  
Vol 351 (2-3) ◽  
pp. 260-270 ◽  
Author(s):  
H. Seliger ◽  
E. G�ldner ◽  
I. Kittel ◽  
B. Plage ◽  
H. -R. Schulten

1993 ◽  
Vol 21 (5) ◽  
pp. 1213-1217 ◽  
Author(s):  
Gian Maria Bonora ◽  
Giancarlo Biancotto ◽  
Mauro Maffini ◽  
Carlo Luigi Scremin

Author(s):  
Duygu Yılmaz Aydın ◽  
◽  
Metin Gürü ◽  

In this study, zinc fluoroborate was synthesized by wet method using fluoroboric acid and zinc oxide as reactant and its usability as flame retardant for cotton fabrics was investigated. The wet method is economical, green, efficient and applicable for a large-scale. The maximum yield was determined related to the variation of reactant ratio, temperature, reaction period and stirrer rate. The characterization of the product was carried out by means of FTIR, BF4- ion selective electrode and XRD. The maximum yield of 97% was achieved at the reactant mole ratio (nZnO/nHBF4) of 1:3, temperature of 90 °C and reaction period of 90 minutes. The purity of the synthesized product was found as 98 %. Flame retardancy and high temperature resistance effects of zinc fluoroborate on cotton fabrics were investigated by LOI test and high temperature durability test method, respectively. Although LOI value of the untreated original fabric was determined as 16, this value increased above 55 by impregnating of fabric with 50 % zinc fluoroborate solution.


Author(s):  
Sara Drioli ◽  
Ilaria Adamo ◽  
Maurizio Ballico ◽  
François Morvan ◽  
Gian M. Bonora

Author(s):  
Simon Thomas

Trends in the technology development of very large scale integrated circuits (VLSI) have been in the direction of higher density of components with smaller dimensions. The scaling down of device dimensions has been not only laterally but also in depth. Such efforts in miniaturization bring with them new developments in materials and processing. Successful implementation of these efforts is, to a large extent, dependent on the proper understanding of the material properties, process technologies and reliability issues, through adequate analytical studies. The analytical instrumentation technology has, fortunately, kept pace with the basic requirements of devices with lateral dimensions in the micron/ submicron range and depths of the order of nonometers. Often, newer analytical techniques have emerged or the more conventional techniques have been adapted to meet the more stringent requirements. As such, a variety of analytical techniques are available today to aid an analyst in the efforts of VLSI process evaluation. Generally such analytical efforts are divided into the characterization of materials, evaluation of processing steps and the analysis of failures.


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