Three-dimensional high-conductivity trees for volumetric cooling

2014 ◽  
Vol 38 (12) ◽  
pp. 1571-1577 ◽  
Author(s):  
Erdal Cetkin
Keyword(s):  
Three Dimensional ◽  
High Conductivity ◽  
Volumetric Cooling

Hierarchically Three-Dimensional Nanofiber Based Textile with High Conductivity and Biocompatibility As a Microbial Fuel Cell Anode

2016 ◽  
Vol 50 (14) ◽  
pp. 7889-7895 ◽  
Author(s):  
Yifei Tao ◽  
Qiongzhen Liu ◽  
Jiahui Chen ◽  
Bo Wang ◽  
Yuedan Wang ◽  
...  
Keyword(s):  
Fuel Cell ◽  
Microbial Fuel Cell ◽  
Three Dimensional ◽  
High Conductivity ◽  
Cell Anode ◽  
Fuel Cell Anode

scholarly journals Lightweight, interconnected VO2 nanoflowers hydrothermally grown on 3D graphene networks for wide-voltage-window supercapacitors

RSC Advances ◽  
2017 ◽  
Vol 7 (56) ◽  
pp. 35558-35564 ◽  
Author(s):  
Junya Wang ◽  
Xuetao Zhang ◽  
Yue Zhang ◽  
Asim Abas ◽  
Xiaohua Zhao ◽  
...  
Keyword(s):  
Three Dimensional ◽  
High Conductivity ◽  
Supercapacitor Electrode ◽  
3D Graphene

Highly stable and interconnected VO2 nanoflowers were uniformly grown on flexible three dimensional graphene networks, which directly served as a lightweight and high conductivity supercapacitor electrode (VO2 NF@3DG).

Constructal Placement of High-Conductivity Inserts in a Slab: Optimal Design of “Roughness”

2001 ◽  
Vol 123 (6) ◽  
pp. 1184-1189 ◽  
Author(s):  
M. Neagu and ◽  
A. Bejan
Keyword(s):  
Numerical Simulation ◽  
Heat Conduction ◽  
Optimal Design ◽  
Contact Resistance ◽  
Rough Surface ◽  
Fundamental Problem ◽  
Three Dimensional ◽  
High Conductivity ◽  
Constant Thickness ◽  
Two Dimensional

This paper addresses the fundamental problem of how to facilitate the flow of heat across a conducting slab heated from one side. Available for distribution through the system is a small amount of high-conductivity material. The constructal method consists of optimizing geometrically the distribution of the high-conductivity material through the material of lower conductivity. Two-dimensional distributions (plate inserts) and three-dimensional distributions (pin inserts) are optimized based on the numerical simulation of heat conduction in a large number of possible configurations. Results are presented for the external and internal features of the optimized architectures: spacings between inserts, penetration distances, tapered inserts and constant-thickness inserts. The use of optimized pin inserts leads consistently to lower global thermal resistances than the use of plate inserts. The side of the slab that is connected to the high-conductivity intrusions is in effect a “rough” surface. This paper shows that the architecture of a rough surface can be optimized for minimum global contact resistance. Roughness can be designed.

Constructal Three-Dimensional Trees for Conduction Between a Volume and One Point

1998 ◽  
Vol 120 (4) ◽  
pp. 977-984 ◽  
Author(s):  
G. A. Ledezma ◽  
A. Bejan
Keyword(s):  
Heat Conduction ◽  
Thermal Resistance ◽  
Building Block ◽  
Heat Sink ◽  
Three Dimensional ◽  
Finite Size ◽  
Building Blocks ◽  
Volume Element ◽  
High Conductivity ◽  
The Given

This paper extends to three-dimensional heat conduction the geometric “constructal” method of minimizing the overall thermal resistance between a finite-size volume and a small heat sink. The volume contains (i) low-conductivity material that generates heat at every point, and (ii) a small amount of high-conductivity material that must be distributed optimally in space. The given volume is covered in a sequence of building blocks (volume sizes) that starts with the smallest volume element, and continues toward larger assemblies. It is shown that the overall shape of each building block can be optimized for minimal volume-to-point resistance. The relative thicknesses of the high-conductivity paths can also be optimized. These optima are developed analytically and numerically for the smallest elemental volume and the first assembly. The high-conductivity paths form a tree network that is completely deterministic.

Development of a Microfluidic Device Embedding High-Conductivity Flexible Electrodes for Three-Dimensional Cell Culture Stimulations

2012 ◽  
Author(s):  
Marco Rasponi ◽  
Francesco Piraino ◽  
Nicola Cagol ◽  
Matteo Moretti ◽  
Gianfranco B. Fiore ◽  
...  
Keyword(s):  
Tissue Engineering ◽  
Cell Culture ◽  
Cardiac Tissue ◽  
Three Dimensional ◽  
Stem Cell Differentiation ◽  
High Conductivity ◽  
Simple Method ◽  
Beneficial Effects ◽  
Flexible Material ◽  
Macro Scale

Successful treatment of cardiovascular diseases has so far been limited by the lack of suitable autologous tissue to restore injured tissues. Currently, a novel encouraging frontier for such treatment is represented by tissue engineering [1]. Although traditional bioreactors for cardiac tissue engineering, based on a classical macro-scale approach, are widely used, research for identifying effective stimulation patterns has not lead to robust results yet. In this sense, the phenomena driving cell growth and differentiation become more addressable in reduced-scale systems, and microfluidics represents a valid alternative approach to overcome traditional bioreactors limitations. In order to favor the differentiation paths, recently developed microfluidic bioreactors tend to increase the control within cell culture chambers by coupling mechanical, electrical, thermical or optical effects. In particular, stem cell differentiation into cardiomyocytes seems to draw beneficial effects from electrical and mechanical stimulations [2]. This work introduces a simple method of embedding conductive and flexible material within microfluidic devices as a means to realize microscale bioreactors for cell electro-mechanical stimulation. Thanks to the proposed technology, high conductivity three-dimensional (3D) electrodes can be simply realized.

A Comparison of Thermal Dispersion Behaviour in High-Conductivity Porous Media of Various Pore Geometries

2012 ◽  
Vol 326-328 ◽  
pp. 307-312
Author(s):  
Christopher T. DeGroot ◽  
Anthony G. Straatman
Keyword(s):  
Porous Media ◽  
Three Dimensional ◽  
High Conductivity ◽  
Circular Cylinders ◽  
Pore Geometry ◽  
Thermal Dispersion ◽  
Equilibrium Conditions ◽  
Solid Constituent ◽  
Prandtl Numbers ◽  
Graphite Foam

The effect of pore geometry on the axial thermal dispersion conductivity for high-conductivity porous media under general thermal non-equilibrium conditions is studied numerically. Pore geometries including arrays of inline square and circular cylinders, staggered circular cylinders, and a three-dimensional idealization of a graphite foam pore geometry are used to study the effects of the solid constituent shape and arrangement, as well as the effect of a relatively complex three-dimensional pore structure. Results indicate that in general, the dispersion conductivity cannot be considered a simple function of the Péclet number due to the effects of inertia, which cause the dispersion behaviour to depend on both the Reynolds and Prandtl numbers. On the basis of the current results, it is recommended that the influences of the Reynolds and Prandtl numbers be considered separately when generating models for the dispersion conductivity.

The orbit of Pluto over a long interval of time

1966 ◽  
Vol 25 ◽  
pp. 227-229 ◽  
Author(s):  
D. Brouwer
Keyword(s):  
Periodic Orbit ◽  
Numerical Integration ◽  
Restricted Problem ◽  
Three Dimensional ◽  
The Third ◽  
Circular Restricted Problem ◽  
Resonance Relation

The paper presents a summary of the results obtained by C. J. Cohen and E. C. Hubbard, who established by numerical integration that a resonance relation exists between the orbits of Neptune and Pluto. The problem may be explored further by approximating the motion of Pluto by that of a particle with negligible mass in the three-dimensional (circular) restricted problem. The mass of Pluto and the eccentricity of Neptune's orbit are ignored in this approximation. Significant features of the problem appear to be the presence of two critical arguments and the possibility that the orbit may be related to a periodic orbit of the third kind.

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