Evaluation of analog printed circuit board wiring routes by surface charge modeling method and applicatuion to the determination of wiring

1995 ◽  
Vol 78 (4) ◽  
pp. 28-41 ◽  
Author(s):  
Masatoshi Kasuga ◽  
Isamu Konta ◽  
Jin-Ichi Matsuda
Keyword(s):  
Surface Charge ◽  
Printed Circuit Board ◽  
Modeling Method ◽  
Circuit Board ◽  
Printed Circuit

404 Modeling Method of the Printed Circuit Board with Some Kind of Arrangements of Thermal Via Holes

2010 ◽  
Vol 2010.47 (0) ◽  
pp. 129-130
Author(s):  
Sadakazu TAKAKUWA ◽  
Masaru ISHIZUKA ◽  
Shinji NAKAGAWA ◽  
Tomoyuki HATAKEYAMA
Keyword(s):  
Printed Circuit Board ◽  
Modeling Method ◽  
Circuit Board ◽  
Printed Circuit ◽  
Via Holes

scholarly journals Equivalent modeling method of printed circuit board interference source based on magnetic dipole array

2014 ◽  
Vol 63 (12) ◽  
pp. 124102
Author(s):  
Cao Zhong ◽  
Du Ping-An ◽  
Nie Bao-Lin ◽  
Ren Dan ◽  
Zhang Qi-Dao
Keyword(s):  
Magnetic Dipole ◽  
Printed Circuit Board ◽  
Modeling Method ◽  
Circuit Board ◽  
Printed Circuit

Stereoimaging Determination of Strains in Surface Mounted Components and Plated Through Holes Resulting from Thermal Cycung

1991 ◽  
Vol 226 ◽  
Author(s):  
David L. Davidson
Keyword(s):  
Printed Circuit Board ◽  
High Spatial Resolution ◽  
Circuit Board ◽  
Depth Of Field ◽  
Scanning Microscope ◽  
Printed Circuit ◽  
Plated Through Hole ◽  
Microelectronic Components ◽  
Through Hole

AbstractThe experimental mechanics of microelectronics components requires high spatial resolution measurements that are best obtained by using the scanning microscope because of the high spacial resolution and depth of field obtained using this instrument. This paper describes how measurements made from photographs taken in the scanning electron microscope have been used successfully to determine the strains which develop due to differences in coefficient of thermal between various parts of microelectronic components. Results are presented for thermal strains in the solder joints of a surface mounted component and in a printed circuit board plated through hole.

scholarly journals Determination of the potential gold electrowinning from an ammoniacal thiosulphate solution applied to recycling of printed circuit board scraps

2015 ◽  
Vol 34 (1) ◽  
pp. 47-57 ◽  
Author(s):  
Angela C Kasper ◽  
Jordi Carrillo Abad ◽  
Montserrat García Gabaldón ◽  
Hugo M Veit ◽  
Valentín Pérez Herranz
Keyword(s):  
Printed Circuit Board ◽  
Circuit Board ◽  
Printed Circuit
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