scholarly journals Development of heat dissipation multilayer media for magnetic hologram memory

2020 ◽  
Vol 103 (7) ◽  
pp. 22-29
Author(s):  
Yuichi Nakamura ◽  
Pang Boey Lim ◽  
Taichi Goto ◽  
Hironaga Uchida ◽  
Mitsuteru Inoue
Keyword(s):  
Heat Dissipation ◽  
Multilayer Media

scholarly journals Development of Heat Dissipation Multilayer Media for Volumetric Magnetic Hologram Memory

2019 ◽  
Vol 9 (9) ◽  
pp. 1738 ◽  
Author(s):  
Nakamura ◽  
Lim ◽  
Goto ◽  
Uchida ◽  
Inoue
Keyword(s):  
Diffraction Efficiency ◽  
Heat Dissipation ◽  
Data Transfer ◽  
Single Layer ◽  
Heat Diffusion ◽  
Holographic Memory ◽  
Recording Process ◽  
Layer Medium ◽  
Strong Candidate ◽  
Multilayer Media

Holographic memory is a strong candidate for next-generation optical storage, featuring high recording densities and data transfer rates, and magnetic hologram memory using a magnetic garnet, as the recording material is expected to be used as a rewritable and stable storage technology. However, the diffraction efficiency of magnetic holography depending on the Faraday rotation angle is insufficiently high for actual storage devices. To increase the diffraction efficiency, it is important to record deep magnetic fringes, whereas it is necessary to suppress the merging of fringes owing to heat diffusion near the medium surface. In this work, we investigated the recording process of magnetic holograms in detail with experiments and numerical simulations, and developed a multilayer media with transparent heat dissipation layers to record deep and clear magnetic holograms by controlling the heat diffusion generated during the thermomagnetic recording process. To suppress lateral heat diffusion near the medium surface, we designed and fabricated a multilayer magnetic medium in which the recording magnetic layers are discrete in a film, approximately 12-µm thick. This medium exhibited diffraction efficiency higher than that of the single-layer medium, and error-free recording and reconstruction were achieved using the magnetic assist technique.

Integration of pure copper to optimize heat dissipation in injection mould inserts using laser metal deposition

2021 ◽  
Vol 33 (1) ◽  
pp. 012029
Author(s):  
Stefan Polenz ◽  
Christian Kolbe ◽  
Florian Bittner ◽  
Elena López ◽  
Frank Brückner ◽  
...  
Keyword(s):  
Heat Dissipation ◽  
Pure Copper ◽  
Metal Deposition ◽  
Laser Metal Deposition ◽  
Injection Mould

3D Integrated Power—A Discrete Perspective

2015 ◽  
Author(s):  
Ian Kearney ◽  
Stephen Brink
Keyword(s):  
Heat Dissipation ◽  
Automatic Test Equipment ◽  
Systematic Analysis ◽  
Power Mosfet ◽  
Root Cause ◽  
Industry Standard ◽  
Bona Fide ◽  
Process Issue ◽  
Board Level ◽  
3D Package

Abstract The shift in power conversion and power management applications to thick copper clip technologies and thinner silicon dies enable high-current connections (overcoming limitations of common wire bond) and enhance the heat dissipation properties of System-in-Package solutions. Powerstage innovation integrates enhanced gate drivers with two MOSFETs combining vertical current flow with a lateral power MOSFET. It provides a low on-resistance and requires an extremely low gate charge with industry-standard package outlines - a combination not previously possible with existing silicon platforms. These advancements in both silicon and 3D Multi-Chip- Module packaging complexity present multifaceted challenges to the failure analyst. The various height levels and assembly interfaces can be difficult to deprocess while maintaining all the critical evidence. Further complicating failure isolation within the system is the integration of multiple chips, which can lead to false positives. Most importantly, the discrete MOSFET all too often gets overlooked as just a simple threeterminal device leading to incorrect deductions in determining true root cause. This paper presents the discrete power MOSFET perspective amidst the competing forces of the system-to-board-level failure analysis. It underlines the requirement for diligent analysis at every step and the importance as an analyst to contest the conflicting assumptions of challenging customers. Automatic Test Equipment (ATE) data-logs reported elevated power MOSFET leakage. Initial assumptions believed a MOSFET silicon process issue existed. Through methodical anamnesis and systematic analysis, the true failure was correctly isolated and the power MOSFET vindicated. The authors emphasize the importance of investigating all available evidence, from a macro to micro 3D package perspective, to achieve the bona fide path forward and true root cause.

Effect of Plated Helix on Heat Dissipation Capability of the Slow-Wave Circuit

2011 ◽  
Vol 30 (8) ◽  
pp. 2029-2032
Author(s):  
Yong Han ◽  
Yan-wen Liu ◽  
Yao-gen Ding ◽  
Pu-kun Liu ◽  
Chun-hua Lu ◽  
...  
Keyword(s):  
Slow Wave ◽  
Heat Dissipation

DESIGN AND THERMAL ANALYSIS OF BRAKE ROTOR WITH DIFFERENT MATERIALS

2020 ◽  
Vol 15 (2) ◽  
Author(s):  
Sugunarani S ◽  
Santhosh V
Keyword(s):  
Temperature Distribution ◽  
Heat Dissipation ◽  
Brake Disc ◽  
Element Analysis ◽  
Analysis Techniques ◽  
Engineering Software ◽  
The Finite Element Analysis ◽  
Brake Rotor ◽  
Grey Cast ◽  
Aluminium Metal

This work deals with the analysis of heat generation and dissipation in the disc brake of a car during braking and the following release period by using computer-aided engineering software for three different materials of the rotor disc and brake pad. The objective of this work is to analyze the temperature distribution of rotor disc during operation using COMSOL Multiphysics. The work uses the finite element analysis techniques to calculate and predict the temperature distribution on the brake disc and to identify the critical temperature of the brake rotor disc. Conduction, convection and radiation of heat transfer have been analyzed. The results obtained from the analysis indicates that different material on the same retardation of the car during braking shows different temperature distribution. A comparative study was made between grey cast iron (GCI), Aluminium Metal Matrix Composite (AMMC), Alloy steel materials are used for brake disc and the best material for making brake disc based on the rate of heat dissipation have been suggested.

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