Nanostructured Copper Surface Kills ESKAPE Pathogens and Virues in Minutes

ChemMedChem ◽  
2021 ◽  
Author(s):  
Guangshun Yi ◽  
siti Riduan ◽  
Arunmozhiarasi Armugam ◽  
Jin Ting Ong ◽  
Pei Yun Hon ◽  
...  
Keyword(s):  
Copper Surface ◽  
Eskape Pathogens ◽  
Nanostructured Copper

ESKAPE pathogens among pediatric patients in Iraq

2020 ◽  
Vol 23 (16) ◽  
Author(s):  
Amel Mohamed-Saed Al-Musawi ◽  
Alaa H. Al-Charrakh ◽  
Adnan H. Al-Juwethry
Keyword(s):  
Pediatric Patients ◽  
Eskape Pathogens

scholarly journals Improved Copper–Epoxy Adhesion by Laser Micro- and Nano-Structuring of Copper Surface for Thermal Applications

Polymers ◽  
2021 ◽  
Vol 13 (11) ◽  
pp. 1721
Author(s):  
Mario Mora ◽  
Hippolyte Amaveda ◽  
Luis Porta-Velilla ◽  
Germán F. de la Fuente ◽  
Elena Martínez ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Bonding Strength ◽  
Copper Surface ◽  
Heat Sinks ◽  
Electrical Insulation ◽  
Cryogenic Temperatures ◽  
Shear Tests ◽  
Patterned Structures ◽  
Different Temperatures ◽  
Mechanical Tensile

The objective of this work is the enhancement of metal-to-metal bonding to provide high thermal conductivity together with electrical insulation, to be used as heat sinks at room and cryogenic temperatures. High thermal conductive metal (copper) and epoxy resin (Stycast 2850FT) were used in this study, with the latter also providing the required electrical insulation. The copper surface was irradiated with laser to induce micro- and nano-patterned structures that result in an improvement of the adhesion between the epoxy and the copper. Thus, copper-to-copper bonding strength was characterized by means of mechanical tensile shear tests. The effect of the laser processing on the thermal conductivity properties of the Cu/epoxy/Cu joint at different temperatures, from 10 to 300 K, is also reported. Using adequate laser parameters, it is possible to obtain high bonding strength values limited by cohesive epoxy fracture, together with good thermal conductivity at ambient and cryogenic temperatures.

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