ChemInform Abstract: From Phosphine-Promoted to Phosphine-Catalyzed Reactions by in situ Phosphine Oxide Reduction

ChemInform ◽  
2016 ◽  
Vol 47 (46) ◽  
Author(s):  
Arnaud Voituriez ◽  
Nidal Saleh
Keyword(s):  
Phosphine Oxide ◽  
Oxide Reduction ◽  
Catalyzed Reactions

In Situ Phosphine Oxide Reduction: A Catalytic Appel Reaction

2011 ◽  
Vol 17 (40) ◽  
pp. 11290-11295 ◽  
Author(s):  
Henri A. van Kalkeren ◽  
Stefan H. A. M. Leenders ◽  
C. Rianne A. Hommersom ◽  
Floris P. J. T. Rutjes ◽  
Floris L. van Delft
Keyword(s):  
Phosphine Oxide ◽  
Oxide Reduction

Synthesis of Bifunctional Au/Pt/Au Core/Shell Nanoraspberries for in Situ SERS Monitoring of Platinum-Catalyzed Reactions

2011 ◽  
Vol 133 (48) ◽  
pp. 19302-19305 ◽  
Author(s):  
Wei Xie ◽  
Christoph Herrmann ◽  
Karsten Kömpe ◽  
Markus Haase ◽  
Sebastian Schlücker
Keyword(s):  
Core Shell ◽  
Catalyzed Reactions

In situ surface oxide reduction with pulsed arc discharge for maximum adhesion of diamond-like carbon coatings

2008 ◽  
Vol 17 (12) ◽  
pp. 2071-2074 ◽  
Author(s):  
Veli-Matti Tiainen ◽  
Antti Soininen ◽  
Esa Alakoski ◽  
Yrjö T. Konttinen
Keyword(s):  
Arc Discharge ◽  
Surface Oxide ◽  
Diamond Like Carbon ◽  
Oxide Reduction ◽  
Carbon Coatings ◽  
Pulsed Arc Discharge ◽  
Pulsed Arc

In situ determination of the electrochemically active platinum surface area: key to improvement of solid acid fuel cells

2018 ◽  
Vol 6 (6) ◽  
pp. 2700-2707 ◽  
Author(s):  
Felix P. Lohmann-Richters ◽  
Bernd Abel ◽  
Áron Varga
Keyword(s):  
Fuel Cells ◽  
Solid Electrolyte ◽  
Surface Area ◽  
Solid Acid ◽  
Oxide Reduction ◽  
Electrolyte System ◽  
Platinum Surface ◽  
Electrochemically Active

Surface oxide reduction is demonstrated for measuring the active Pt surface area in a solid electrolyte system at 240 °C.

3D-IC Integration Using D2C or D2W Alignment Schemes Together with Local Oxide Reduction

2011 ◽  
Vol 2011 (DPC) ◽  
pp. 001291-001315
Author(s):  
Gilbert Lecarpentier ◽  
Jean-Stephane Mottet ◽  
Keith Cooper ◽  
Michael Stead
Keyword(s):  
Integrated Circuits ◽  
High Density ◽  
Oxide Reduction ◽  
3D Ic ◽  
3 Dimensional ◽  
Temperature Requirements

3-Dimensional interconnection of high density integrated circuits enables building devices with greater functionality with higher performances in a smaller space. This paper explores the chip-to-chip and chip-to-wafer alignment and the associated bonding techniques such as in-situ reflow or thermocompression with a local oxide reduction which contributes to higher yield together with reduction of the force or temperature requirements.

scholarly journals Poly(methylhydrosiloxane) as a green reducing agent in organophosphorus-catalysed amide bond formation

2017 ◽  
Vol 15 (30) ◽  
pp. 6426-6432 ◽  
Author(s):  
Daan F. J. Hamstra ◽  
Danny C. Lenstra ◽  
Tjeu J. Koenders ◽  
Floris P. J. T. Rutjes ◽  
Jasmin Mecinović
Keyword(s):  
Carboxylic Acids ◽  
Phosphine Oxide ◽  
Bond Formation ◽  
Reducing Agent ◽  
Amide Bond ◽  
Amide Bond Formation ◽  
Amidation Reaction

In situ reduction of phosphine oxide by poly(methylhydrosiloxane) leads to efficient amidation reaction between carboxylic acids and amines.

scholarly journals In-situ Atomic-Resolution Observations of Oxide-Reduction Induced Formation of Nano-Holes in Cu2O Thin Films

2018 ◽  
Vol 24 (S1) ◽  
pp. 1816-1817
Author(s):  
Xiaobo Chen ◽  
Dongxiang Wu ◽  
Lianfeng Zou ◽  
Qiyue Yin ◽  
Hanlei Zhang ◽  
...  
Keyword(s):  
Thin Films ◽  
Atomic Resolution ◽  
Oxide Reduction ◽  
Cu2o Thin Films
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