ChemInform Abstract: THERMAL STRESSES IN HETEROEPITAXIAL BETA-SILICON CARBIDE THIN FILMS GROWN ON SILICON SUBSTRATES

1985 ◽  
Vol 16 (15) ◽  
Author(s):  
H. P. LIAW ◽  
R. F. DAVIS
Keyword(s):  
Thin Films ◽  
Silicon Carbide ◽  
Thermal Stresses ◽  
Silicon Substrates

scholarly journals Влияние ориентации кремниевой подложки с буферным подслоем карбида кремния на диэлектрические и полярные свойства пленок нитрида алюминия

2019 ◽  
Vol 61 (12) ◽  
pp. 2379
Author(s):  
О.Н. Сергеева ◽  
А.В. Солнышкин ◽  
Д.А. Киселев ◽  
Т.С. Ильина ◽  
С.А. Кукушкин ◽  
...  
Keyword(s):  
Thin Films ◽  
Silicon Carbide ◽  
Aluminum Nitride ◽  
Buffer Layer ◽  
Thin Layers ◽  
Silicon Substrates ◽  
Pyroelectric Effect ◽  
Force Microscopy ◽  
Piezoelectric Force Microscopy ◽  
P Type

The dielectric and polar properties of thin films of aluminum nitride (AlN) epitaxially grown on variously oriented p-type silicon substrates with a buffer sublayer of silicon carbide (SiC), as well as on vicinal planes, are studied. According to the results of studies of the polar properties by two independent methods — the dynamic pyroelectric effect and piezoelectric force microscopy, it was shown that the use of a SiC buffer layer significantly improves the polar properties of thin layers of aluminum nitride.

Finite-Element Modeling and Quantitative Measurement Using Scanning Microwave Microscopy to Characterize Dielectric Films

2018 ◽  
Author(s):  
K. A. Rubin ◽  
W. Jolley ◽  
Y. Yang
Keyword(s):  
Thin Films ◽  
Dielectric Film ◽  
Dielectric Constants ◽  
Dielectric Films ◽  
Silicon Substrates ◽  
Fem Modeling ◽  
Dielectric Thin Films ◽  
Microwave Microscopy ◽  
Scanning Microwave Microscopy ◽  
Low K

Abstract Scanning Microwave Impedance Microscopy (sMIM) can be used to characterize dielectric thin films and to quantitatively discern film thickness differences. FEM modeling of the sMIM response provides understanding of how to connect the measured sMIM signals to the underlying properties of the dielectric film and its substrate. Modeling shows that sMIM can be used to characterize a range of dielectric film thicknesses spanning both low-k and medium-k dielectric constants. A model system consisting of SiO2 thin films of various thickness on silicon substrates is used to illustrate the technique experimentally.

Thermodynamics and Microstructure Development in the Thin Film Reaction of Aluminum on Silicon Carbide

1995 ◽  
Vol 403 ◽  
Author(s):  
T. S. Hayes ◽  
F. T. Ray ◽  
K. P. Trumble ◽  
E. P. Kvam
Keyword(s):  
Thin Film ◽  
Thin Films ◽  
Silicon Carbide ◽  
Ohmic Contacts ◽  
Microstructure Development ◽  
P Type ◽  
Microstructural Studies

AbstractA refined thernodynamic analysis of the reaction between molen Al and SiC is presented. The calculations indicate much higher Si concentrations for saturation with respect to AkC 3 formation than previously reported. Preliminary microstructural studies confirm the formation of interfacial A14C3 for pure Al thin films on SiC reacted at 9000C. The implications of the calculations and experimental observations for the production of ohmic contacts to p-type SiC are discussed.

Structural relaxation of amorphous silicon carbide thin films in thermal annealing

2008 ◽  
Vol 516 (12) ◽  
pp. 3855-3861 ◽  
Author(s):  
Kun Xue ◽  
Li-Sha Niu ◽  
Hui-Ji Shi ◽  
Jiwen Liu
Keyword(s):  
Thin Films ◽  
Silicon Carbide ◽  
Amorphous Silicon ◽  
Thermal Annealing ◽  
Structural Relaxation ◽  
Amorphous Silicon Carbide
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