Thermal and dielectric properties enhancement of photocurable acrylate polymers for digital light processing 3D printed electronics

3D printable, flexible, and conductive composites are prepared by incorporating a thermoplastic elastomer and electrically conductive carbon fillers. The advantageous printability, workability, chemical resistance, electrical conductivity, and biocompatibility components allowed for an enabling of 3D-printed electronics, electromagnetic interference (EMI) shielding, static elimination, and biomedical sensors. Carbon-infused thermoplastic polyurethane (C/TPU) composites have been demonstrated to possess right-strained sensing abilities and are the candidate in fields such as smart textiles and biomedical sensing. Flexible and conductive composites were prepared by a mechanical blending of biocompatible TPU and carbons. 3D structures that exhibit mechanical flexibility and electric conductivity were successfully printed. Three different types of C/TPU composites, carbon nanotube (CNT), carbon black (CCB), and graphite (G) were prepared with differentiating sizes and composition of filaments. The conductivity of TPU/CNT and TPU/CCB composite filaments increased rapidly when the loading amount of carbon fillers exceeded the filtration threshold of 8%–10% weight. Biocompatible G did not form a conductive pathway in the TPU; resistance to indentation deformation of the TPU matrix was maintained by weight by 40%. Adding a carbon material to the TPU improved the mechanical properties of the composites, and carbon fillers could improve electrical conductivity without losing biocompatibility. For the practical use of the manufactured filaments, optimal printing parameters were determined, and an FDM printing condition was adjusted. Through this process, a variety of soft 3D-printed C/TPU structures exhibiting flexible and robust features were built and tested to investigate the performance of the possible application of 3D-printed electronics and medical scaffolds.

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Toward 3D‐Printed Electronics: Inkjet‐Printed Vertical Metal Wire Interconnects and Screen‐Printed Batteries

Advanced Engineering Materials ◽

10.1002/adem.201900568 ◽

2019 ◽

Vol 21 (10) ◽

pp. 1900568 ◽

Cited By ~ 2

Author(s):

Enrico Sowade ◽

Maxim Polomoshnov ◽

Andreas Willert ◽

Reinhard R. Baumann

Keyword(s):

Printed Electronics ◽

Metal Wire ◽

3D Printed ◽

3D Printed Electronics ◽

Screen Printed

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Full-3D printed electronics process using stereolitography and electroless plating

2017 32nd Conference on Design of Circuits and Integrated Systems (DCIS) ◽

10.1109/dcis.2017.8311624 ◽

2017 ◽

Cited By ~ 3

Author(s):

A. Salas-Barenys ◽

N. Vidal ◽

J. Sieiro ◽

J. M. Lopez-Villegas ◽

B. Medina-Rodriguez ◽

...

Keyword(s):

Electroless Plating ◽

Printed Electronics ◽

3D Printed ◽

3D Printed Electronics

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Residual polymer stabiliser causes anisotropic conductivity in metal nanoparticle 2D and 3D printed electronics

10.21203/rs.3.rs-86443/v1 ◽

2020 ◽

Author(s):

Gustavo Trindade ◽

Feiran Wang ◽

Jisun Im ◽

Yinfeng He ◽

Adam Balogh ◽

...

Keyword(s):

Printed Electronics ◽

Metal Nanoparticle ◽

Anisotropic Conductivity ◽

Design Flexibility ◽

3D Printed ◽

Multiple Materials ◽

Traditional Manufacturing ◽

Rapid Processing ◽

3D Printed Electronics ◽

2D And 3D

Abstract Inkjet printing of metal nanoparticles (MNPs) allows for design flexibility, rapid processing and enables 3D printing of functional electronic devices through co-deposition of multiple materials. However, the performance of printed devices, especially their conductivity, is lower than those made by traditional manufacturing methods and is previously not fully understood. Here, we revealed that anisotropic electrical conductivity of printed MNPs is caused by organic residuals from MNPs inks. We employed a combination of electrical resistivity tests, morphological analysis and novel 3D nanoscale chemical analysis of printed devices using silver nanoparticles (AgNPs) to show that the polymer stabiliser polyvinylpyrrolidone (PVP) tends to concentrate between vertically stacked AgNPs layers as well as at dielectric/conductive interfaces. The understanding of organic residues behaviour in printed nanoparticles reveal potential new strategies to improve nanomaterial ink formulations for functional printed electronics.

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