Mechanical and dielectric properties of epoxy resin modified using reactive liquid rubber (HTPB)

2011 ◽  
Vol 124 (5) ◽  
pp. 4346-4351 ◽  
Author(s):  
Wenying Zhou ◽  
Jiangtao Cai
2021 ◽  
Vol 60 (5) ◽  
pp. 2178-2186
Author(s):  
Rafał Januszewski ◽  
Michał Dutkiewicz ◽  
Marek Nowicki ◽  
Mariusz Szołyga ◽  
Ireneusz Kownacki

2020 ◽  
Vol 60 (8) ◽  
pp. 1984-1997
Author(s):  
Wenying Zhou ◽  
Xu Li ◽  
Dan Cao ◽  
Ying Li ◽  
Caihua Zhang ◽  
...  

Polymers ◽  
2021 ◽  
Vol 13 (15) ◽  
pp. 2451
Author(s):  
Jianwen Zhang ◽  
Dongwei Wang ◽  
Lujia Wang ◽  
Wanwan Zuo ◽  
Lijun Zhou ◽  
...  

To study the effect of hyperbranched polyester with different kinds of terminal groups on the thermomechanical and dielectric properties of silica–epoxy resin composite, a molecular dynamics simulation method was utilized. Pure epoxy resin and four groups of silica–epoxy resin composites were established, where the silica surface was hydrogenated, grafted with silane coupling agents, and grafted with hyperbranched polyester with terminal carboxyl and terminal hydroxyl, respectively. Then the thermal conductivity, glass transition temperature, elastic modulus, dielectric constant, free volume fraction, mean square displacement, hydrogen bonds, and binding energy of the five models were calculated. The results showed that the hyperbranched polyester significantly improved the thermomechanical and dielectric properties of the silica–epoxy composites compared with other surface treatments, and the terminal groups had an obvious effect on the enhancement effect. Among them, epoxy composite modified by the hyperbranched polyester with terminal carboxy exhibited the best thermomechanical properties and lowest dielectric constant. Our analysis of the microstructure found that the two systems grafted with hyperbranched polyester had a smaller free volume fraction (FFV) and mean square displacement (MSD), and the larger number of hydrogen bonds and greater binding energy, indicating that weaker strength of molecular segments motion and stronger interfacial bonding between silica and epoxy resin matrix were the reasons for the enhancement of the thermomechanical and dielectric properties.


2021 ◽  
Vol 412 ◽  
pp. 128647
Author(s):  
Jingjing Meng ◽  
Pengfei Chen ◽  
Rui Yang ◽  
Linli Dai ◽  
Cheng Yao ◽  
...  

2014 ◽  
Vol 49 (8) ◽  
pp. 3125-3134 ◽  
Author(s):  
Ruijun Gu ◽  
Mohini Sain ◽  
Samir Konar

2018 ◽  
Vol 76 (8) ◽  
pp. 3957-3970 ◽  
Author(s):  
Yang Wang ◽  
Lingjie Zhu ◽  
Jun Zhou ◽  
Beibei Jia ◽  
Yingye Jiang ◽  
...  

1999 ◽  
Vol 119 (7) ◽  
pp. 1011-1018
Author(s):  
Minoru Ezoe ◽  
Sanshiro Yamanaka ◽  
Masataka Tada ◽  
Hideaki Kawamura

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