Preparation and properties of high performance phthalide-containing bismaleimide modified epoxy matrices

2011 ◽  
Vol 121 (6) ◽  
pp. 3122-3130 ◽  
Author(s):  
Xuhai Xiong ◽  
Ping Chen ◽  
Jinxiang Zhang ◽  
Qi Yu ◽  
Baichen Wang
Keyword(s):  
High Performance ◽  
Epoxy Matrices ◽  
Modified Epoxy

Dielectric monitoring of curing of liquid oligomer-modified epoxy matrices

2001 ◽  
Vol 50 (9) ◽  
pp. 957-965 ◽  
Author(s):  
G Kortaberria ◽  
P Arruti ◽  
I Mondragon
Keyword(s):  
Epoxy Matrices ◽  
Modified Epoxy

Control of morphologies and mechanical properties of thermoplastic-modified epoxy matrices by addition of a second thermoplastic

2003 ◽  
Vol 52 (9) ◽  
pp. 1444-1453 ◽  
Author(s):  
G Peña ◽  
A Eceiza ◽  
A Valea ◽  
P Remiro ◽  
P Oyanguren ◽  
...  
Keyword(s):  
Mechanical Properties ◽  
Epoxy Matrices ◽  
Modified Epoxy

scholarly journals Study of heat resistance of epoxy matrix modified by phthalimide for protection of vehicles

2020 ◽  
Vol 99 (3) ◽  
pp. 93-101
Author(s):  
A. Buketov ◽  
A. Sharko ◽  
T. Cherniavska ◽  
T. Ivchenko ◽  
V. Yatsyuk ◽  
...  
Keyword(s):  
Heat Resistance ◽  
Thermophysical Properties ◽  
Epoxy Oligomer ◽  
Thermal Coefficient ◽  
Modified Polymer ◽  
Coefficient Of Linear Expansion ◽  
Main Component ◽  
Epoxy Matrices ◽  
Modified Epoxy ◽  
Allowable Temperature

The perspectives of using new modified polymer-based materials for the restoration of vehicle parts are substantiated in this article. The use of binders based on epoxy diane oligomers is proved to be promising in the formation of anti-corrosion coatings. To improve the properties of epoxy matrices at the preliminary stage of their formation, active additives are introduced. The use of a phthalimide modifier, which contains functional groups active before interfacial interaction, is proved to be promising as well. An epoxy diane oligomer is selected as the binder‘s main component in the formation of composites. The hardener polyethylene polyamine is used for crosslinking the epoxy compositions. It allows to harden materials at room temperatures. The choice of a phthalimide modifier for the improvement of thermophysical properties of the developed materials is substanciated. Heat resistance (according to Martens), glass transition temperature and thermal coefficient of linear expansion of modified epoxy composites are studied. To form a composite material or protective coating with improved thermophysical properties, the modifier phthalimide in the amount of q = 0.25… 0.50 pts. wt. at q = 100 pts. wt. of epoxy oligomer ED-20 should be introduced into the epoxy binder. Based on the tests of thermophysical properties of phthalimide-modified materials, the allowable temperature limits, at which it is possible to use the developed composites, are found.

scholarly journals Preparation and Properties of Toluene-Diisocyanate-Trimer-Modified Epoxy Resin

Polymers ◽  
2019 ◽  
Vol 11 (3) ◽  
pp. 416 ◽  
Author(s):  
Xiongfei Zhang ◽  
Lu Qiao ◽  
Xiaolian Lu ◽  
Linqi Jiang ◽  
Ting Cao
Keyword(s):  
Mechanical Properties ◽  
Corrosion Resistance ◽  
Epoxy Resin ◽  
Network Structure ◽  
High Performance ◽  
Toluene Diisocyanate ◽  
Interpenetrating Network ◽  
Resin Curing ◽  
Modified Epoxy ◽  
Polyurethane Prepolymer

In this paper, a novel modified epoxy resin with an interpenetrating network structure for use as a grouting material with high toughness was prepared by a method of graft copolymerization between polyurethane prepolymer (PUP) trimer and epoxy resin (E-44). Polyurethane prepolymer was synthesized using poly(propylene glycol) (PPG) and 2,4-toluene diisocyanate trimer (TDIT) at 70 °C for 3 h. The graft copolymer was prepared by grafting polyurethane prepolymer onto the side chain of epoxy resin at 110 °C. The mechanical properties, fracture surface morphology, chemical structure, thermal properties, and corrosion resistance of the modified epoxy resin curing products were studied. Due to the beneficial flexible segments and the interpenetrating network structure, the results show that when the ratio of epoxy resin to polyurethane prepolymer is 10:2, the optimum mechanical properties are obtained; these include a compressive resistance of 184.8 MPa, impact property of 76.6 kJ/m2, and elongation at break of 31.5%. At the same time, the modified epoxy resin curing product also has excellent heat and corrosion resistance. This work provides a new method for the study of epoxy resins with high performance.

The study of Thermal Resistant Enhancement of Siloxane-Modified LED Transparent Encapsulants

2007 ◽  
Vol 1007 ◽  
Author(s):  
Kai-Chi Chen ◽  
Chia-Wen Hsu ◽  
Hsun-Tien Li
Keyword(s):  
Thermal Resistance ◽  
High Performance ◽  
Diglycidyl Ether ◽  
Thermal Treatments ◽  
Curing Agent ◽  
C Storage ◽  
Yellow Index ◽  
Modified Epoxy ◽  
Mean Time

ABSTRACTThermal resistant property of siloxane-modified epoxy compositions designed for long-term and high temperature storage was investigated. In this study, we developed two siloxane-modified epoxy compositions to improve the thermal stability of current epoxy encapsulants. One composition contained silicone epoxy, and the other one was cyclic aliphatic siloxane dianhydride.We selected triglycidyl ether terminated Phenylmethylsiloxnae-co-dimethylsiloxne (GT-1000), which was compatible with the diglycidyl ether of bisphenol A epoxy (Epon-828), to partial replaced the epoxy resin and was cured by liquid anhydride (MHHPA). In the mean time, we also synthesized 5, 5'-(1, 1, 3, 3-tetramethyl disiloxane-1, 3-dilyl)-bis-norborane-2, 3-dicarboxylic anhydride (A1) as a co-curing agent to cure Epon-828.The thermal resistance was studied by measuring the increase of yellow index (ΔYI) after thermal treatments. In 110 °C storage experiment for 1000 h, the ΔYI of GT-1000 0.2 equivalent was 1.51, whereas Epon-828/MHHPA (Comp 1) was 6.74. Moreover, The ΔYI of the composition with higher equivalent GT-1000 was only 2.15 after 2000 hours thermal aging. In the cyclic aliphatic siloxane dianhydride co-curing compositions, when A1 was 0.05 and 0.1 equivalent, the ΔYI was 2.28 and 0.72 after 1000 h, respectively. Compared with Comp 1, both GT-1000 and A1 were effective for thermal resistance.In IR-reflow test, the ΔYI of GT-1000/Epon-828/MHHPA= 0.5/0.5/1 was 0.65 and that of Epon-828/MHHPA was 1.49 after 260 °C for 10 seconds. The results revealed that either the siloxane-modified epoxy or siloxane-modified curing agent had excellent thermal resistant property for high performance LED applications.

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