Influence of processing conditions and physicochemical interactions on morphology and fracture behavior of a clay/thermoplastic/thermosetting ternary blend

2010 ◽  
Vol 118 (6) ◽  
pp. 3632-3642 ◽  
Author(s):  
M. Hernandez ◽  
J. Duchet-Rumeau ◽  
H. Sautereau
Keyword(s):  
Fracture Behavior ◽  
Ternary Blend ◽  
Processing Conditions ◽  
Physicochemical Interactions

scholarly journals Fracture Toughness of Vapor Grown Carbon Nanofiber-Reinforced Polyethylene Composites

2009 ◽  
Vol 2009 ◽  
pp. 1-6 ◽  
Author(s):  
A. R. Adhikari ◽  
E. Partida ◽  
T. W. Petty ◽  
R. Jones ◽  
K. Lozano ◽  
...  
Keyword(s):  
Fracture Behavior ◽  
Carbon Nanofiber ◽  
Processing Conditions ◽  
Essential Work ◽  
Essential Work Of Fracture ◽  
Material Evaluation ◽  
Impact Fracture Behavior ◽  
The Impact ◽  
Work Of Fracture ◽  
Vapor Grown Carbon Nanofiber

The impact fracture behavior of a vapor grown carbon nanofiber (VGCNF) reinforced high-density polyethylene (PE) composite was evaluated. The samples consisting of pure PE and composites with 10 wt% and 20 wt% of VGCNFs were prepared by a combination of hot-pressing and extrusion methods. Extrusion was used to produce samples with substantially different shear histories. The fracture behavior of these samples was analyzed using the essential work of fracture (EWF) approach. The results showed an increase of 292% in the essential work of fracture for the loading of 10 wt%. Further increasing fiber loading to 20 wt% caused the essential work of fracture to increase only 193% with respect to the unmodified material. Evaluation of the fracture surface morphology indicated that the fibril frequency and microvoid size within the various fiber loadings depended strongly on processing conditions.

INFLUENCE OF PROCESSING CONDITIONS ON THE STRUCTURAL AND FRACTURE BEHAVIOR OF PP PIPE GRADES

2002 ◽  
Vol 41 (4-6) ◽  
pp. 711-723 ◽  
Author(s):  
E. Nezbedova ◽  
A. Zahradnickova ◽  
P. Bartaskova
Keyword(s):  
Fracture Behavior ◽  
Processing Conditions

Effect of processing conditions on the fracture behavior of Al-5Zn-1.5Mg-1.0Mn-0.35Cu alloy fabricated from recycled beverage cans (RBCs) for bumper beam applications

2021 ◽  
Author(s):  
Abubakar Kazeem ◽  
Mohammed H. Rady ◽  
Nur Azam Badarulzaman ◽  
Wan Fahmin Faiz Wan Ali ◽  
Mohd Azlan Suhaimi ◽  
...  
Keyword(s):  
Fracture Behavior ◽  
Processing Conditions ◽  
Bumper Beam

Study on the effect of processing conditions on the mechanical properties of PP/PC/SEBS ternary blends using Taguchi experimental analysis

e-Polymers ◽  
2010 ◽  
Vol 10 (1) ◽  
Author(s):  
O. Moini Jazani ◽  
A. Arefazar ◽  
M.H. Beheshty
Keyword(s):  
Mechanical Properties ◽  
Impact Strength ◽  
Young Modulus ◽  
Continuous Phase ◽  
Ternary Blend ◽  
Twin Screw Extruder ◽  
Processing Conditions ◽  
Ternary Blends ◽  
Screw Extruder ◽  
Twin Screw

AbstractIn this study, nine ternary polymer blends based on polypropylene (PP)/polycarbonate (PC)/styrene-ethylene-butylene-styrene triblock copolymer (SEBS) with the same compositions (70%wt PP, 15%wt PC, 7.5%wt SEBS and 7.5%wt maleic-anhydride grafted SEBS (SEBS-g-MAH) as a compatibilizer) are prepared using twin screw extruder at different levels of die temperature (235-245- 255 °C), screw speed (70-100-130rpm) and blending sequence (M1-M2-M3) . In M1 procedure, all of the components are dry blended and extruded simultaneously using Brabender twin-screw extruder. In M2 procedure, PC, SEBS, and SEBS-g- MAH minor phases are first pre-blended in twin screw extruder and after granulating are added to PP continuous phase in twin screw extruder. Consequently, in M3 procedure, PP and SEBS-g-MAH are first pre-blended and then are extruded with other components. The influence of these parameters as processing conditions on mechanical properties of PP/PC/SEBS ternary blends is investigated using L9 Taghuchi experimental design. The responding variables are impact strength and tensile properties (young modulus and yield stress) which are influenced by the morphology of ternary blend and the results are used to perform the analysis of variance (ANOVA). It is shown that the resulted morphology, tensile and impact strength are influenced by extrusion variables. Additionally the optimum processing conditions of ternary PP/PC/SEBS blends from Taguchi analysis was achieved.

Formation of defects in implanted hipox-structures

1992 ◽  
Vol 50 (2) ◽  
pp. 1406-1407
Author(s):  
Peter Pegler ◽  
N. David Theodore ◽  
Ming Pan
Keyword(s):  
High Pressure ◽  
Cross Section ◽  
Semiconductor Devices ◽  
Silicon Substrates ◽  
Processing Conditions ◽  
Pressure Oxidation ◽  
Deep Trench ◽  
Local Oxidation ◽  
Trench Isolation ◽  
And Behavior

High-pressure oxidation of silicon (HIPOX) is one of various techniques used for electrical-isolation of semiconductor-devices on silicon substrates. Other techniques have included local-oxidation of silicon (LOCOS), poly-buffered LOCOS, deep-trench isolation and separation of silicon by implanted oxygen (SIMOX). Reliable use of HIPOX for device-isolation requires an understanding of the behavior of the materials and structures being used and their interactions under different processing conditions. The effect of HIPOX-related stresses in the structures is of interest because structuraldefects, if formed, could electrically degrade devices.This investigation was performed to study the origin and behavior of defects in recessed HIPOX (RHIPOX) structures. The structures were exposed to a boron implant. Samples consisted of (i) RHlPOX'ed strip exposed to a boron implant, (ii) recessed strip prior to HIPOX, but exposed to a boron implant, (iii) test-pad prior to HIPOX, (iv) HIPOX'ed region away from R-HIPOX edge. Cross-section TEM specimens were prepared in the <110> substrate-geometry.

A privileged ternary blend enabling non-fullerene organic photovoltaics with over 14% efficiency

2020 ◽  
Vol 8 (43) ◽  
pp. 15135-15141
Author(s):  
Jing Yan ◽  
Yuan-Qiu-Qiang Yi ◽  
Jianqi Zhang ◽  
Huanran Feng ◽  
Yanfeng Ma ◽  
...  
Keyword(s):  
Small Molecule ◽  
Organic Photovoltaics ◽  
Power Conversion ◽  
Ternary Blend ◽  
Conversion Efficiencies

Two non-fullerene small molecule acceptors, NT-4F and NT-4Cl, were designed and synthesized. Power conversion efficiencies of 11.44% and 14.55% were achieved for NT-4Cl-based binary and ternary devices, respectively.

Fracture Behavior of AZ31-xCa (x=0, 0.7, 2.0 wt.%) Extrudes during Compression

2010 ◽  
Vol 48 (1) ◽  
pp. 85-89 ◽  
Author(s):  
Na Eun Kang ◽  
Chang Dong Yim ◽  
Bong Sun You ◽  
Ik Min Park
Keyword(s):  
Fracture Behavior

Progressive Debonding of Multilayer Interconnect Structures

1997 ◽  
Vol 473 ◽  
Author(s):  
Michael Lane ◽  
Robert Ware ◽  
Steven Voss ◽  
Qing Ma ◽  
Harry Fujimoto ◽  
...  
Keyword(s):  
Thin Films ◽  
Crack Growth ◽  
Driving Force ◽  
Adhesion Energy ◽  
Time Dependent ◽  
Multilayer Thin Films ◽  
Processing Conditions ◽  
Interface Morphology ◽  
Entire Sample ◽  
Crack Growth Velocity

ABSTRACTProgressive (or time dependent) debonding of interfaces poses serious problems in interconnect structures involving multilayer thin films stacks. The existence of such subcriticai debonding associated with environmentally assisted crack-growth processes is examined for a TiN/SiO2 interface commonly encountered in interconnect structures. The rate of debond extension is found to be sensitive to the mechanical driving force as well as the interface morphology, chemistry, and yielding of adjacent ductile layers. In order to investigate the effect of interconnect structure, particularly the effect of an adjacent ductile Al-Cu layer, on subcriticai debonding along the TiN/SiO2 interface, a set of samples was prepared with Al-Cu layer thicknesses varying from 0.2–4.0 μm. All other processing conditions remained the same over the entire sample run. Results showed that for a given crack growth velocity, the debond driving force scaled with Al-Cu layer thickness. Normalizing the data by the critical adhesion energy allowed a universal subcriticai debond rate curve to be derived.

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