scholarly journals High‐Density Force and Temperature Sensing Skin Using Micropillar Array with Image Sensor

2021 ◽  
pp. 2000280
Author(s):  
Xiao-Xiao Shi ◽  
Yan Chen ◽  
Hong-Lan Jiang ◽  
Du-Li Yu ◽  
Xiao-Liang Guo
Keyword(s):  
Image Sensor ◽  
High Density ◽  
Temperature Sensing ◽  
Sensing Skin ◽  
Density Force ◽  
Micropillar Array

Flexible Micropillar Array for Pressure Sensing in High Density Using Image Sensor

2020 ◽  
Vol 7 (12) ◽  
pp. 1902205
Author(s):  
Zimei Cao ◽  
Kaiyang He ◽  
Wei Xiong ◽  
Yan Chen ◽  
Xianbo Qiu ◽  
...  
Keyword(s):  
Image Sensor ◽  
High Density ◽  
Pressure Sensing ◽  
Micropillar Array

Ultra-High-Density Interconnect Enabled by Hybrid Bonding for Heterogeneous Integration: Interfacial Characteristics

2021 ◽  
Author(s):  
Mei-Chien Lu
Keyword(s):  
Performance Metrics ◽  
High Volume ◽  
Image Sensor ◽  
Structure Design ◽  
High Density ◽  
Heterogeneous Integration ◽  
Wafer Level ◽  
Bonding Area ◽  
The Impact ◽  
Interfacial Characteristics

Abstract Hybrid bonding has been explored for more than a decade and implemented recently in high volume production at wafer-to-wafer level for image sensor applications to enable high performance chip-stacking architectures with ultra-high-density chip-to-chip interconnect. The feasibility of sub-micron hybrid bond pitch leading to ultra-high-density chip-to-chip interconnect has been demonstrated due to the elimination of solder bridging issues from microbump method. Hybrid bonding has also been actively considered for logic and memory chip-stacking, chiplets, and heterogeneous integration in general but encountering additional challenges for bonding at die-to-wafer or die-to-die level. Overlay precision, throughput, wafer dicing are among the main causes. Widening the process margin against overlay error by designing innovative hybrid bonding pad structure is highly desirable. This work proposes a method to evaluate these hybrid bonding pad structure designs and to assess the potential performance metrics by analyzing interfacial characteristics at design phase. The bonding areas and ratios of copper-copper, copper-dielectric, and dielectric-dielectric are the proposed key parameters. The correlation between bonding area ratios and overlay errors can provide insights on the sensitivity to process margins. Nonetheless, the impact of copper recess or protrusion associated with bonding area ratios are also highlighted. The proposed method is demonstrated by examining and analyzing the hybrid bonding pad structure design concepts from a few cases reported in literatures as examples. Concerns are identified for elaboration in future designs and optimizations.

Technical Note: High-Density Solid-State Image Sensor

SMPTE Journal ◽  
1987 ◽  
Vol 96 (12) ◽  
pp. 1186-1188
Author(s):  
W. C. Chang ◽  
T. J. Tredwell ◽  
E. G. Stevens ◽  
D. N. Nichols
Keyword(s):  
Solid State ◽  
Image Sensor ◽  
Technical Note ◽  
High Density

A proportional control scheme for high density force myography

2018 ◽  
Vol 15 (4) ◽  
pp. 046029 ◽  
Author(s):  
Alexander T Belyea ◽  
Kevin B Englehart ◽  
Erik J Scheme
Keyword(s):  
High Density ◽  
Proportional Control ◽  
Control Scheme ◽  
Force Myography ◽  
Density Force

High Density Frame Transfer Image Sensor

1983 ◽  
Vol 22 (S1) ◽  
pp. 109 ◽  
Author(s):  
G. A. Beck ◽  
M. G. Collet ◽  
J. A. A. van Gils ◽  
A. J. Klinkhamer ◽  
H. L. Peek ◽  
...  
Keyword(s):  
Image Sensor ◽  
High Density

High density frame transfer image sensor

1982 ◽  
Author(s):  
G. A. Beck ◽  
M. G. Collet ◽  
J. A. A. van Gils ◽  
A. J. Klinkhamer ◽  
P. L. Peek ◽  
...  
Keyword(s):  
Image Sensor ◽  
High Density

Nanometer-Scale Oxide Thin Film Transistor with Potential for High-Density Image Sensor Applications

2010 ◽  
Vol 3 (1) ◽  
pp. 1-6 ◽  
Author(s):  
Sanghun Jeon ◽  
Sungho Park ◽  
Ihun Song ◽  
Ji-Hyun Hur ◽  
Jaechul Park ◽  
...  
Keyword(s):  
Thin Film ◽  
Thin Film Transistor ◽  
Image Sensor ◽  
High Density ◽  
Oxide Thin Film ◽  
Nanometer Scale ◽  
Sensor Applications ◽  
Density Image

High‐density chipless RFID tag for temperature sensing

2016 ◽  
Vol 52 (8) ◽  
pp. 620-622 ◽  
Author(s):  
T. Noor ◽  
A. Habib ◽  
Y. Amin ◽  
J. Loo ◽  
H. Tenhunen
Keyword(s):  
High Density ◽  
Temperature Sensing ◽  
Rfid Tag ◽  
Chipless Rfid
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