Technical Note: High-Density Solid-State Image Sensor

SMPTE Journal ◽  
1987 ◽  
Vol 96 (12) ◽  
pp. 1186-1188
Author(s):  
W. C. Chang ◽  
T. J. Tredwell ◽  
E. G. Stevens ◽  
D. N. Nichols
Keyword(s):  
Solid State ◽  
Image Sensor ◽  
Technical Note ◽  
High Density

Tuning the electrochemical and catalytic ORR performance of C60 by its encapsulation in ZIF-8: a solid-state analogue of dilute fullerene solution

2021 ◽  
Vol 5 (20) ◽  
pp. 7654-7665
Author(s):  
Olivia Basu ◽  
Subhabrata Mukhopadhyay ◽  
Avik De ◽  
Anupam Das ◽  
Samar K. Das
Keyword(s):  
Solid State ◽  
Active Sites ◽  
Metal Organic Frameworks ◽  
Electrochemical Activity ◽  
High Density ◽  
Fullerene Solution ◽  
Metal Organic ◽  
Significant Attention

Hassle-free encapsulation of fullerene C60 in ZIF-8 has been performed to preserve the molecularity and solution-like properties of C60 in solid-state. The resulting composite shows efficient heterogeneous electrocatalytic oxygen reduction reaction.

scholarly journals Flexible solid-state supercapacitors based on shrunk high-density aligned carbon nanotube arrays

2018 ◽  
Vol 67 (2) ◽  
pp. 028201
Author(s):  
Zhu Qi ◽  
Yuan Xie-Tao ◽  
Zhu Yi-Hao ◽  
Zhang Xiao-Hua ◽  
Yang Zhao-Hui
Keyword(s):  
Carbon Nanotube ◽  
Solid State ◽  
High Density ◽  
Nanotube Arrays ◽  
Carbon Nanotube Arrays

Ultra-High-Density Interconnect Enabled by Hybrid Bonding for Heterogeneous Integration: Interfacial Characteristics

2021 ◽  
Author(s):  
Mei-Chien Lu
Keyword(s):  
Performance Metrics ◽  
High Volume ◽  
Image Sensor ◽  
Structure Design ◽  
High Density ◽  
Heterogeneous Integration ◽  
Wafer Level ◽  
Bonding Area ◽  
The Impact ◽  
Interfacial Characteristics

Abstract Hybrid bonding has been explored for more than a decade and implemented recently in high volume production at wafer-to-wafer level for image sensor applications to enable high performance chip-stacking architectures with ultra-high-density chip-to-chip interconnect. The feasibility of sub-micron hybrid bond pitch leading to ultra-high-density chip-to-chip interconnect has been demonstrated due to the elimination of solder bridging issues from microbump method. Hybrid bonding has also been actively considered for logic and memory chip-stacking, chiplets, and heterogeneous integration in general but encountering additional challenges for bonding at die-to-wafer or die-to-die level. Overlay precision, throughput, wafer dicing are among the main causes. Widening the process margin against overlay error by designing innovative hybrid bonding pad structure is highly desirable. This work proposes a method to evaluate these hybrid bonding pad structure designs and to assess the potential performance metrics by analyzing interfacial characteristics at design phase. The bonding areas and ratios of copper-copper, copper-dielectric, and dielectric-dielectric are the proposed key parameters. The correlation between bonding area ratios and overlay errors can provide insights on the sensitivity to process margins. Nonetheless, the impact of copper recess or protrusion associated with bonding area ratios are also highlighted. The proposed method is demonstrated by examining and analyzing the hybrid bonding pad structure design concepts from a few cases reported in literatures as examples. Concerns are identified for elaboration in future designs and optimizations.

Impact Strength of High Density Solid-State Microcellular Polycarbonate Foams

2000 ◽  
Vol 123 (2) ◽  
pp. 229-233 ◽  
Author(s):  
Chris Barlow ◽  
Vipin Kumar ◽  
Brian Flinn ◽  
Rajendra K. Bordia ◽  
John Weller
Keyword(s):  
Solid State ◽  
Impact Strength ◽  
Cell Size ◽  
High Density ◽  
Gas Content ◽  
Impact Behavior ◽  
Strong Function ◽  
Impact Tests ◽  
Izod Impact ◽  
The Impact

The effect of density (relative densities 0.33 to 0.90) on the impact behavior of microcellular polycarbonate (PC) was investigated. Cell size and foaming gas content were also considered. Flexed-beam Izod impact tests were conducted and the impact strength of these foams appears to be a strong function of both density and cell size. The impact strength was observed to improve over the unprocessed polycarbonate’s impact strength for foams with relative densities of 60 percent and above. In terms of cell size, the impact strength increased with increasing cell size at a given density.

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