Self-Aligned Single-Crystalline Hexagonal Boron Nitride Arrays: Toward Higher Integrated Electronic Devices

2015 ◽  
Vol 1 (11) ◽  
pp. 1500223 ◽  
Author(s):  
Lifang Tan ◽  
Jiangli Han ◽  
Rafael G. Mendes ◽  
Mark H. Rümmeli ◽  
Jinxin Liu ◽  
...  
2016 ◽  
Vol 5 (3) ◽  
Author(s):  
Toan Trong Tran ◽  
Cameron Zachreson ◽  
Amanuel Michael Berhane ◽  
Kerem Bray ◽  
Russell Guy Sandstrom ◽  
...  

2020 ◽  
Vol 20 (7) ◽  
pp. 4450-4453 ◽  
Author(s):  
Gun Hee Lee ◽  
Ah Hyun Park ◽  
Jin Hong Lim ◽  
Chil-Hyoung Lee ◽  
Dae-Woo Jeon ◽  
...  

We report on the electrical characteristics of AlGaN/GaN high-electron mobility transistors (HEMTs) with hexagonal boron nitride (h-BN) as a passivation capping layer. The HEMTs with h-BN layers showed an increase in current drainage and 103-times reduction in the gate-leakage current compared with those of conventional unpassivated HEMTs. Moreover, the extrinsic transconductance and the pulse responses were improved due to the reduced charge-trapping effect at the surface of HEMTs. From our observations, the h-BN can be used as a passivation capping layer for high-power electronic devices.


2020 ◽  
Vol 12 (41) ◽  
pp. 46466-46475
Author(s):  
Xu Yang ◽  
Markus Pristovsek ◽  
Shugo Nitta ◽  
Yuhuai Liu ◽  
Yoshio Honda ◽  
...  

Science ◽  
2018 ◽  
Vol 362 (6416) ◽  
pp. 817-821 ◽  
Author(s):  
Joo Song Lee ◽  
Soo Ho Choi ◽  
Seok Joon Yun ◽  
Yong In Kim ◽  
Stephen Boandoh ◽  
...  

Although polycrystalline hexagonal boron nitride (PC-hBN) has been realized, defects and grain boundaries still cause charge scatterings and trap sites, impeding high-performance electronics. Here, we report a method of synthesizing wafer-scale single-crystalline hBN (SC-hBN) monolayer films by chemical vapor deposition. The limited solubility of boron (B) and nitrogen (N) atoms in liquid gold promotes high diffusion of adatoms on the surface of liquid at high temperature to provoke the circular hBN grains. These further evolve into closely packed unimodal grains by means of self-collimation of B and N edges inherited by electrostatic interaction between grains, eventually forming an SC-hBN film on a wafer scale. This SC-hBN film also allows for the synthesis of wafer-scale graphene/hBN heterostructure and single-crystalline tungsten disulfide.


2019 ◽  
Vol 3 (11) ◽  
pp. 2455-2462 ◽  
Author(s):  
Si-Wei Xiong ◽  
Pan Zhang ◽  
Yu Xia ◽  
Pei-Gen Fu ◽  
Jing-Gang Gai

We developed a thermally conductive and antimicrobial QACs@h-BN/LLDPE composites for thermal management of medically electronic devices, it was approximately 100% against both E. coli and S. aureus and its thermal conductivity can reach 1.115 W m−1 K−1.


2017 ◽  
Vol 29 (15) ◽  
pp. 6252-6260 ◽  
Author(s):  
Ren-Jie Chang ◽  
Xiaochen Wang ◽  
Shanshan Wang ◽  
Yuewen Sheng ◽  
Ben Porter ◽  
...  

2015 ◽  
Vol 08 (03) ◽  
pp. 1550038 ◽  
Author(s):  
Mingchao Wang ◽  
Guangping Zhang ◽  
Huisheng Peng ◽  
Cheng Yan

Graphene/hexagonal boron nitride (G/h-BN) heterostructure has attracted tremendous research efforts owing to its great potential for applications in nanoscale electronic devices. In such hybrid materials, tilt grain boundaries (GBs) between graphene and h-BN grains may have unique physical properties, which have not been well understood. Here we have conducted non-equilibrium molecular dynamics simulations to study the energetic and thermal properties of tilt GBs in G/h-BN heterostructures. The effect of misorientation angles of tilt GBs on both GB energy and interfacial thermal conductance are investigated.


2015 ◽  
Vol 6 (1) ◽  
Author(s):  
Shujie Tang ◽  
Haomin Wang ◽  
Hui Shan Wang ◽  
Qiujuan Sun ◽  
Xiuyun Zhang ◽  
...  

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