The Lateral Cross-Linking of Polyurethane Using Grafted Epichlorohydrin and the Impact on the Tensile and Thermal Properties

2016 ◽  
Vol 37 (2) ◽  
pp. 323-331 ◽  
Author(s):  
Yong-Chan Chung ◽  
Byung Hee Lee ◽  
Jae Won Choi ◽  
Byoung Chul Chun
Keyword(s):  
Thermal Properties ◽  
Cross Linking ◽  
The Impact

scholarly journals Investigation of the functional network modifier loading on the stoichiometric ratio of epoxy resins and their dielectric properties

2021 ◽  
Author(s):  
Istebreq A. Saeedi ◽  
Sunny Chaudhary ◽  
Thomas Andritsch ◽  
Alun S. Vaughan
Keyword(s):  
Glass Transition ◽  
Dielectric Properties ◽  
Electrical Properties ◽  
Epoxy Resins ◽  
Functional Network ◽  
Cross Linking ◽  
Network Modifier ◽  
Epoxy Resin System ◽  
The Cross ◽  
The Impact

AbstractReactive molecular additives have often been employed to tailor the mechanical properties of epoxy resins. In addition, several studies have reported improved electrical properties in such systems, where the network architecture and included function groups have been modified through the use of so-called functional network modifier (FNM) molecules. The study reported here set out to investigate the effect of a glycidyl polyhedral oligomeric silsesquioxane (GPOSS) FNM on the cross-linking reactions, glass transition, breakdown strength and dielectric properties of an amine-cured epoxy resin system. Since many previous studies have considered POSS to act as an inorganic filler, a key aim was to consider the impact of GPOSS addition on the stoichiometry of curing. Fourier transform infrared spectroscopy revealed significant changes in the cross-linking reactions that occur if appropriate stoichiometric compensation is not made for the additional epoxide groups present on the GPOSS. These changes, in concert with the direct effect of the GPOSS itself, influence the glass transition temperature, dielectric breakdown behaviour and dielectric response of the system. Specifically, the work shows that the inclusion of GPOSS can result in beneficial changes in electrical properties, but that these gains are easily lost if consequential changes in the matrix polymer are not appropriately counteracted. Nevertheless, if the system is appropriately optimized, materials with pronounced improvements in technologically important characteristics can be designed.

scholarly journals Impact of Immunoglobulin Isotype and Epitope on the Functional Properties of Vibrio cholerae O-Specific Polysaccharide-Specific Monoclonal Antibodies

mBio ◽  
2021 ◽  
Vol 12 (2) ◽  
Author(s):  
Robert C. Kauffman ◽  
Oluwaseyi Adekunle ◽  
Hanyi Yu ◽  
Alice Cho ◽  
Lindsay E. Nyhoff ◽  
...  
Keyword(s):  
Monoclonal Antibodies ◽  
Functional Properties ◽  
Diarrheal Disease ◽  
Cross Linking ◽  
Specific Antibodies ◽  
Immunoglobulin Isotype ◽  
High Affinity ◽  
O Antigen ◽  
The Impact ◽  
Motility Inhibition

ABSTRACT Vibrio cholerae causes the severe diarrheal disease cholera. Clinical disease and current oral cholera vaccines generate antibody responses associated with protection. Immunity is thought to be largely mediated by lipopolysaccharide (LPS)-specific antibodies, primarily targeting the O-antigen. However, the properties and protective mechanism of functionally relevant antibodies have not been well defined. We previously reported on the early B cell response to cholera in a cohort of Bangladeshi patients, from which we characterized a panel of human monoclonal antibodies (MAbs) isolated from acutely induced plasmablasts. All antibodies in that previous study were expressed in an IgG1 backbone irrespective of their original isotype. To clearly determine the impact of affinity, immunoglobulin isotype and subclass on the functional properties of these MAbs, we re-engineered a subset of low- and high-affinity antibodies in different isotype and subclass immunoglobulin backbones and characterized the impact of these changes on binding, vibriocidal, agglutination, and motility inhibition activity. While the high-affinity antibodies bound similarly to O-antigen, irrespective of isotype, the low-affinity antibodies displayed significant avidity differences. Interestingly, despite exhibiting lower binding properties, variants derived from the low-affinity MAbs had comparable agglutination and motility inhibition properties to the potently binding antibodies, suggesting that how the MAb binds to the O-antigen may be critical to function. In addition, not only pentameric IgM and dimeric IgA, but also monomeric IgA, was remarkably more potent than their IgG counterparts at inhibiting motility. Finally, analyzing highly purified F(ab) versions of these antibodies, we show that LPS cross-linking is essential for motility inhibition. IMPORTANCE Immunity to the severe diarrheal disease cholera is largely mediated by lipopolysaccharide (LPS)-specific antibodies. However, the properties and protective mechanisms of functionally relevant antibodies have not been well defined. Here, we have engineered low and high-affinity LPS-specific antibodies in different immunoglobulin backbones in order to assess the impact of affinity, immunoglobulin isotype, and subclass on binding, vibriocidal, agglutination, and motility inhibition functional properties. Importantly, we found that affinity did not directly dictate functional potency since variants derived from the low-affinity MAbs had comparable agglutination and motility inhibition properties to the potently binding antibodies. This suggests that how the antibody binds sterically may be critical to function. In addition, not only pentameric IgM and dimeric IgA, but also monomeric IgA, was remarkably more potent than their IgG counterparts at inhibiting motility. Finally, analyzing highly purified F(ab) versions of these antibodies, we show that LPS cross-linking is essential for motility inhibition.

scholarly journals Influence of partial replacement of sand with copper slag on the thermal properties of hardened concrete

2019 ◽  
Author(s):  
Łukasz Majewski ◽  
Roman Jaskulski ◽  
Wojciech Kubissa
Keyword(s):  
Thermal Properties ◽  
Cement Content ◽  
Copper Slag ◽  
Partial Replacement ◽  
Hardened Concrete ◽  
Different Types ◽  
Compressive Strength Of Concrete ◽  
The Impact ◽  
Fine Copper ◽  
Slag Waste

The article presents the results of testing the effect of partial replacement of sand with fine copper slag waste on the thermal properties of hardened concrete. The impact of the replacement on mechanical properties (ie. compressive and tensile strength of concrete) was also investigated. The thermal properties of the concrete were determined using the non-stationary method with the ISOMET 2114 device. Tests were performed on concrete containing three different types of cement (CEM I, CEM II and CEM III). A total cement content of 360 kg/m3 was assumed in the compositions of all concrete mixes with a water-cement ratio of 0.45. Replacing 66% of the sand volume with copper slag waste caused a decrease in thermal conductivity by about 4–8% in relation to the reference concrete. In addition, the compressive strength of concrete containing copper slag increased by about from 4–21% in relation to the reference concrete.

The impact of Maillard cross-linking on soy proteins and tofu texture

2007 ◽  
Vol 104 (4) ◽  
pp. 1502-1508 ◽  
Author(s):  
S YASIR ◽  
K SUTTON ◽  
M NEWBERRY ◽  
N ANDREWS ◽  
J GERRARD
Keyword(s):  
Soy Proteins ◽  
Cross Linking ◽  
The Impact

Evaluating Thermal Cycling Fatigue Resistance for LED Chip-on-Board Applications

2012 ◽  
Vol 2012 (DPC) ◽  
pp. 000706-000737
Author(s):  
Ravi M. Bhatkal ◽  
Ranjit Pandher ◽  
Anna Lifton ◽  
Paul Koep ◽  
Hafez Raeisi Fard
Keyword(s):  
Mechanical Properties ◽  
Thermal Conductivity ◽  
Thermal Properties ◽  
Thermal Cycle ◽  
Metal Core ◽  
Creep Fatigue ◽  
Cte Mismatch ◽  
Thermal Cycling Fatigue ◽  
Transient Thermal ◽  
The Impact

LED chip-on-board applications typically involve assembling an LED die stack directly on to a high thermal conductivity substrate such as a Metal Core PCB. If solder is used for die-substrate attach for such chip-on-board applications, one needs to consider the CTE mismatch between the die stack and the MCPCB and its impact on thermal cycle-induced creep fatigue of the solder material. This paper presents a methodology to compare relative performance of different solder materials with varying thermo-mechanical properties, and compare the impact of CTE mismatch and temperature swings on transient thermal properties and relative reliability of the solder attach materials. Implications for LED chip-on-board applications are discussed.

scholarly journals Self-Toughening and Self-Enhancement Poly(arylene ether nitrile) with Low Dielectric Constant by Solid Crosslinking Reaction

Polymers ◽  
2019 ◽  
Vol 11 (9) ◽  
pp. 1403 ◽  
Author(s):  
Lifen Tong ◽  
Xiting Lei ◽  
Guangyao Yang ◽  
Xiaobo Liu
Keyword(s):  
Mechanical Properties ◽  
Heat Treatment ◽  
Dielectric Constant ◽  
Thermal Properties ◽  
Heat Treatment Temperature ◽  
Treatment Temperature ◽  
Cross Linking ◽  
Hydroxyl Groups ◽  
Crosslinking Reaction ◽  
Arylene Ether

A novel poly(arylene ether nitrile) terminated with hydroxyl groups (PEN–OH) was synthesized successfully. The effects of heat-treatment temperature on the thermal properties, mechanical properties, and dielectric properties of the PEN–OH films were studied in detail. Due to the cross-linking reaction occurring, at high temperature, among the nitrile groups on the side of the PEN–OH main chain to form a structurally stable triazine ring, the structure of materials changes from a linear structure to a bulk structure. Thus, the thermal properties and mechanical properties were improved. In addition, the occurrence of cross-linking reactions can reduce the polar groups in the material, leading to the decrease of dielectric constant. As the heat-treatment temperature increased, the glass-transition temperature increased from 180.6 °C to 203.6 °C, and the dielectric constant decreased from 3.4 to 2.8 at 1 MHz. Proper temperature heat-treatment could improve the tensile strength, as well as the elongation, at the break of the PEN–OH films. Moreover, because of the excellent adhesive property of PEN–OH to copper foil, a double-layer flexible copper clad laminate (FCCL) without any adhesives based on PEN–OH was prepared by a simple hot-press method, which possessed high peel strength with 1.01 N/mm. Therefore, the PEN–OH has potential applications in the electronic field.

scholarly journals Thermal Behavior of Worsted Fabrics Produced from Different Yarn Spinning Systems

2013 ◽  
Vol 8 (3) ◽  
pp. 155892501300800 ◽  
Author(s):  
Abolfazl Mirdehghan ◽  
Siamak Saharkhiz ◽  
Hooshang Nosraty
Keyword(s):  
Thermal Conductivity ◽  
Thermal Properties ◽  
Thermal Behavior ◽  
Thermal Insulation ◽  
Weft Yarn ◽  
Spun Yarn ◽  
Finishing Process ◽  
Yarn Structure ◽  
Fabric Structures ◽  
The Impact

This paper describes an experimental study of the impact of yarn structure on the thermal properties of worsted fabric. In this study, four different spun yarn structures (Solo, Siro, and single ply and two ply Ring) were woven into four fabric structures (Plain, Twill2/1, Twill2/2 and Basket2/2) and their thermal properties were studied. In addition, the thermal behavior of finished and unfinished samples was also evaluated. Results showed that the finishing process causes an increase in thermal conductivity and warmth to weight factor and a decrease in thermal insulation. Different spinning systems, also affect the thermal properties of the worsted fabrics. Samples with Siro yarns in the weft were found to have the highest thermal conductivity and those made from single ply weft yarn the lowest thermal conductivity. A relation between fabric thermal insulation and air permeability and thickness was also found.

Inverse Vulcanization Polymers with Enhanced Thermal Properties via Divinylbenzene Homopolymerization-Assisted Cross-Linking

2019 ◽  
Vol 8 (12) ◽  
pp. 1670-1675 ◽  
Author(s):  
Sangwoo Park ◽  
Duhwan Lee ◽  
Hongkwan Cho ◽  
Jeewoo Lim ◽  
Kookheon Char
Keyword(s):  
Thermal Properties ◽  
Cross Linking

The impact of cross-linking degree on the thermal and texture behavior of poly(methyl methacrylate)

2016 ◽  
Vol 124 (2) ◽  
pp. 709-717 ◽  
Author(s):  
Mahmoud A. Hussein ◽  
Reda M. El-Shishtawy ◽  
Bahaa M. Abu-Zied ◽  
Abdullah M. Asiri
Keyword(s):  
Methyl Methacrylate ◽  
Cross Linking ◽  
Poly Methyl Methacrylate ◽  
The Impact
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