scholarly journals Direct‐Printing of Functional Nanofibers on 3D Surfaces Using Self‐Aligning Nanojet in Near‐Field Electrospinning

2020 ◽  
Vol 5 (6) ◽  
pp. 2000232 ◽  
Author(s):  
Dongwoon Shin ◽  
Sun Choi ◽  
Jonghyun Kim ◽  
Abiral Regmi ◽  
Jiyoung Chang
Keyword(s):  
Near Field ◽  
Direct Printing ◽  
Functional Nanofibers ◽  
3D Surfaces

scholarly journals Three-dimensional surface printing method for interconnecting electrodes on opposite sides of substrates

2020 ◽  
Vol 10 (1) ◽  
Author(s):  
Md. Khalilur Rahman ◽  
Seong-jun Kim ◽  
Thanh Huy Phung ◽  
Jin-Sol Lee ◽  
Jaeryul Yu ◽  
...  
Keyword(s):  
Near Field ◽  
Three Dimensional ◽  
Electrical Signal ◽  
Jet Stream ◽  
Flat Surfaces ◽  
Direct Printing ◽  
Fine Pattern ◽  
Sharp Edges ◽  
Glass Surfaces ◽  
Printing Method

Abstract As the application of the direct printing method becomes diversified, printing on substrates with non-flat surfaces is increasingly required. However, printing on three-dimensional surfaces suffers from a number of difficulties, which include ink flow due to gravity, and the connection of print lines over sharp edges. This study presents an effective way to print a fine pattern (~ 30 μm) on three different faces with sharp edge boundaries. The method uses a deflectable and stretchable jet stream of conductive ink, which is produced by near-field electrospinning (NFES) technique. Due to added polymer in the ink, the jet stream from the nozzle is less likely to be disconnected, even when it is deposited over sharp edges of objects. As a practical industrial application, we demonstrate that the method can be effectively used for recent display applications, which require the connection of electrical signal and power on both sides of the glass. When the total length of printed lines along the ‘Π’ shaped glass surfaces was 1.2 mm, we could achieve the average resistance of 0.84 Ω.

Near-field scanning optical microscopy

1986 ◽  
Vol 44 ◽  
pp. 642-643
Author(s):  
E. Betzig ◽  
A. Harootunian ◽  
M. Isaacson ◽  
A. Lewis
Keyword(s):  
Near Field ◽  
Optical Microscope ◽  
Visible Radiation ◽  
Field Methods ◽  
Optical Elements ◽  
Optical Region ◽  
Order Of Magnitude ◽  
Nondestructive Imaging ◽  
Scanning Optical Microscopy ◽  
Near Field Scanning

In general, conventional methods of optical imaging are limited in spatial resolution by either the wavelength of the radiation used or by the aberrations of the optical elements. This is true whether one uses a scanning probe or a fixed beam method. The reason for the wavelength limit of resolution is due to the far field methods of producing or detecting the radiation. If one resorts to restricting our probes to the near field optical region, then the possibility exists of obtaining spatial resolutions more than an order of magnitude smaller than the optical wavelength of the radiation used. In this paper, we will describe the principles underlying such "near field" imaging and present some preliminary results from a near field scanning optical microscope (NS0M) that uses visible radiation and is capable of resolutions comparable to an SEM. The advantage of such a technique is the possibility of completely nondestructive imaging in air at spatial resolutions of about 50nm.

Principles of Planar Near-Field Antenna Measurements

2007 ◽  
Author(s):  
Stuart Gregson ◽  
John McCormick ◽  
Clive Parini
Keyword(s):  
Near Field ◽  
Antenna Measurements

Immobilization of Radionuclides on Iron Canister Material at Simulated Near-field Conditions

2008 ◽  
Author(s):  
Daqing Cui ◽  
Ylva Ranebo ◽  
Jeanett Low ◽  
Vincenzo Rondinella ◽  
Jinshan Pan ◽  
...  
Keyword(s):  
Near Field ◽  
Field Conditions

AlCu Pattern Generation on 3D StructuredWafer Using Multi Level Exposure Method on Electrodeposited Polymer Material

2003 ◽  
Vol 766 ◽  
Author(s):  
Vineet Sharma ◽  
Arief B. Suriadi ◽  
Frank Berauer ◽  
Laurie S. Mittelstadt
Keyword(s):  
Line Width ◽  
Metal Film ◽  
Focal Depth ◽  
Cost Effective ◽  
Pattern Generation ◽  
Promising Technique ◽  
Critical Dimensions ◽  
Exposure Method ◽  
Multi Level ◽  
3D Surfaces

AbstractNormal photolithography tools have focal depth limitations and are unable to meet the expectations of high resolution photolithography on highly topographic structures. This paper shows a cost effective and promising technique of combining two different approaches to achieve critical dimensions of traces on slope pattern continuity on highly topographic structures. Electrophoretically deposited photoresist is used on 3-D structured wafers. This photoresist coating technique is fairly known in the MEMS industries to achieve uniform and conformal photoresist films on 3D surfaces. Multi step exposures are used to expose electrophoretically deposited photoresist. AlCu (Cu-0.5%), 0.47-0.53 μm thick metal film is deposited on 3D structured silicon substrate to plate photoresist. By combining these two novel methods, metal (AlCu) traces of 75 μm line width and 150 μm pitch (from top flat to down the slope) have been demonstrated on isotropically etched 350 μm deep trenches with 5-10% line width loss.

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