Laser‐Induced Forward Transfer: A Digital Approach for Printing Devices on Regular Paper

2020 ◽  
Vol 5 (6) ◽  
pp. 2000080 ◽  
Author(s):  
Pol Sopeña ◽  
Javier Sieiro ◽  
Juan M. Fernández‐Pradas ◽  
José M. López‐Villegas ◽  
Pere Serra
Keyword(s):  
Regular Paper ◽  
Forward Transfer

scholarly journals Subthreshold laser jetting via flow-focusing in laser-induced forward transfer

2018 ◽  
Vol 3 (8) ◽  
Author(s):  
Emre Turkoz ◽  
SeungYeon Kang ◽  
Luc Deike ◽  
Craig B. Arnold
Keyword(s):  
Flow Focusing ◽  
Forward Transfer ◽  
Subthreshold Laser

scholarly journals Eco-Friendly Lead-Free Solder Paste Printing via Laser-Induced Forward Transfer for the Assembly of Ultra-Fine Pitch Electronic Components

Materials ◽  
2021 ◽  
Vol 14 (12) ◽  
pp. 3353
Author(s):  
Marina Makrygianni ◽  
Filimon Zacharatos ◽  
Kostas Andritsos ◽  
Ioannis Theodorakos ◽  
Dimitris Reppas ◽  
...  
Keyword(s):  
High Resolution ◽  
Form Factors ◽  
Circuit Board ◽  
Lead Free ◽  
Process Conditions ◽  
Solder Paste ◽  
Electronic Components ◽  
Successful Operation ◽  
Fine Pitch ◽  
Forward Transfer

Current challenges in printed circuit board (PCB) assembly require high-resolution deposition of ultra-fine pitch components (<0.3 mm and <60 μm respectively), high throughput and compatibility with flexible substrates, which are poorly met by the conventional deposition techniques (e.g., stencil printing). Laser-Induced Forward Transfer (LIFT) constitutes an excellent alternative for assembly of electronic components: it is fully compatible with lead-free soldering materials and offers high-resolution printing of solder paste bumps (<60 μm) and throughput (up to 10,000 pads/s). In this work, the laser-process conditions which allow control over the transfer of solder paste bumps and arrays, with form factors in line with the features of fine pitch PCBs, are investigated. The study of solder paste as a function of donor/receiver gap confirmed that controllable printing of bumps containing many microparticles is feasible for a gap < 100 μm from a donor layer thickness set at 100 and 150 μm. The transfer of solder bumps with resolution < 100 μm and solder micropatterns on different substrates, including PCB and silver pads, have been achieved. Finally, the successful operation of a LED interconnected to a pin connector bonded to a laser-printed solder micro-pattern was demonstrated.

Laser induced forward transfer of Ag nanoparticles ink deposition and characterization

2014 ◽  
Vol 297 ◽  
pp. 40-44 ◽  
Author(s):  
M. Makrygianni ◽  
I. Kalpyris ◽  
C. Boutopoulos ◽  
I. Zergioti
Keyword(s):  
Ag Nanoparticles ◽  
Forward Transfer

Microdroplet deposition by laser-induced forward transfer

2005 ◽  
Vol 86 (24) ◽  
pp. 244103 ◽  
Author(s):  
David A. Willis ◽  
Vicentiu Grosu
Keyword(s):  
Forward Transfer

Experimental investigation of laser induced forward transfer process of metal thin films

2002 ◽  
Vol 186 (1-4) ◽  
pp. 221-226 ◽  
Author(s):  
T. Sano ◽  
H. Yamada ◽  
T. Nakayama ◽  
I. Miyamoto
Keyword(s):  
Thin Films ◽  
Experimental Investigation ◽  
Transfer Process ◽  
Metal Thin Films ◽  
Forward Transfer

Laser‐induced forward transfer of high‐TcYBaCuO and BiSrCaCuO superconducting thin films

1989 ◽  
Vol 66 (1) ◽  
pp. 457-459 ◽  
Author(s):  
E. Fogarassy ◽  
C. Fuchs ◽  
F. Kerherve ◽  
G. Hauchecorne ◽  
J. Perriere
Keyword(s):  
Thin Films ◽  
Superconducting Thin Films ◽  
Forward Transfer

Laser induced forward transfer of high viscosity silver paste on double groove structure

2022 ◽  
Vol 148 ◽  
pp. 107795
Author(s):  
Yilin Shan ◽  
Xianmin Zhang ◽  
Gengchao Chen ◽  
Kai Li
Keyword(s):  
High Viscosity ◽  
Silver Paste ◽  
Forward Transfer ◽  
Groove Structure
Sign in / Sign up

Export Citation Format

Share Document