Validation of a Terminally Amino Functionalized Tetra‐Alkyl Sn(IV) Precursor in Metal–Organic Chemical Vapor Deposition of SnO 2 Thin Films: Study of Film Growth Characteristics, Optical, and Electrical Properties

2018 ◽  
Vol 6 (1) ◽  
pp. 1801540 ◽  
Author(s):  
David Zanders ◽  
Engin Ciftyurek ◽  
Christian Hoppe ◽  
Teresa de los Arcos ◽  
Aleksander Kostka ◽  
...  
Keyword(s):  
Thin Films ◽  
Electrical Properties ◽  
Vapor Deposition ◽  
Film Growth ◽  
Chemical Vapor ◽  
Growth Characteristics ◽  
Organic Chemical ◽  
Optical And Electrical Properties ◽  
Metal Organic ◽  
Organic Chemical Vapor Deposition

Thin films for superconducting electronics: Precursor performance issues, deposition mechanisms, and superconducting phase formation-processing strategies in the growth of Tl2Ba2CaCu2O8 films by metal-organic chemical vapor deposition

1997 ◽  
Vol 12 (5) ◽  
pp. 1214-1236 ◽  
Author(s):  
Bruce J. Hinds ◽  
Richard J. McNeely ◽  
Daniel B. Studebaker ◽  
Tobin J. Marks ◽  
Timothy P. Hogan ◽  
...  
Keyword(s):  
Thin Films ◽  
Chemical Vapor Deposition ◽  
Vapor Pressure ◽  
Vapor Deposition ◽  
Film Growth ◽  
Chemical Vapor ◽  
Growth Conditions ◽  
Organic Chemical ◽  
Metal Organic ◽  
Organic Chemical Vapor Deposition

Epitaxial Tl2Ba2CaCu2O8 thin films with excellent electrical transport characteristics are grown in a two-step process involving metal-organic chemical vapor deposition (MOCVD) of a BaCaCuO(F) thin film followed by a postanneal in the presence of Tl2O vapor. Vapor pressure characteristics of the recently developed liquid metal-organic precursors Ba(hfa)2 • mep (hfa = hexafluoroacetylacetonate, mep = methylethylpentaglyme), Ca(hfa)2 • tet (tet = tetraglyme), and the solid precursor Cu(dpm)2 (dpm = dipivaloylmethanate) are characterized by low pressure thermogravimetric analysis. Under typical film growth conditions, transport is shown to be diffusion limited. The transport rate of Ba(hfa)2 • mep is demonstrated to be stable for over 85 h at typical MOCVD temperatures (120 °C). In contrast, the vapor pressure stability of the commonly used Ba precursor, Ba(dpm)2, deteriorates rapidly at typical growth temperatures, and the decrease in vapor pressure is approximately exponential with a half-life of ∼9.4 h. These precursors are employed in a low pressure (5 Torr) horizontal, hot-wall, film growth reactor for growth of BaCaCuO(F) thin films on (110) LaAlO3 substrates. From the dependence of film deposition rate on substrate temperature and precursor partial pressure, the kinetics of deposition are shown to be mass-transport limited over the temperature range 350–650 °C at a 20 nm/min deposition rate. A ligand exchange process which yields volatile Cu(hfa)2 and Cu(hfa) (dpm) is also observed under film growth conditions. The MOCVD-derived BaCaCuO(F) films are postannealed in the presence of bulk Tl2Ba2CaCu2O8 at temperatures of 720–890 °C in flowing atmospheres ranging from 0–100% O2. The resulting Tl2Ba2CaCu2O8 films are shown to be epitaxial by x-ray diffraction and transmission electron microscopic (TEM) analysis with the c-axis normal to the substrate surface, with in-plane alignment, and with abrupt film-substrate interfaces. The best films exhibit a Tc = 105 K, transport-measured Jc= 1.2 × 105 A/cm2 at 77 K, and surface resistances as low as 0.4 mΩ (40 K, 10 GHz).

Preparation of semiconductive SrTiO3 thin films by metal-organic chemical vapor deposition and their electrical properties

1997 ◽  
Vol 12 (6) ◽  
pp. 1655-1660 ◽  
Author(s):  
Daisuk Nagano ◽  
Hiroshi Funakubo ◽  
Osamu Sakurai ◽  
Kazuo Shinozaki ◽  
Nobuyasu Mizutani
Keyword(s):  
Thin Films ◽  
Chemical Vapor Deposition ◽  
Electrical Properties ◽  
Vapor Deposition ◽  
Heating Temperature ◽  
Chemical Vapor ◽  
Organic Chemical ◽  
Treatment Conditions ◽  
Metal Organic ◽  
Organic Chemical Vapor Deposition

Insulating epitaxially grown SrTiO3 thin films were prepared on (100)MgO substrates by metal-organic chemical vapor deposition (MOCVD). Semiconductive SrTiO3 thin films were obtained by the rapid cooling after reheating in reduction atmosphere. The microstructure, crystal structure, and electrical properties of these films were investigated. The electrical properties varied by the composition of films and heat-treatment conditions, i.e., the heating temperature, the oxygen partial pressure, and the cooling rate after the annealing. Change of the resistivity of the film was attributed to that of the carrier concentration. Mobility of films was unchanged, and the value was almost the same order of that of bulks. The lowest resistivity of 0.1 Ω·cm was obtained when a sample of Ti/Sr = 1.0 was heated at 1200 °C under 10−15 Pa of PO2 and then rapidly cooled. This value is similar to that of bulks (100 –10−1 Ω · cm).

Properties of Tin Oxide Films Prepared by MOCVD

2004 ◽  
Vol 449-452 ◽  
pp. 997-1000 ◽  
Author(s):  
Gwang Pyo Choi ◽  
Yong Joo Park ◽  
Whyo Sup Noh ◽  
Jin Seong Park
Keyword(s):  
Thin Films ◽  
Oxygen Content ◽  
Tin Oxide ◽  
Vapor Deposition ◽  
Chemical Vapor ◽  
Organic Chemical ◽  
Metal Organic ◽  
Organic Chemical Vapor Deposition ◽  
Tin Oxide Films ◽  
N2 Annealing

Tin oxide thin films were deposited at 375 °C on α-alumina substrate by metal-organic chemical vapor deposition (MOCVD) process. A number of hillocks on the film were formed after air annealing at 500 °C for 30 min and few things in N2 annealing. The oxygen content and the binding energy after air annealing came to close the stoichiometric SnO2. The cauliflower hillocks of the film seem to be formed by the continuous migration of crystallites from a cauliflower grain on the substrate to release the stress due to the increase of oxygen content and volume.

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